SFSD1024NGBW1MT-T-ME ETC2 | Alldatasheet
Document overview
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Technical content
Swissbit AG Swissbit reserves the right to change products or specifications without notice. Revision: 1.10 Industriestrasse 4 CH-9552 Bronschhofen www.swissbit.com S-300u_data_sheet_SD-NxBW_Rev110 Switzerland industrial@swissbit.com Page 23 of 23 Product Data Sheet Industrial MICRO SD Memory Card S-300u Series SPI, SD and SDHC compliant BU: Flash Products Date: March 29, 2012 Revisio n: 1.00 File: factsheet titel_rz4. docx Prod uct fact shee t
Swissbit AG Swissbit reserves the right to change products or specifications without notice. Revision: 1.10 Industriestrasse 4 CH-9552 Bronschhofen www.swissbit.com S-300u_data_sheet_SD-NxBW_Rev110 Switzerland industrial@swissbit.com Page 23 of 23 S-300u Series MICRO SD Memory Card
1 Feature summary
Highly-integrated memory controller o Fully compliant with SD Memory Card specification SD1.01, SD1.1, SD2.0 and SD3.01 and MICRO SD Memory Card Addendum 4.00 Standard MICRO SD Memory Card form factor o 15.0mm x 11.0mm x 0.7mm Operating voltage 2.7…3.6V Low-power CMOS technology High reliability o MTBF: > 3,000,000 hours o Number of insertions: > 10,000 o Extended Temperature range -25° up to 85°C o Industrial Temperature range -40° up to 85°C Hot swappable High performance o Speed class 2GB Card speed class 6 1,GB, 4GB, 8GB speed class 10 o SD burst up to 25MB/s o SD Low/High speed 0…25/50MHz clock rate o Flash burst up to 40MB/s o Flash Bus interleave Operating bus modes: SD 1 & 4bit and SPI Error Correction up to 24bit/1KB BCH ECC Wear Leveling: equal wear leveling of static and dynamic data The wear leveling assures that dynamic data as well as static data is balanced evenly across the memory. With that the maximum write endurance of the device is guaranteed. Write Endurance: Due to advanced wear leveling an even use of the entire flash is guaranteed, regardless how much “static” (OS) data is stored. Example: If the average file size is 10MByte and the total capacity is 8GByte, 48Mio write cycles can be performed. Available densities o 1, 2, 4, and 8GBytes (SLC NAND Flash) Controlled BOM Life Cycle Management
Swissbit AG Swissbit reserves the right to change products or specifications without notice. Revision: 1.10 Industriestrasse 4 CH-9552 Bronschhofen www.swissbit.com S-300u_data_sheet_SD-NxBW_Rev110 Switzerland industrial@swissbit.com Page 23 of 23
2 Order Information
2.1 Standard product list
Table 1: Standard Product List Density Part Number 1GB SFSD1024NgBW1MT-t-ME-1x1-STD 2GB SFSD2048NgBW1MT-t-ME-1x1-STD 4GB SFSD4096NgBW1MT-t-DF-1x1-STD 8GB SFSD8192NgBW1MT-t-QG-1x1-STD g defines the product generation x defines the FW t defines the temperature range (E=-25°C to +85°C, I=-40°C to +85°C)
2.2 Current product generation
Table 2: Standard Product List Density Part Number Extended Temperature grade 1GB SFSD1024N1BW1MT-E-ME-111-STD 2GB SFSD2048N1BW1MT-E-ME-111-STD 4GB SFSD4096N1BW1MT-E-DF-111-STD 8GB SFSD8192N1BW1MT-E-QG-111-STD Industial Temperature grade 1GB SFSD1024N1BW1MT-I-ME-111-STD 2GB SFSD2048N1BW1MT-I-ME-111-STD 4GB SFSD4096N1BW1MT-I-DF-111-STD 8GB SFSD8192N1BW1MT-I-QG-111-STD
Swissbit AG Swissbit reserves the right to change products or specifications without notice. Revision: 1.10 Industriestrasse 4 CH-9552 Bronschhofen www.swissbit.com S-300u_data_sheet_SD-NxBW_Rev110 Switzerland industrial@swissbit.com Page 23 of 23
3 Contents
Swissbit AG Swissbit reserves the right to change products or specifications without notice. Revision: 1.10 Industriestrasse 4 CH-9552 Bronschhofen www.swissbit.com S-300u_data_sheet_SD-NxBW_Rev110 Switzerland industrial@swissbit.com Page 23 of 23
4 Product Specification
The MICRO SD Memory Card is a small form factor non-volatile memory card which provides high capacity data storage. Its aim is to capture, retain and transport data, audio and images, facilitating the transfer of all types of digital information between a large variety of digital systems. The card operates in two basic modes: SD/SDHC card mode SPI mode The MICRO SD Memory Card also supports SD High Speed mode with up to 50MHz clock frequency. The cards are compliant with SD Memory card Specification Part 1, Physical layer Specification V3.01 SD Memory card Specification Part 2, File System Specification V3.00 SD Memory card Specification Part 3, Security Specification V3.00 MICRO SD Memory Card Addendum V4.00 Simplified specifications are available at https://www.sdcard.org/downloads/pls/simplified_specs/ The Card has an internal intelligent controller which manages interface protocols, data storage and retrieval as well as hardware BCH Error Correction Code (ECC), defect handling, diagnostics and clock control . The advanced wear leveling mechanism assures an equal usage of the Flash memory cells to extend the life time. The hardware BCH-code ECC allows to detect and correct up to 24 defect bits per 1kByte. The card has a power-loss management feature to prevent data corruption after power-down. The power consumption is very low. The cards are RoHS compliant and lead-free.
4.1 System Performance
Table 3: Performance System Performance typ max Unit Burst Data transfer Rate (max SD clock 50MHz) 25 MB/s Sustained Sequential Read Sustained Sequential Write 1. All values refer to Micron Flash 8/16Gb MICRO SD Memory Card in SD mode 50MHz, cycle time 20ns, 2. Sustained Speed measured with USB-SD Memory Card reader. It depends on burst speed, flash number, and file size. 3. Maximum values were measured with Testmetrix tester.
Swissbit AG Swissbit reserves the right to change products or specifications without notice. Revision: 1.10 Industriestrasse 4 CH-9552 Bronschhofen www.swissbit.com S-300u_data_sheet_SD-NxBW_Rev110 Switzerland industrial@swissbit.com Page 23 of 23
4.2 Environmental Specifications
4.2.1 Recommended Operating Conditions
Table 4: MICRO SD Memory Card Recommended Operating Conditions Parameter min typ max unit Extended Operating Temperature -25 25 85 °C Industrial Operating Temperature -40 25 85 °C
4.2.2 Recommended Storage Conditions
Table 5: MICRO SD Memory Card Recommended Storage Conditions Parameter min typ max unit Extended Storage Temperature -25 25 85 °C Industrial Operating Temperature -40 25 100 °C
4.2.3 Humidity & ESD
Table 6: Humidity & ESD Parameter Operating Non Operating Humidity (non-condensing) operation: 95% RH @25°C storage: 93% RH @40°C, 500h EMC / EMI Non Contact Pads area: ±8 kV (air discharge) Human body model according to IEC61000-4-2 Contact Pads: ±4 kV, Human body model according to IEC61000-4-2
4.2.4 Environmental Conditions
Table 7: Environmental Conditions Parameter Operating Non Operating UV light exposure UV: 254nm, 15Ws/cm2 according to ISO7816-1 Durability 10,000 mating cycles Drop test 1.5m free fall Bending / Torque 10N / 0.10Nm ±2.5° max Mechanical Schock 1500G, 0,5ms, half sine wave ±xyz-axis, five pulses each Non operating, JESD22B110 Condition B Vibration 50G, 1.5mm p-p, 20..2000Hz, sweep xyz-axis, five pulses each, Non operating MIL-STD-883 M2007.3 Condition B
4.3 Physical Dimensions
Table 8: Physical Dimensions Outer Physical Dimensions Value Unit Length 15.0±0.1 mm Width 11.0±0.1 Thickness 0.7 (1.0)±0.1 Weight (typ.) 0.4 g
4.4 Reliability
Table 9: Reliability Parameter Value Data Retention @ 25°C 10 years (JEDEC47G)
5 Capacity specification
Table 10: MICRO SD Memory Card capacity specification Capacity Sectors Total addressable capacity (Byte) 1GB 2'001'920 1'024'983'040 2GB 4’016’128 2’056’257’536 4GB 8’042’496 4’117’757’952 8GB 16’136’192 8’261’730’304
Swissbit AG Swissbit reserves the right to change products or specifications without notice. Revision: 1.10 Industriestrasse 4 CH-9552 Bronschhofen www.swissbit.com S-300u_data_sheet_SD-NxBW_Rev110 Switzerland industrial@swissbit.com Page 23 of 23
6 Card physical
6.1 Physical description
The MICRO SD Memory Card contains a single chip controller and Flash memory module(s). The controller interfaces with a host system allowing data to be written to and read from the Flash memory module(s). Figure 1 and Figure 2 show card dimensions. Figure 1: Mechanical Dimensions MICRO SD Memory Card (side and top, simplified) Figure 2: Mechanical Dimensions MICRO SD Memory Card (bottom side with connector) Gold pads thickness: 0.8µm / 30µinch
Swissbit AG Swissbit reserves the right to change products or specifications without notice. Revision: 1.10 Industriestrasse 4 CH-9552 Bronschhofen www.swissbit.com S-300u_data_sheet_SD-NxBW_Rev110 Switzerland industrial@swissbit.com Page 8 of 23
7 Electrical interface
7.1 Electrical description
Figure 3: MICRO SD Memory Card Block Diagram Figure 4: MICRO SD Memory Card Shape and Interface (Bottom View) Table 11: MICRO SD Memory Card Pad Assignment Pin # SD Mode SPI Mode Name Type1 Description Name Type1 Description
1 DAT25 I/O/PP Data Line [Bit 2] RSV
2 CD/DAT32 I/O/PP3 Card Detect/ Data Line [Bit 3] CS I3 Chip Select (negative true)
3 CMD PP Command/Response DI I Data In
4 VDD S Supply voltage VDD S Supply voltage
5 CLK I Clock SCLK I Clock
6 VSS S Supply voltage ground VSS S Supply voltage ground
7 DAT0 I/O/PP Data Line [Bit 0] DO O/PP Data Out
8 DAT14 I/O/PP Data Line [Bit 1] RSV
Notes: 1) S: power supply; I: input; O: output using push-pull drivers; PP: I/O using push-pull drivers; 2) The extended DAT lines (DAT1-DAT3) are input on power up. They start to operate as DAT lines after SET_BUS_WIDTH command. The Host shall keep its own DAT1-DAT3 lines in input mode, as well, while they are not used. 3) At power up this line has a 50kOhm pull up enabled in the card. This resistor serves two functions Card detection and Mode Selection. For Mode Selection, the host can drive the line high or let it be pulled high to select SD mode. If the host wants to select SPI mode it should drive the line low. For Card detection, the host detects that the line is pulled high. This pull-up should be disconnected by the user, during regular data transfer, with SET_CLR_CARD_DETECT (ACMD42) command 4) DAT1 line may be used as Interrupt Output (from the Card) in SDIO mode during all the times that it is not in use for data transfer operations (refer to "SDIO Card Specification" for further details). 5) DAT2 line may be used as Read Wait signal in SDIO mode (refer to "SDIO Card Specification" for fur ther details).
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7.2 DC characteristics
Measurements are at Recommended Operating Conditions unless otherwise specified. Table 12: DC Characteristics Symbol Parameter min typ max unit notes Peak Voltage on all Lines -0.3 VDD+0.3 V VIL Input LOW Voltage -0.3 0.25*VDD V VIH Input HIGH Voltage 0.625*VDD VDD+0.3 V VOL Output LOW Voltage 0.125*VDD V @ 100µA VOH Output HIGH Voltage 0.75*VDD V @ 100µA IDD Operating Current Read 50 60 mA @ 25°C Operating Current Write 60 70 mA @ 25°C Pre-initialization Standby Current 150 200 µA @ 25°C Post-initialization Standby Current 130 150 µA @ 25°C 400 600 µA @ 85°C ILI Input Leakage Current -10 10 µA without pull up R ILO Output Leakage Current -10 10 µA Table 13: MICRO SD Memory Card Recommended Operating Conditions Symbol Parameter min typ max unit VDD Supply Voltage Normal Operating Status 2.7 3.6 V Basic Communication (CMD0, CMD15, CMD55, ACMD41) 2.0 3.3 3.6 V - Power Up Time (from 0V to VDD min) 250 ms
7.3 Signal Loading
The total capacitance CL is the sum of the bus master capacitance CHOST, the bus capacitance CBUS, and the capacitance CCARD of the card connected to the line: CL = CHOST + CBUS + CCARD To allow the sum of the host and bus capacitances to be up to 20pF for the card, the following conditions in the table below are met by the card. Table 14: Signal loading Parameter Symbol Min Max Unit Notes Pull up resistance RCMD 10 100 kOhm To prevent bus floating Pull up resistance RDAT 10 100 kOhm To prevent bus floating Bus signal line capacitance CL 40 pF Single card Signal card capacitance Ccard 10 pF Single card Signal line inductance 16 nH f≤20MHz
Swissbit AG Swissbit reserves the right to change products or specifications without notice. Revision: 1.10 Industriestrasse 4 CH-9552 Bronschhofen www.swissbit.com S-300u_data_sheet_SD-NxBW_Rev110 Switzerland industrial@swissbit.com Page 10 of 23 Figure 5: Signal Loading (MICRO SD Memory Card has no WP slider)
7.4 AC characteristics
Table 15: AC Characteristics Low Speed Mode Parameter Symbol Min Max Unit Notes Clock frequency in data transfer mode fPP 0 25 MHz CL≤100pF Clock frequency in card id mode fOD 0 400 KHz CL≤250pF Clock low time tWL 10/50 ns CL≤100/250pF Clock high time tWH 10/50 ns Clock rise time tTLH 10/50 ns Clock fall time tTHL 10/50 ns CMD, DAT input setup time tISU 5 ns CL≤25pF CMD, DAT input hold time tIH 5 ns CMD, DAT output delay time tODLY 0 14 ns CL≤25pF, data transfer CMD, DAT output delay time tODLY 0 50 ns CL≤25pF, identification Notes 1. Rise and fall times are measured from 10% to 90% of voltage level. 2. CLK referenced to VIH min and VIL max. 3. CMD and DAT inputs and outputs referenced to CLK. 4. 0Hz means to stop the clock. The given minimum frequency range is for cases where a continuous clock is required 5. Specified for one card
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8 Host access Specification
The following chapters summarize how the host accesses the card: Chapter 8.1 summarizes the SD and SPI buses. Chapter 8.2 summarizes the registers.
8.1 SD and SPI Bus Modes
The card supports SD and the SPI Bus modes. Application can chose either one of the modes. Mode selection is transparent to the host. The card automatically detects the mode of the reset command and will expect all further communication to be in the same communication mode. The SD mode uses a 4 -bit high performance data transfer, and the SPI mode provides compatible interface to MMC host systems with little redesign, but with a lower performance.
8.1.1 SD Bus Mode Protocol
The SD Bus mode has a single master (host) and multiple slaves (cards) synchronous topology. Clock, power, and ground signals are common to all cards. After power up, the SD Bus mode uses DAT0 only; after initialization, the host can change the cards’ bus width from 1 bit (DAT0) to 4 bits (DAT0-DAT3). In high speed mode, only one card can be connected to the bus. Communication over the SD bus is based on command and data bit streams which are initiated by a start bit and terminated by a stop bit. Command: a command is a token which starts an operation. A command is sent from the host either to a single card (addressed command) or to all connected cards (broadcast command). A command is transferred serially on the CMD line. Response: a response is a token which is sent from an addressed card, or (synchronously) from all connected cards, to the host as an answer to a previously received command. A response is transferred serially on the CMD line. Data: data can be transferred from the card to the host or vice versa. Data is transferred via the data lines. The SD bus signals are listed in Table 17, and the SD bus topology is illustrated in Figure 8: SD Bus Topology. Table 17: SD Bus Signals Signal Description CLK Host to card clock signal CMD Bidirectional Command/Response signal DAT0-DAT3 4 Bidirectional data signals Vdd, Vss Power and Ground Figure 8: SD Bus Topology
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8.1.2 SPI Bus Mode Protocol
The Serial Parallel Interface (SPI) Bus is a general purpose synchronous serial interface. The SPI mode consists of a secondary communication protocol. The interface is selected during the first reset command after power up (CMD0) and it cannot be changed once the card is powered on. While the SD channel is based on command and data bit streams which are initiated by a start bit and terminated by a stop bit, the SPI channel is byte oriented. Every command or data block is built of 8 -bit bytes and is byte aligned to the CS signal. The card identification and addressing methods are replaced by a hardware Chip Select (CS) signal. There are no broadcast commands. For every command, a card (slave) is selected by asserting (active low) the CS signal. The CS signal must be continuously active for the duration of the SPI transaction (command, response and data). The only exception occurs during card programming, when the host can de-assert the CS signal without affecting the programming process. The bidirectional CMD and DAT lines are replaced by unidirectional dataIn and dataOut signals. The SPI bus signals are listed Table 18 and the SPI bus topology is illustrated in Figure 9. Table 18: SPI Bus Signals Signal Description /CS Host to card chip select CLK Host to card clock signal Data In Host to card data signal Data Out Card to host data signal Vdd, Vss Power and ground Figure 9: SPI bus topology
8.1.3 Mode Selection
The SD Memory Card wakes up in the SD mode. It will enter SPI mode if the CS signal is asserted (negative) during the reception of the reset command (CMD0) and the card is in idle_state. If the card recognizes that the SD mode is required it will not respond to the command and remain in the SD mode. If SPI mode is required the card will switch to SPI and respond with the SPI mode R1 response. The only way to return to the SD mode is by entering the power cycle. In SPI mode the SD Memory Card protocol state machine is not observed. All the SD Memory Card commands supported in SPI mode are always available. During the initialization sequence, if the host gets Illegal Command indication for ACMD41 sent to the card, it may assume that the card is Multimedia Card. In that case it should re-start the card as Multimedia Card using CMD0 and CMD1.
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8.2 Card Registers
The MICRO SD Memory Card has five registers. Refer to Table 19 to Table 24 for detail. Table 19: MICRO SD Memory Card registers Register Name Bit Width Description Function CID 128 Card Identification information This register contains the card identification information used during the Card Identification phase. OCR 32 Operation Conditions Registers This register describes the operating voltage range and contains the status bit in the power supply. CSD 128 Card specific information This register provides information on how to access the card content. Some fields of this register are writeable by PROGRAM_CSD (CMD27). SCR 64 SD Memory Card’s Special features This register provides information on special features. RCA 16 Relative Card Address This register carries the card address is SD Card mode. Table 20: CID register Register Name Bit Width Description typ. value MID 8 Manufacture ID TBD (0x5d) OID 16 OEM/Application ID TBD (0x5342) PNM 40 Product Name TBD (“NgBWc”) g=generation c=number of channels PRV 8 Product Revision 0xgg PSN 32 Product Serial Number xxxxxxxx — 4 Reserved 0x0 MDT 12 Manufacture Date 0xyym CRC 7 Check sum of CID contents chksum — 1 Not used; always=1 1 Table 21: OCR register OCR bit position VDD voltage window typ. value OCR bit position VDD voltage window typ. value 0-3 Reserved 0 15 2.7-2.8 1 4 1.6-1.7 0 16 2.8-2.9 1 5 1.7-1.8 0 17 2.9-3.0 1 6 1.8-1.9 0 18 3.0-3.1 1 7 1.9-2.0 0 19 3.1-3.2 1 8 2.0-2.1 0 20 3.2-3.3 1 9 2.1-2.2 0 21 3.3-3.4 1 10 2.2-2.3 0 22 3.4-3.5 1 11 2.3-2.4 0 23 3.5-3.6 1 12 2.4-2.5 0 24-30 Reserved 13 2.5-2.6 0 30 Card Capacity Status (CCS) *1) 14 2.6-2.7 0 31 0=busy; 1=ready *2) Notes 1. This bit is valid only when the card power up status bit is set. 2. This bit is set to LOW if the card has not finished the power up routine.
Swissbit AG Swissbit reserves the right to change products or specifications without notice. Revision: 1.10 Industriestrasse 4 CH-9552 Bronschhofen www.swissbit.com S-300u_data_sheet_SD-NxBW_Rev110 Switzerland industrial@swissbit.com Page 15 of 23 Table 22: CSD register Register Name Bits Bit Width Description typ. Value 1GB, 2GB typ. Value 4GB, 8GB CSD_STRUCTURE 127:126 2 CSD structure 00 01 — 125:120 6 Reserved 000000 00000 TAAC 119:112 8 Data read access time 1 01011110 00001110 NSAC 111:104 8 Data read access time 2 (CLK cycle) 00000000 00000000 TRAN_SPEED 103:96 8 Data transfer rate 00110010 00110010 CCC 95:84 12 Card command classes 010110110101 010110110101 READ_BL_LEN 83:80 4 Read data block length 1010 1001 READ_BL_PARTIAL 79 1 Partial blocks for read allowed 1 0 WRITE_BLK_MISALIGN 78 1 Write block misalignment 0 0 READ_BLK_MISALIGN 77 1 Read block misalignment 0 0 DSR_IMP 76 1 DSR implemented 0 0 — 75:74 2 Reserved 00 - C_SIZE 73:62 12 Device size xxx*) - VDD_R_CURR_MIN 61:59 3 VDD min read current 101 - VDD_R_CURR_MAX 58:56 3 VDD max read current 101 - VDD_W_CURR_MIN 55:53 3 VDD min write current 101 - VDD_W_CURR_MAX 52:50 3 VDD max write current 101 - C_SIZE_MULT 49:47 3 Device size multiplier 111*) - — 75:70 6 Reserved - 000000 C_SIZE 69:48 22 Device size - xxx*) — 47 1 Reserved - 0 ERASE_BLK_EN 46 1 Erase single block enable 1 1 SECTOR_SIZE 45:39 7 Erase sector size 1111111 1111111 WP_GRP_SIZE 38:32 7 Write protect group size 0111111*) 0000000 WP_GRP_ENABLE 31 1 Write protect group enable 0 0 — 30:29 2 Reserved 00 00 R2W_FACTOR 28:26 3 Write speed factor 101 010 WRITE_BL_LEN 25:22 4 Write data block length 1010*) 1001*) WRITE_BL_PARTIAL 21 1 Partial blocks for write allowed 0 0 — 20:16 5 Reserved 00000 00000 FILE_FORMAT_GRP 15 1 File format group 0 W(1) 0 W(1) COPY 14 1 Copy flag 0 W(1) 0 W(1) PERM_WRITE_PROTECT 13 1 Permanent write protection 0 W(1) 0 W(1) TMP_WRITE_PROTECT 12 1 Temporary write protection 0 W 0 W FILE_FORMAT 11:10 2 File format 00 W(1) 00 W(1) — 9:8 2 Reserved 00 W 00 W CRC 7:1 7 Checksum of CSD contents xxxxxxx W xxxxxxx W — 0 1 Always=1 1 1 *) Drive Size and block sizes vary with card capacity ≤2Gb memory capacity = BLOCKNR * BLOCK_LEN Where BLOCKNR = (C_SIZE+1) * MULT MULT = 2C_SIZE_MULT+2 (C_SIZE_MULT < 8) BLOCK_LEN = 2READ_BL_LEN, (READ_BL_LEN < 12) >2Gb memory capacity = (C_SIZE+1) * 512kByte W value can be changed with CMD27 (PROGRAM_CSD) W(1) value can be changed ONCE with CMD27 (PROGRAM_CSD)
Swissbit AG Swissbit reserves the right to change products or specifications without notice. Revision: 1.10 Industriestrasse 4 CH-9552 Bronschhofen www.swissbit.com S-300u_data_sheet_SD-NxBW_Rev110 Switzerland industrial@swissbit.com Page 16 of 23 Table 23: SCR register Field Bit Width typ Value remark SCR_STRUCTURE 4 0000 SCR 1.01…2.00 SD_SPEC 4 0010 SD 2.0 or 3.0 DATA_STAT_AFTER_ERASE 1 0 0 SD_SECURITY 3 010 or 011 Version 1.01 (SD) or 2.00 (SDHC) SD_BUS_WIDTHS 4 0101 1 or 4 bit Reserved 16 0 0 Reserved 32 0 0 Table 24: RCA register Field Bit Width typ Value RCA 16 0x0000*) *) After Initialization the card can change the RCA register.
Swissbit AG Swissbit reserves the right to change products or specifications without notice. Revision: 1.10 Industriestrasse 4 CH-9552 Bronschhofen www.swissbit.com S-300u_data_sheet_SD-NxBW_Rev110 Switzerland industrial@swissbit.com Page 17 of 23
9 Declaration of Conformity
Manufacturer: Swissbit AG Industriestrasse 4 CH-9552 Bronschhofen Switzerland declare under our sole responsibility that the product Product Type: MICRO SD Memory Card Brand Name: SWISSMEMORY™ MICRO SD Memory Card Product Series: S-300u Part Number: SFSDxxxxNxBWxxx-x-xx-xxx-xxx to which this declaration relates is in conformity with the following directives: EN55022:2006 +A1:r B FCC47 Part 15 Subpart B §15.111 EN 61000-4-2:1995 +A1:1998 + A2:2001 EN 61000-4-3:2006+A1:2008 2012/19/EU Category 3 (WEEE) following the provisions of Directive Electromagnetic compatibility 2004/108/EC Restriction of the use of certain hazardous substances 2011/65/EU Swissbit AG, January 2014 Manuela Kögel Head of Quality Management
Swissbit AG Swissbit reserves the right to change products or specifications without notice. Revision: 1.10 Industriestrasse 4 CH-9552 Bronschhofen www.swissbit.com S-300u_data_sheet_SD-NxBW_Rev110 Switzerland industrial@swissbit.com Page 18 of 23
10 RoHS and WEEE update from Swissbit
Dear Valued Customer, We at Swissbit place great value on the environment and thus pay close attention to the diverse aspects of manufacturing environmentally and health friendly products. The European Parliament and the Council of the European Union have published two Directives defining a European standard for environmental protection. This states that CompactFlash Cards must comply with both Directives in order for them to be sold on the European market: RoHS – Restriction of Hazardous Substances WEEE – Waste Electrical and Electronic Equipment Swissbit would like to take this opportunity to inform our customers about the measures we have implemented to adapt all our products to the European norms. What is the WEEE Directive (2012/19/EC)? The Directive covers the following points: Prevention of WEEE Recovery, recycling and other measures leading to a minimization of wastage of electronic and electrical equipment Improvement in the quality of environmental performance of all operators involved in the EEE life cycle, as well as measures to incorporate those involved at the EEE waste disposal points What are the key elements? The WEEE Directive covers the following responsibilities on the part of producers: Producers must draft a disposal or recovery scheme to dispose of EEE correctly. Producers must be registered as producers in the country in which they distribu te the goods. They must also supply and publish information about the EEE categories. Producers are obliged to finance the collection, treatment and disposal of WEEE. Inclusion of WEEE logos on devices In reference to the Directive, the WEEE logo must be printed directly on all devices that have sufficient space. «In exceptional cases where this is necessary because of the size of the product, the symbol of the WEEE Directive shall be printed on the packaging, on the instructions of use and on the warranty » (WEEE Directive 2012/19/EC) When does the WEEE Directive take effect? The Directive came into effect internationally on July 04, 2012. What is RoHS (2011/65/EU)? The goals of the Directive are to: Place less of a burden on human health and to protect the environment by restricting the use of hazardous substances in new electrical and electronic devices To support the WEEE Directive (see above) RoHS enforces the restriction of the following 6 hazardous substances in electronic and electrical devices: Lead (Pb) – no more than 0.1% by weight in homogeneous materials Mercury (Hg) – no more than 0.1% by weight in homogeneous materials Cadmium (Cd) – no more than 0.01% by weight in homogeneous materials Chromium (Cr6+) – no more than 0.1% by weight in homogeneous materials PBB, PBDE – no more than 0.1% by weight in homogeneous materials
Swissbit AG Swissbit reserves the right to change products or specifications without notice. Revision: 1.10 Industriestrasse 4 CH-9552 Bronschhofen www.swissbit.com S-300u_data_sheet_SD-NxBW_Rev110 Switzerland industrial@swissbit.com Page 19 of 23 Swissbit is obliged to minimize the hazardous substances in the products. According to part of the Directive, manufacturers are obliged to make a self-declaration for all devices with RoHS. Swissbit carried out intensive tests to comply with the self-declaration. We have also already taken steps to have the analyses of the individual components guaranteed by third-party companies. Swissbit carried out the following steps during the year with the goal of offering our customers products that are fully compliant with the RoHS Directive. Preparing all far-reaching directives, logistical enhancements and alternatives regarding the full understanding and introduction of the RoHS Di rective’s standards Checking the components and raw materials: o Replacing non-RoHS-compliant components and raw materials in the supply chain o Cooperating closely with suppliers regarding the certification of all components and raw materials used by Swissbit Modifying the manufacturing processes and procedures o Successfully adapting and optimizing the new management-free integration process in the supply chain o Updating existing production procedures and introducing the new procedures to support the integration process and the sorting of materials Carrying out the quality process o Performing detailed function and safety tests to ensure the continuous high quality of the Swissbit product line When does the RoHS Directive take effect? As of June 08, 2011 only new electrical and electronic devices with approved quantities of RoHS will be put on the market. When will Swissbit be offering RoHS-approved products? Swissbit’s RoHS-approved products are available now. Please contact your Swissbit contact person to find out more about exchanging your existing products for RoHS-compliant devices. For your attention We understand that packaging and accessories are not EEE material and are therefore not subject to the WEEE or RoHS Directives. Contact details: Swissbit AG Industriestrasse 4 CH 9552 Bronschhofen Tel: +41 71 913 03 03 – Fax: +41 71 913 03 15 E-mail: info@swissbit.com – Website: www.swissbit.com
Swissbit AG Swissbit reserves the right to change products or specifications without notice. Revision: 1.10 Industriestrasse 4 CH-9552 Bronschhofen www.swissbit.com S-300u_data_sheet_SD-NxBW_Rev110 Switzerland industrial@swissbit.com Page 20 of 23
11 Part Number Decoder
S F SD 2048 N 1 B W 1 MT - E - M E - 111 - STD 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Manuf. Option Memory Type. Configuration Product Type Manuf. Code: Flash Mode Capacity Manuf. Code: Flash Package Platform Temp. Option Generation Flash vendor Code Memory Organization Number of flash chips/channels Technology
11.1 Manufacturer
11.2 Memory Type
11.3 Product Type
11.4 Capacity
1 GByte 1024
2 GByte 2048
4 GByte 4096
8 GByte 8192
11.5 Platform
11.6 Generation
11.7 Memory Organization
11.8 Technology
SD Memory Card controller S-3x0 series W
11.9 Channels
1 Flash Channel 1
11.10 Flash Code
Swissbit AG Swissbit reserves the right to change products or specifications without notice. Revision: 1.10 Industriestrasse 4 CH-9552 Bronschhofen www.swissbit.com S-300u_data_sheet_SD-NxBW_Rev110 Switzerland industrial@swissbit.com Page 21 of 23 11.11 Temp. Option Extended Temp. Range -25°C to 85°C E Industrial Temp. Range -40°C to 85°C I
11.12 DIE Classification
(single die package) M SLC DDP (dual die package) D SLC QDP (dual die package) Q MLC MONO (single die package) G MLC DDP (dual die package) L
11.13 PIN Mode
Single nCE & R/nB E Dual nCE & Dual R/nB F Quad nCE & Quad R/nB G
11.14 Configuration XYZ
X Configuration Configuration X default 1 Y FW Revision Version 1 1 Z optional Optional Z optional 1
11.15 Option
Swissbit AG Swissbit reserves the right to change products or specifications without notice. Revision: 1.10 Industriestrasse 4 CH-9552 Bronschhofen www.swissbit.com S-300u_data_sheet_SD-NxBW_Rev110 Switzerland industrial@swissbit.com Page 22 of 23
12 Swissbit Label specification
12.1 Front side marking
12.2 Back side marking
Swissbit AG Swissbit reserves the right to change products or specifications without notice. Revision: 1.10 Industriestrasse 4 CH-9552 Bronschhofen www.swissbit.com S-300u_data_sheet_SD-NxBW_Rev110 Switzerland industrial@swissbit.com Page 23 of 23 Table 25: Document Revision History Date Revision Revision Details April 19, 2012 1.00 Initial release February 01, 2013 1.01 Electrical characteristic update, added I-grade material, added CE Declaration and gold pads thickness December 17, 2013 1.10 Changed back side laser marking, 1GB card added, icons added Disclaimer: No part of this document may be copied or reproduced in any form or by any mean s, or transferred to any third party, without the prior written consent of an authorized representative of Swissbit AG (“SWISSBIT”). The information in this document is subject to change without notice. SWISSBIT assumes no responsibility for any errors or omissions that may appear in this document, and disclaims responsibility for any consequences resulting from the use of the information set forth herein. SWISSBIT makes no commitments to update or to keep current information contained in this document. The products listed in this document are not suitable for use in applications such as, but not limited to, aircraft control systems, aerospace equipment, submarine cables, nuclear reactor control systems and life support systems. Moreover, SWISSBIT does not recommend or approve the use of any of its products in life support devices or systems or in any application where failure could result in injury or death. If a customer wishes to use SWISSBIT products in applications not intended by SWISSBIT, said customer must contact an authorized SWISSBIT representative to determine SWISSBIT willingness to support a given application. The information set forth in this document does not convey any license under the copyrights, patent rights, trademarks or other inte llectual property rights claimed and owned by SWISSBIT. The information set forth in this document is considered to be “Proprietary” and “Confidential” property owned by SWISSBIT. ALL PRODUCTS SOLD BY SWISSBIT ARE COVERED BY THE PROVISIONS APPEARING IN SWISSBIT’S TERMS AND CONDITIONS OF SALE ONLY, INCLUDING THE LIMITATIONS OF LIABILITY, WARRANTY AND INFRINGEMENT PROVISIONS. SWISSBIT MAKES NO WARRANTIES OF ANY KIND, EXPRESS, STATUTORY, IMPLIED OR OTHERWISE, REGARDING INFORMATION SET FORTH HEREIN OR REGARDING THE FREEDOM OF THE DESCRIBED PRODUCTS FROM INTELLECTUAL PROPERTY INFRINGEMENT, AND EXPRESSLY DISCLAIMS ANY SUCH WARRANTIES INCLUDING WITHOUT LIMITATION ANY EXPRESS, STATUTORY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. ©2014 SWISSBIT AG All rights reserved.