SFC05-4 PROTEC | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 6
Technical content
05131.R6 4/05 www.protekdevices.com FLIP CHIP ARRAY Only One Name Means ProTek’Tion™
APPLICATIONS
✔ Cellular Phones ✔ Personnal Digital Assistant (PDA) ✔ Ground Positioning System (GPS) ✔ SMART & PCMCIA Cards IEC COMPATIBILITY (EN61000-4) ✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV ✔ 61000-4-5 (Surge): 24A, 8/20µs - Level 2(Line-Gnd) & Level 3(Line-Line)
FEATURES
✔ ESD Protection > 25 kilovolts ✔ 300 Watts Peak Pulse Power per Line (tp = 8/20µs) ✔ Protects up to Four (4) Unidirectional Lines ✔ RoHS Compliant in Lead-Free Versions MECHANICAL CHARACTERISTICS ✔ Weight 0.73 milligrams (Approximate) ✔ Available in Tin-Lead or Lead-Free Plating ✔ Solder Reflow Temperature: Tin-Lead - Sn/Pb, 85/15: 240-245°C Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C ✔ Flammability Rating UL 94V-0 ✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 ✔ Device Marking On Reel ✔ Top Contacts: Solder Bump 0.004” in Height (Nominal) QUAD 05131 PIN CONFIGURATION BOTTOM VIEW
www.protekdevices.com 05131.R6 4/05 SFC05-4 GRAPHS 0 5 10 15 20 VC - Clamping Voltage - Volts FIGURE 5 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR SFC05-4 IPP - Peak Pulse Current - Amps ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape) FIGURE 4 OVERSHOOT & CLAMPING VOLTAGE FOR SFC05-4
5 Volts per Division
TL - Lead Temperature - °C 100 % Of Rated Power Peak Pulse Power 8/20µs Average Power FIGURE 3 POWER DERATING CURVE
www.protekdevices.com 05131.R6 4/05 SFC05-4
APPLICATION INFORMATION
t 25°C to Peak 30-60 seconds Temperature - °C TP 155° 140° 0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) ±50µm ±20µm
60 Seconds
270°C Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183°C) Soldering Maximum Temperature PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-265°C TP for Tin-Lead: 240-245°C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating. RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION Non-Solder Mask Defined Pad 0.275mm DIA. Solder Mask Opening 0.325mm DIA. Solder Stencil Opening 0.330mm DIA.
www.protekdevices.com 05131.R6 4/05 SFC05-4 PACKAGE OUTLINE & DIMENSIONS A B C E F G H I 0.510 0.510 0.99 ± 0.0254
0.15 NOM
1.5 ± 0.0254
0.076 MIN
0.419 NOM
0.020 0.020 0.039 ± 0.001
0.006 NOM
0.059 ± 0.001
0.003 MIN
0.0165 NOM
NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx ± 0.05mm (± 0.002”). 3. “H” Dimensions for the SFC05-4 device are 0.10mm Max and 0.004” Max. PACKAGE OUTLINE MOUNTING PAD LAYOUT - Option 1 A B C D E F G 0.305 0.457 0.203 0.254 0.510 0.990 0.510 NOTE: 1. Preferred: Using 0.1mm (0.004”) stencil. 0.012 0.018 0.008 0.010 0.020 0.039 0.020 PAD DIMENSIONS DIM MILLIMETERS INCHES Outline & Dimensions: Rev 0 - 10/02, 06039 G H E F I SIDE A B C TOP END SOLDER PRINT A F B G SOLDER PADS C E SOLDER MASK DIE SOLDER BUMPS D
www.protekdevices.com 05131.R6 4/05 SFC05-4 PACKAGE OUTLINE & DIMENSIONS COPYRIGHT © ProTek Devices 2005 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility with respect to the selection or specifications of such products. ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com A B C D E 1.499
0.152 NOM
0.510 0.990 0.510 0.059 0.020 0.039 0.020 DIM MILLIMETERS INCHES PACKAGE DIMENSIONS NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx ± 0.05mm (± 0.002”). 3. Preferred: Using 0.1mm (0.004”) stencil. MOUNTING PAD LAYOUT - Option 2 TAPE & REEL ORDERING NOMENCLATURE 1. Surface mount product is taped and reeled in accordance with EIA 481. 2. 8mm Plastic Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-1 (i.e., SFC05-4-T75-1). 3. 8mm Paper Tape: 7 Inch Reels - 5,000 pieces per reel. Ordering Suffix: -T75-2 (i.e., SFC05-4-T75-2). 4. Suffix - LF = Lead-Free, i.e., SFC05-4-LF-T75-2. Outline & Dimensions: Rev 0 - 10/02, 06039 TAPE & REEL ORIENTATION NOTE: 1. Top view of tape. Solder bumps are face down in tape package. SOLDER PRINT 0.014” [0.36] DIA. A D E B C SOLDER MASK DIE SOLDER BUMPS COPPER CONTACTS 0.009” [0.23] DIA.