SFC05-4_07 PROTEC | Alldatasheet
Document overview
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Technical content
105131.R7 3/07 www.protekdevices.com SFC05-4 FLIP CHIP ARRAY 05131
APPLICATIONS
✔ Cellular Phones ✔ Personal Digital Assistant (PDA) ✔ Ground Positioning System (GPS) ✔ SMART & PCMCIA Cards IEC COMPATIBILITY (EN61000-4) ✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV ✔ 61000-4-5 (Surge): 24A, 8/20µs - Level 2(Line-Gnd) & Level 3(Line-Line)
FEATURES
✔ ESD Protection > 25 kilovolts ✔ 300 Watts Peak Pulse Power per Line (tp = 8/20µs) ✔ Protects up to Four (4) Unidirectional Lines ✔ RoHS Compliant MECHANICAL CHARACTERISTICS ✔ Quad Flip Chip Package ✔ Weight 0.73 milligrams (Approximate) ✔ Available in Lead-Free Plating ✔ Solder Reflow Temperature: Lead-Free - Sn/Ag/Cu, 96/3.5/0.5: 260-270°C ✔ Consult Factory for Leaded Device Availability ✔ Flammability Rating UL 94V-0 ✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481 ✔ Top Contacts: Solder Bump 0.004” in Height (Nominal) PIN CONFIGURATION QUAD 6 5 4 1 2 3 BOTTOM VIEW
305131.R7 3/07 www.protekdevices.com SFC05-4 GRAPHS 0 5 10 15 20 VC - Clamping Voltage - Volts FIGURE 5 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT IPP - Peak Pulse Current - Amps ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape) FIGURE 4 OVERSHOOT & CLAMPING VOLTAGE
5 Volts per Division
TA - Ambient Temperature - °C 100 % Of Rated Power Peak Pulse Power 8/20µs Average Power FIGURE 3 POWER DERATING CURVE
405131.R7 3/07 www.protekdevices.com SFC05-4
APPLICATION INFORMATION
t 25°C to Peak 30-60 seconds Temperature - °C TP 155° 140° 0.275mm Round Non-Solder Mask Defined Pads 0.325mm Round 0.150mm 0.330mm Round No Clean OSP(Entek Cu Plus 106A) ±50µm ±20µm
60 Seconds
270°C Pad Size on PCB Pad Shape Pad Definition Solder Mask Opening Solder Stencil Thickness Solder Stencil Aperture Opening (laser cut, 5% tapered walls) Solder Paste Type Pad Protective Finish Tolerance - Edge To Corner Ball Solder Ball Side Coplanarity Maximum Dwell Time Above Liquidous (183°C) Soldering Maximum Temperature PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE REQUIREMENTS Temperature: TP for Lead-Free (SnAgCu): 260-270°C TP for Tin-Lead: 240-245°C Preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating. RECOMMENDED NON-SOLDER MASK DEFINED PAD ILLUSTRATION Non-Solder Mask Defined Pad 0.275mm DIA. Solder Mask Opening 0.325mm DIA. Solder Stencil Opening 0.330mm DIA.
505131.R7 3/07 www.protekdevices.com SFC05-4 QUAD PACKAGE OUTLINE & DIMENSIONS A B C E F G H I 0.510 0.510 0.99 ± 0.0254
0.15 NOM
1.5 ± 0.0254
0.076 MIN
0.419 NOM
0.020 0.020 0.039 ± 0.001
0.066 NOM
0.059 ± 0.001
0.006 NOM
0.003 MIN
0.0165 NOM
NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx ± 0.05mm (± 0.002”). 3. “H” Dimensions for the SFC05-4 device are from 0.10mm Max and 0.004” Max. PACKAGE OUTLINE MOUNTING PAD LAYOUT - Option 1 A B C D E F G 0.305 0.457 0.203 0.254 0.510 0.990 0.510 NOTE: 1. Preferred: Using 0.1mm (0.004”) stencil. 0.012 0.018 0.008 0.010 0.020 0.039 0.020 PAD DIMENSIONS DIM MILLIMETERS INCHES G H E F I SIDE A B C TOP END SOLDER PRINT A F B G SOLDER PADS C E SOLDER MASK DIE SOLDER BUMPS D
605131.R7 3/07 www.protekdevices.com SFC05-4 COPYRIGHT © ProT ek Devices 2007 SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except JEDEC). DESIGN CHANGES: ProTek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer’s and that in furnishing engineering and technical assistance, ProTek assumes no responsibility wit h respect to the selection or specifications of such products. ProTek Devices
2929 South Fair Lane, Tempe, AZ 85282
Tel: 602-431-8101 Fax: 602-431-2288 E-Mail: sales@protekdevices.com Web Site: www.protekdevices.com QUAD PACKAGE OUTLINE & DIMENSIONS A B C D E 1.499
0.152 NOM
0.510 0.990 0.510 0.059 0.020 0.039 0.020 DIM MILLIMETERS INCHES PACKAGE DIMENSIONS NOTES: 1. Controlling dimensions in inches. 2. Decimal tolerances for mounting pad and outline: .xxx ± 0.05mm (± 0.002”). Preferred: Using 0.1mm (0.004”) stencil. MOUNTING PAD LAYOUT - Option 2 TAPE & REEL ORIENTATION NOTE: 1. Top view of tape. Solder bumps are facedown in tape package. SOLDER PRINT 0.014” [0.36] DIA. A D E B C SOLDER MASK DIE SOLDER BUMPS COPPER CONTACTS 0.009” [0.23] DIA. Outline & Dimensions: Rev 1 - 11/01, 06039 TAPE & REEL ORDERING NOMENCLATURE 1. Surface mount product is taped and reeled in accordance with EIA 481. 4. Suffix - LF = Lead-Free, i.e., SFC05-4-LF-T75-2.