SFA0001 SANKEN | Alldatasheet

Document overview

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  • PDF pages: 12

Technical content

Features

Build-in current limit protection, thermal shutdown protection. Built-in error -amp helps el iminate components at sensing stage such as shunt regulator.

3 Absolute maximum ratings

3-1 Absolute maximum ratings(Ta=25℃) (※1)Mounted on glass epoxy board (The dimension of PCB : 42mm×32mm×1mmt) 3-2 Recommended operating conditions Switching frequency FOSC 20~200 kHz Parameter Symbol Ratings Unit Input voltage for control part V CC 6~24 V Symbol PD Tj Tstg VOCP VSS VFB VCC VCOMP VFREQ IDRV(peak) IDRV(DC) Drive terminal peak current -540mA~+270mA mA Drive terminal DC current -180mA~+90mA mA Junction temperature -40~150 ℃ Storage temperature -40~150 ℃ Frequency setting terminal voltage -0.3~+ 6 V Power dissipation 1.2 (※1) W Input voltage for control part 0~ 3 6 V Phase compensation terminal voltage -0.3~+ 6 V SS terminal voltage -0.3~+9 V FB terminal voltage -0.3~+6 V Parameter Ratings Unit OCP terminal voltage -6~+6 V

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4 Electrical characteristic

4-1 Electrical characteristics (VCC=14V , Ta=-40~125℃) (*1) *1 The ratings at Ta=-40℃ to 125℃ shall be treated as a design value. The ratings of devices shall be checked at -30℃,25℃,125℃ at Outgoing Inspection. *2 The rating of devices shall be treated as a design value. 4-2 Typical characteristics(Ta=25℃) MIN TYP MAX Conditions Power supply Start-up Operation Parameter Symbol Ratings Unit 4.9 5.1 5.3 V FB=0V、SS=0V、OCP=0V、FREQ=200pF VCC=0V→14V Operation stop voltage VCC(OFF) 4.4 4.6 4.8 V FB=0V、SS=0V、OCP=0V、FREQ=200pF VCC=14V→0V Operation start voltage VCC(ON) 1.8 2.8 4 mA FB=0V、SS=0V、OCP=0V、FREQ=200pF、 VCC=14V Circuit current in non-operation ICC(OFF) 0.3 0.6 1 mA FB=0V、SS=0V、OCP=0V、FREQ=200pF、 VCC=4.8V Circuit current in operation ICC(ON) Normal Operation SS terminal high threshold voltage VHSS 1.9 2 2.1 V FB=0V、OCP=0V、FREQ=0V、VCC=14V、 SS=0V→2.5V 0.9 1 1.1 V FB=0V、OCP=0V、FREQ=0V、VCC=14V、 SS=2.5V→0V SS terminal voltage hysteresis width Δ VSS 0.9 1 1.1 V VHSS-VLSS SS terminal low threshold voltage VLSS 11 15 19 uA FB=0V、OCP=0V、FREQ=0V、VCC=14V、 SS=0.9V SS terminal inflow current Isnk(SS) 13 17 21 uA FB=0V、OCP=0V、FREQ=0V、VCC=14V、 SS=2.1V SS terminal outflow current Isrc(SS) 85 100 115 kHz FB=0V、SS=0V、OCP=0V、FREQ=200pF、 VCC=14V FREQ terminal outflow current Isrc(FREQ) 27 30 33 uA FB=0V、OCP=0V、SS=0V、VCC=14V、 FREQ=0.9V Switching frequency fosc(200p) 75 86 95 uA FB=0V、OCP=0V、SS=0V、VCC=14V、 FREQ=2.1V Oscillation circuit high threshold voltage VHF 1.9 2 2.1 V FB=0V、OCP=0V、SS=0V、VCC=14V、 FREQ=0V→2.5V FREQ terminal inflow current Isnk(FREQ) 0.9 1 1.1 V FB=0V、OCP=0V、SS=0V、VCC=14V、 FREQ=2.5V→0V Maximum on-duty width Dmax 70 73 78 % FB=0V、SS=0V、OCP=0V、FREQ=200pF、 VCC=14V Oscillation circuit low threshold voltage VLF 2.1 2.5 2.9 mV/% FB=0V、SS=2.5V、COMP=1.3V、 FREQ=470p、VCC=14V、OCP=0V→1V Feedback voltage VFB 2.45 2.5 2.55 V SS=0V、OCP=0V、FREQ=0V、VCC=14V FB=0V→2.5V Slope compensation rate SLP 7.6 8.3 9 V FB=0V、OCP=0V、SS=0V、VCC=14V FREQ=3V・1pluse Minimam drive voltage Vdrive(min) 4 V FB=0V、OCP=0V、SS=0V、VCC≧6V FREQ=3V・1pluse Drive voltage Vdrive (*2) Minimum on-time Ton(min) 400 ns 0.54 V FB=3V、SS=0V、OCP=1V、FREQ=200pF、 VCC=14V Protection Operation Leading edge blanking time Tbw (70) 100 (150) ns OCP threshold voltage VOCP 0.46 0.5 4.5 V FB=0V、SS=0V、VCC=14V FREQ=3V・1pluse、OCP=0V→1V OLP delay time TOLP 32 42 52 ms FB=0V、OCP=0V、SS=10nF、VCC=14V FREQ=3V・1pluse Drive stop threshold voltage VST 3.5 4 FB=0V、OCP=0V、VCC=14V FREQ=3V・1pluse、SS=0V→5V Thermal shutdown operating temperature TjH (TSD) 150 165 ℃ (*2) (*2) Thermal shutdown release temperature TjL (TSD) 150

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fosc[kHz] CFREQ[pF] 100 103 106 109 112 115 -50 0 50 100 150 fosc(200p)[kHz] Tj[℃] 0 5 10 15 20 25 Vdrive[V] VCC[V] 2.45 2.46 2.47 2.48 2.49 2.5 2.51 2.52 2.53 2.54 2.55 -50 0 50 100 150 VFB[V] Tj[℃] 0.5 1.5 2.5 3.5 0 5 10 15 20 25 ICC[mA] VCC[V]

5 Block diagram

8.3V 5.1/4.6V 2.5V 2.5V ErrAmp UVLO Logic SS_OSC LEB FB Drv V reference OCPComparator FBComparator

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6 Standard connection

※Since the switching noise caused by Q1 may affect the operation of an IC ,appropriate design for peripheral circuits is required to prevent the malfunction of an IC by adding snubber circuit and /or filter circuit.

7 Pins function description

Terminal No symbols Descripton

1 VCC Power supply terminal

2 FB Feedback terminal

3 GND Ground terminal

4 SS Soft start terminal

5 FREQ Frequency setting terminal

6 COMP Phase compensation terminal

7 Drive Gate drive terminal

8 OCP Over current protection terminal

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8 Timing diagram

8-1 Timing diagram in standard connection 8-2 Timing diagram in protection VCC FB SS FREQ DRV OCP COMP VCC(ON) VFB VCC(OFF) VHF VLF Dmax VOCP Vdrive VHSS VLSS Δ VSS Start stop Softstart Steady operation Startup transient operation VCC SS FREQ OCP Drv VOCP VCC(ON) VCC(OFF) TOLP VST

8 TOLP×

Released from OLP operation Stop Drv terminal operation by extarnal Input to SS terminal

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9 Package information

9-1Package type, physical dimensions and material 9-2 Appearance The body shall be clean and shall not bear any stain, rust or flaw. 9-3 Marking The type number and lot number shall be legitimately marked in order not to be erased easily . ※1:Part Number ※2:Logo Mark ※3:Lot Number 1st letter:The Last digit of year 2nd letter:Month (1 to 9 Jan. to Sept.,O for Oct. N for Nov. D for Dec.) 3rd & 4th letter:day 01~31 Arabic Numeral ※4:Administer number Dimensions in mm Lead is solder-plated (except cutting surface of lead) SFA0001 SK Terminal No symbols Descripton

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The example of the solder pattern There are reference val ue that are according with the EIAJ standards. (ED-7402-1) e e e b e e e α L β1 β2 L L 記号 寸法(mm) Symbol Dimensions(mm) e1 5.72 e 1.27 α 0.2以上 β1 0.2~0.5 β2 0.2 L 0.6 b 0.42 b2 0.76 I2 L+β1+β2 or more

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SOP8 Taping specifications for packing 1. Outline This specification specifies packaging spec. for Sanken electric co., SFA0001 -VF-RP as well as its related matters. Shipping is only taping as to SOP8. 2. Part name indication This followings specifies part name for taping spec.

2.1 Part name indication method

“Part name” - VF

2.2 IC direction in carrier tape pocket

SFA0001-VF-RP is [VF type] . End of “Part name” is [- VB]: 1 pin of IC is facing to tape roll-in direction. End of “Part name” is [- VF]: 1 pin of IC is facing to tape pull-out direction. 3. Embossed taping specifications

3.1 Taping type and physical dimensions

This carrier tape is treated antistatic treatment. 1Pin Pull-Out direction Material:Emboss

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3.2 Reeling type and physical dimensions

This reel is made of plastic with antistatic treatment. A label shall be put on a side of flange. A label has part number including a direction for unreeling, quantity , and lot number. Label content NAME LOT No. AMOUNT P・C・S SANKEN ELECTRIC CO.,LTD Note Reel Material:Plastic

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3.3 Reeling specifications (Leader/Trail)

Cover tape section MIN 100mm Empty carrier tape MIN 320mm Leader Section MIN 420mm Trail Empty carrier tape MIN 80mm

3.4 Strength of taping seal

Detachment Strength of cover tape 0.1~1.0N Tear away angle: 165~180° Detachment speed: 300±10mm/min

3.5 Missed parts on tape

The number of missed parts can not exceed 0.2% of total parts on the tape. Also, missing of sequential parts must not happen. Trail Leader Cover tape section Empty carrier tape Adhesive tape Leader Cover tape Carrier tape Tape feed direction

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  1. Packaging

4.1 The number of parts per a reel: 3000 parts (MAX)

4.2 Indication of part name and quantity

A label shows part number, quantity , and lot number.

4.3 Outer packaging of reel

Reel is put into moisture barrier bag and seal with desiccant and put into outer box. 5. Packing Dimensions and Appearance (A box is made of card boards. The following dimensions are reference value.) Dimensions of a box: H336mm x V345mm x T 40mm Size of a box contains 5 small boxes: 357mm x 357x 233mm 6. Storage In order to avoid failures during picking and mounting of devices by degradation of taping peel strength and to maintain mounting quality , the box shall be stored under temperature +5~+40 degree C and humidity 40%~60%. Parts shall be used within 3 months from the shipping date with unpacked state. After unpacking the bag, the parts shall be stored under temperature 30℃ and humidity 60% and used within 168hrs. Moisture sensitivity level (MSL): Level 3 336 357 345 233

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 Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the products herein and Sanken can assume no responsibility for any infri ngement of industrial property rights, intellectual property rights or any other rights of Sanken or any third party which may result from its use.  Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failur e and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires o r damages to the society due to device failure or malfunction.  Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommuni cation equipment, measuring equipment, etc.). Please return to us this document with your signature(s) or seal(s) prior to the use of the products herein. When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), please contact your nearest Sanken sales representative to discuss, and then return to us this document with your signature(s) or seal(s) prior to the use of the products herein. The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required (aerospace equipment, nuclear power control system s, life support systems, etc.) is strictly prohibited.  In the case that you use our semiconductor devices or design your products by using our semiconductor devices, the reliability largely depends on the degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. In general, derating factors include electr ic stresses such as electric voltage, electric current, electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor devices. For these stresses, instantaneous values, maximum values and minimum values must be taken into consideration. In addition, it should be noted that since power devices or IC’s including power devices have large self -heating value, the degree of derating of junction temperature (Tj) affects the re liability significantly.  When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically or otherwise processing or treating the products, please duly consider all possible risks that m ay result from all such uses in advance and proceed therewith at your own responsibility.  Anti radioactive ray design is not considered for the products listed herein.  Sanken assumes no responsibility for any troubles, such as dropping products caused du ring transportation out of Sanken’s distribution network.