SF800 LSTD | Alldatasheet
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Technical content
Tflex™ SF800 Series Thermal Gap Filler FEATURES AND BENEFITS
- Silicone-free gap filler
- Thermal Conductivity of 7.8 W/mK
- Exceptionally low thermal resistance
- Available in thicknesses from 0.020-inch (0.50mm) through 0.040-inch (1.00mm) in 0.010-inch increments
- RoHS Compliant HIGHEST THERMAL CONDUCTIVITY SILICONE-FREE GAP FILLER AVAILABLE Tflex™ SF800 is a high-performance, compliant, silicone free thermal interface material. By coupling extremely high thermal conductivity with exceptional wetting characteristics, Tflex™ SF800 provides some of the lowest thermal resistance values in the industry. This makes it well-suited for applications where silicone based pads are traditionally used as well as those applications which are silicone sensitive. Tflex™ SF800 is naturally tacky on both sides requiring no additional adhesive coating, which would inhibit thermal performance. The natural tack allows for the pad to be held in place during assembly.
APPLICATIONS
- Silicone-sensitive applications
- Automotive applications
- Optical components
- Flat panel displays
- Hard disk drives
- Medical devices
- Laser equipment
- Aerospace electronics
- Solar energy Americas: +1.800.843.4556 Europe: +49.8031.24600 Asia: +86.755.2714.116 CLV-customerservice@lairdtech.com
THR-DS-TFLEX-SF800_07_2_14 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or noninfringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2012 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. Document A16822-00 Rev C Tflex™ 800 Series Thermal Gap Filler STANDARD THICKNESSES MATERIAL NAME AND THICKNESS Tflex™ indicates Laird Technologies’ gap filler product line. SF8XXX indicates Tflex™ SF800 product line with thickness in mils (0.001-inches). EXAMPLES: Tflex™ SF840 = standard 0.040-inch thick Tflex™ SF800 material. Data for design engineer guidance only. Observed performance varies in application. Engineers are reminded to test the material in application. * Method detection limit = 40ppm Tflex™ SF800 TEST METHOD Construction Ceramic-filled, silicone-free gap filler N/A Color Grey Visual Thermal Conductivity (W/mK) 7.8 Hot Disk Thermal Resistance at 30 mil bondline (°Cin2/W) 0.19 ASTM D5470 (modified) Thickness Range (inches / mm) 0.020 - 0.160 / 0.051 - 4.064 Thickness Tolerance (%) ± 10 Density (g/cc) 3.21 Helium Pyncometer Hardness (Shore 00) 8 1 ; 3 s e co n d s 75 ; 30 seconds ASTM D2240 Volatile Siloxane (D3-D10) None detected* GC/MS Weight Loss over time Belcore (Telcordia) Silicone Extraction Pass TR-NWT-000930 UL Flammability Rating (UL 94) V0 File E180840 Continuous Use Temperature (°C) -20 to 120 TGA CTE (ppm/°C) 106.1; 25°C to 120°C IPC-TM-650 2.4.24 Heat Capacity at 50°C (J/g-K) 0.8 MDSC Volume Resistivity (ohm-cm) 5 x 1012 ASTM D257 Dielectric Constant @ 1 kHz @ 1 MHz 16.6
15.9 ASTM D150
@ 1 kHz @ 1 MHz 0.09
0.03 ASTM D150
Percent Deflection vs Pressure Percent Deflection (%) Thermal Resistance vs Pressure Pressure (psi) Themal Resistance (°Cin2/W) Pressure (psi)