SF2249E RFM | Alldatasheet
Document overview
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Technical content
www.RFM.com E-mail: info@rfm.com Page 1 of 5 ©2010 by RF Monolithics, Inc. SF2249E - 10/13/10
Electrical Characteristics
Characteristic Sym Not Min Typ Max Units Center Frequency fC 1602 MHz 3 dB Bandwidth BW3 61 Insertion Loss, 1596 to 1607 MHz IL 3.0 4.0 dBAmplitude Ripple, 1596 to 1607 MHz 0.6 2.0 Group Delay Ripple, 1596 to 1607 MHz 61 5 n s Input/Output Return Loss, 1596 to 1607 MHz 8 9 dB Attenuation, 0 dB Reference: 10 to 1500 MHz 45 48 dB 1700 to 2400 MHz 43 50 200 ohm Balanced Source Impedance 200 Ω || 18 nH 200 ohm Balanced Load Impedance 200 Ω || 18 nH Case Style SM3030-8 3.0 x 3.0 mm Nominal Footprint Lid Symbolization, Y=year, WW=week, S=shift, dot=pin 1 indicator 990, YWWS Standard Reel Quantity Reel Size 7 inch 500 Pieces/Reel Reel Size 13 inch 3000 Pieces/Reel SM3030-8
- Low-loss UHF SAW Filter 3.0 x 3.0 Surface-mount Package Complies with Directive 2002/95/EC (RoHS) Maximum Rating Rating Value Units Input Power Level +10 dBm DC Voltage on any Non-ground Terminal 3 V Operating Temperature Range -40 to +85 °C Storage Temperature Range in Tape and Reel -40 to +85 °C Solder Reflow Temperature, 10 seconds/5 cycles maximum 260 °C
1602 MHz
Notes: 1. US and international patents may apply. 2. RFM, stylized RFM logo, and RF Monolithics, Inc. are registered trademarks of RF Monolithics, Inc. 3. Electrostatic Sensitive Device. Observe precautions for handling. Preliminary Electrical Connections Connection Terminals Input 1, 2 Balanced Output 5, 6 Case Ground All others
www.RFM.com E-mail: info@rfm.com Page 2 of 5 ©2010 by RF Monolithics, Inc. SF2249E - 10/13/10 Filter Response Plots
www.RFM.com E-mail: info@rfm.com Page 3 of 5 ©2010 by RF Monolithics, Inc. SF2249E - 10/13/10 Input/Output Return Loss Plots
www.RFM.com E-mail: info@rfm.com Page 4 of 5 ©2010 by RF Monolithics, Inc. SF2249E - 10/13/10 /G49 /G49 /G4A /G4A /G4A /G4B /G4B /G4C /G4D /G4E /G4E /G4F /G4F 8-Terminal Ceramic Surface-Mount Case 3.0 X 3.0 mm Nominal Footprint PCB Footprint Top View Case Materials Materials Solder Pad Plating 0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel Lid Plating 2.0 to 3.0 µm Nickel Body Al2O3 Ceramic Pb Free Dimension mm Inches Min Nom Max Min Nom Max I 3.19 0.126 J 0.81 0.032 K 0.96 0.038 L 0.81 0.032 M 1.39 0.055 N 0.23 0.009 O 0.38 0.015 Case and PCB Footprint Dimensions A B C H E F G D TOP VIEW BOTTOM VIEW
www.RFM.com E-mail: info@rfm.com Page 5 of 5 ©2010 by RF Monolithics, Inc. SF2249E - 10/13/10 Tape and Reel Specifications “B” Nominal Size Quantity Per Reel Inches millimeters 7 178 500 13 330 3000 See Detail "A" 13.0 20.22.0 12.0 100 REF. "B" REF. COMPONENT ORIENTATION and DIMENSIONS Carrier Tape Dimensions Ao 3.35 mm Bo 3.35 mm Ko 1.4 mm Pitch 8.0 mm W 12.0 mm RO.3 (MAX.) Ko SECTION A-A 0.3 ± 0.05 SECTION B-B Bo 2.0 4.0 Ao Pitch BB A R0.5 (MAX.) A 5.5 12.0 1.75 1.5 1.50PIN #1 USER DIRECTION OF FEED