SF2230A RFM | Alldatasheet
Document overview
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- PDF pages: 8
Technical content
www.RFM.com E-mail: info@rfm.com Page 1 of 8 ©2010 by RF Monolithics, Inc. SF2230A - 5/17/10
Electrical Characteristics
Characteristic Sym Notes Min Typ Max Units Center Frequency fC 1 70.0 MHz 1 dB Bandwidth BW1 1 20.8 21.3 25 dB Bandwidth BW25 1 27.7 28.5 40 dB Bandwidth BW40 1 29.7 Insertion Loss IL 1 13.9 15 dB Amplitude Ripple, fC ± 9.75 MHz 1, 2, 3 0.35 0.60 dBP-P Group Delay Ripple, fC ± 9.75 MHz 28 45 nsP-P Sidelobe Attenuation: dB Lower Sidelobe 40 45 Upper Sidelobe 38 42 Operating Temperature Range 1 -45 +85 °C Frequency Temperature Coefficient -86 ppm/°C Impedance Matching to 50 Ω Unbalanced Source/Load External L-C Case Style SM13365-12 13.3 x 6.5 mm Nominal Footprint Lid Symbolization (YY = year, WW = week) RFM SF2230A YYWW
- Precision IF SAW Filter Hermetic 13.3 x 6.5 mm Surface-mount Case Complies with Directive 2002/95/EC (RoHS) Absolute Maximum Ratings Rating Value Units Maximum Incident Power in Passband +20 dBm Maximum DC Voltage on any Non-ground Terminal 10 VDC Storage Temperature Range in Tape and Reel -40 to +85 °C Suitable for Lead-free Soldering - Maximum Soldering Profile 260 °C for 30 s
70 MHz
- Unless noted otherwise, all specifications apply over the operating temperature range with filter soldered to the specified d emonstration board with impedance matching to 50 Ω and measured with 50 Ω network analyzer. 2. Unless noted otherwise, all frequency specifications are referenced to the nominal center frequency, fc. 3. Rejection is measured as attenuation below the minimum IL point in the passband. Rejection in final user application is depen dent on PCB layout and external impedance matching design. See Application Note No. 42 for details. 4. Part to part absolute delay measurement records the absolute delay mean across 1 dB passband. 5. "LRIP" or "L" after the part number indicates "low rate initial production" and "ENG" or "E" indicates "engineering prototype s.” 6. The design, manufacturing process, and specifications of this filter are subject to change. 7. Either Port 1 or Port 2 may be used for either input or output in the design. However, impedances and impedance matching may vary between Port 1 and Port 2, so that the filter must always be installed in one direction per the circuit design. 8. US and international patents may apply. Pb CAUTION: Electrostatic Sensitive Device. Observe precautions for handling. Notes: Preliminary
www.RFM.com E-mail: info@rfm.com Page 2 of 8 ©2010 by RF Monolithics, Inc. SF2230A - 5/17/10 1 dB Filter Bandwidth Detail 3 dB Filter Bandwidth Detail
www.RFM.com E-mail: info@rfm.com Page 3 of 8 ©2010 by RF Monolithics, Inc. SF2230A - 5/17/10 25 dB Filter Bandwidth Detail 40 dB Filter Bandwidth Detail
www.RFM.com E-mail: info@rfm.com Page 4 of 8 ©2010 by RF Monolithics, Inc. SF2230A - 5/17/10 Filter Passband Group Delay Ripple Filter Passband Amplitude Ripple
www.RFM.com E-mail: info@rfm.com Page 5 of 8 ©2010 by RF Monolithics, Inc. SF2230A - 5/17/10 Filter Input and Output Impedance Plots Filter VSWR Plots
www.RFM.com E-mail: info@rfm.com Page 6 of 8 ©2010 by RF Monolithics, Inc. SF2230A - 5/17/10 Tuning Component Values PCB Pad Layout /G53 /G46 /G32 /G32 /G33 /G30 /G41 /G31 /G31 /G31 /G32 /G31 /G33 /G35 /G34 /G32 /G31 /G30 /G31 /G35 /G30 /G20 /G6E /G48 /G35 /G30 /G20 /G6F /G68 /G6D /G73 /G35 /G30 /G20 /G6F /G68 /G6D /G73 /G4D /G61 /G74 /G63 /G68 /G69 /G6E /G67 /G20 /G43 /G69 /G72 /G63 /G75 /G69 /G74 /G36 /G37 /G38 /G39 /G32 /G30 /G20 /G70 /G46 /G31 /G30 /G30 /G20 /G6E /G48 /G32 /G37 /G30 /G20 /G6E /G48
www.RFM.com E-mail: info@rfm.com Page 7 of 8 ©2010 by RF Monolithics, Inc. SF2230A - 5/17/10 /G48 /G43 /G50 /G45 /G44 /G42 /G41 /G31 /G32 /G33 /G34 /G31 /G30 /G39 /G38 /G37 /G31 /G32 /G36 /G35 /G31 /G31 /G54 /G4F /G50 /G20 /G56 /G49 /G45 /G57 /G42 /G4F /G54 /G54 /G4F /G4D /G20 /G56 /G49 /G45 /G57 /G31 /G31 /G31 /G32 /G35 /G36 /G31 /G30 /G39 /G38 /G37 /G31 /G32 /G33 /G34 Case Dimensions Case Material Dimension mm Inches Min Nom Max Min Nom Max C 1.80 0.071 D 1.50 0.059 E 0.80 0.031 H 0.80 0.031 P 2.54 0.100 Materials Solder Pad Plating 0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel Lid Plating 2.0 to 3.0 µm Nickel Body Al2O3 Ceramic Pb Free SM13365-12 Ceramic Surface-mount 12-Terminal Case 13.3 x 6.5 mm Nominal Footprint Electrical Connections Connection Terminals Input 11 Output 5 Case Ground All others Case Outline Drawing
www.RFM.com E-mail: info@rfm.com Page 8 of 8 ©2010 by RF Monolithics, Inc. SF2230A - 5/17/10 Tape and Reel Details