SETP0805-100-CC LITTELFUSE | Alldatasheet

Document overview

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Technical content

Features

T emperature Indication Characteristics

Applications

  • Compact footprint: 0805 mils (2.0 x 1 .2mm)
  • Sensitive and reliable temperature indication
  • SMD compatible with reflow soldering process
  • Zero IR loss contribution
  • Easy part selection
  • USB Power Delivery compliant
  • Protects systems with 100W or higher power
  • Evaluated to UL 1434 and Annex J of IEC 60730-1 Agency Approvals
  • USB Type-C Plugs
  • Chargers with captive Type-C Cables
  • USB-C to USB-C Cable
  • Fast charging standards and protocols compliant with USB-C and USB-PD Agency Agency File Number E74889 J 50313999 Notes: 1. Tind = Typical indicating temperature: Typical temperature when device switches to indicating resistance (Rind) 2. Maximum post reflow resistance measured at 25°C in still air 3. Rind = Indicating resistance when device reaches the indicating temperature (Tind) Part Number Marking Code Indicating T emperature (°C) Resistance (Ω) Min T ypical 1 Max Max at 25°C 2 Rind 3 SETP0805-100-SE T 90 100 110 12 35,000 SETP0805-100-CC V 90 100 110 6 35,000

© 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 06/12/19 Surface Mount > setP™ Series Resistance Vs. T emperature Curve Environmental Specifications Operating T emperature -40°C to +85°C Maximum Device Surface T emperature in T ripped State 110°C Passive Aging +70°C 1000 hours ≤ R1max after test Humidity Aging +60°C, 90% R.H., 1000 hours ≤ R1max after test Thermal Shock MIL–STD–202, Method 215 No change -40°C to +85°C, 10 Cycles Solvent Resistance MIL–STD–202, Method 215 No change Vibration MIL–STD–883, Method 2007, Condition A No change Moisture Sensitivity Level Level 2a, J–STD–020 Physical Specifications T erminal Material Solder-Plated Copper (Solder Material: Matte Tin (Sn)) Lead Solderability Meets EIA Specification RS186-9E, ANSI/J-STD-002, Category 3. 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07 1.E+08 1.E+09 20 40 60 80 100 120 140 Resistance, (/uni03A9) Temperature, ºC SETP0805-100-SE SETP0805-100-CC Soldering Parameters Time Temperature TP TL TS(max) TS(min) tP tL tS time to peak temperature PreheatPreheat Ramp-upRamp-up Ramp-downRamp-do Critical Zone tL to tP Profile Feature Pb-Free Assembly Average Ramp-Up Rate (TS(max) to TP) 3°C/second max Pre Heat: T emperature Min (Ts(min)) 150°C T emperature Max (Ts(max)) 200°C Time (Min to Max) (ts) 60 – 120 secs Time Maintained Above: T emperature (TL) 217°C T emperature (tL) 60 – 150 seconds Peak / Classification T emperature (TP) 260+0/-5 °C Time within 5°C of actual peak T emperature (tp) 30 seconds max Ramp-down Rate 2°C/second max Time 25°C to peak T emperature (TP) 8 minutes Max. -- All temperature refer to topside of the package, measured on the package body surface -- If reflow temperature exceeds the recommended profile, devices may not meet the performance requirements -- Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead -- Recommended maximum paste thickness is 0.25mm (0.010 inch) -- Devices can be cleaned using standard industry methods and solvents -- Devices can be reworked using the standard industry practices Notes: 1. Ihold = Hold current: maximum current device will pass without tripping in 20°C still air 2. Itrip = Trip current: minimum current at which the device will trip in 20°C still air 3. Vmax = Maximum voltage device can withstand without damage at rated current (Imax) 4. Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax) 5. Pd = Power dissipated from device when in the tripped state at 20°C still air 6. Rmin = Minimum resistance of device in initial (un-soldered) state 7. R1max = Maximum resistance of device at 20°C measured one hour after tripping or reflow Soldering of 260°C for 20 seconds (Values specified were determined using PCBs with 0.115in x 1 .0in ounce copper traces) Caution: Operation beyond the specified rating may result in damage and possible arcing and flame

Electrical Characteristics

(A) Itrip (A) Vmax (Vdc) Imax (A) Pd typ. (W) Maximum Time-T o-T rip Resistance Current (A) Time (Sec.) Rmin (Ω) R1max (Ω)

© 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 06/12/19 Surface Mount > setP™ Series Dimensions Part Number Device Dimension Solder Pad A B C D E F G H inch mm inch mm inch mm inch mm inch mm inch mm inch mm inch mmMin Max Min Max Min Max Min Max Min Max Min Max Min Max Min Max Max Max A Marking Code varies by device. See Temperature Indication Characteristics Table. C D B F F G D E H Solder Pad LayoutProduct Dimensions Part Ordering Number System Packaging Part Number Ordering Number Minimum Order Quantity Packaging Option Quantity SETP0805-100-SE RF4795-000 20,000 Tape & Reel 4,000 SETP0805-100-CC RF4819-000 20,000 Tape & Reel 4,000 SETP 0805 -100 -SE Series Size Indicating T emp SE - Single End Cables CC - Cable with T ype-C Plug on each end Installation and Handling Guidelines

  • Operation of these devices beyond the stated maximum ratings could result in damage to the devices and lead to electrical arcing and/or fire.
  • These devices are intended to protect against the effects of temporary over-current or over-temperature conditions and are not intended to perform as protective devices where such conditions are expected to be repetitive or prolonged in duration.
  • Exposure to silicon-based oils, solvents, electrolytes, acids, and similar materials can adversely affect the performance of these PPTC devices.
  • These devices undergo thermal expansion under fault conditions, and thus shall be provided with adequate space and be protected against mechanical stresses.
  • Circuits with inductance may generate a voltage (L di/dt) above the rated voltage of the PPTC device.
  • Hand-soldering of PTC devices on boards is generally not recommended. Users shall define and verify this process if needed.
  • Consult Littelfuse when the device is to be applied with thermal processes other than reflow process on the circuit board, such as molding, encapsulation. User should evaluate molding materials used in the charging cable applications to ensure there are no adverse effect on the PTC devices. A Marking Code varies by device. See Temperature Indication Characteristics Table. C D B F F G D E H

© 2019 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 06/12/19 Surface Mount > setP™ Series T ape and Reel Specifications Standard Pack Quantity: 4,000 pcs Minimum Order Quantity: 20,000 pcs Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics. SETP0805-100-SE W 8.0 ± 0.30 P0 4.0 ± 0.10 P1 4.0 ± 0.10 P2 2.0 ± 0.05 A0 1.70 ± 0.10 B0 2.45 ± 0.10 B1 max. 4.35 D0 1.55 ± 0.05 F 3.50 ± 0.05 E1 1.75 ± 0.10 E2 min. 6.25 T max. 0.3 T1 max. 0.1 K0 0.86 ± 0.10 A max. 179 N min. 53.5 W1 9.5 ± 0.5 W2 max. 15