SET-SPE06R

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Document overview

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Technical content

Features

Does not degrade surge capability after multiple surge events within limit Fails short circuit when surged in excess of ratings Bi-directional protection device RoHS compliance S.E.T/SPE06R Series Applicable Global Standards TIA-968-A TIA-968-B ITU K.20/21 Enhanced Level* GR 1089 Intra-building YD/T 1082 YD/T 993 YD/T 950 ITU K.20/21 Basic Level GR 1089 Inter-building * IEC Compatibility IEC 61000-4-2 (ESD) 5kV (air) kV (contact)±±1, 8 IEC 61000-4-5 (SURGE) 10/700 µs 2KV(SPE06RA,SPE06RAL)± µs 4KV(SPE06RB,SPE06RBL)IEC 6100045S U R G E 1 0 7 0 0/±- - ( ) * A/B-rated parts require series resistance Product Name SPE06RA L Default L: Low capacitance Surge Ratings: A: IEC6100-4-5(SURGE) 10/700us ± 2KV B: IEC6100-4-5(SURGE) 10/700us ± 4KV C: IEC6100-4-5(SURGE) 10/700us ± 6KV Packge type: R:DO-214AC S:DO-214AA T:SOD-123 V RWM Type Designation

Applications

Data lines and security systems Serial ports

/UNI77ac/UNI96f7/UNI7535/UNI5b50 SPSEMI Maximum Ratings (T =25 unless otherwise specified )A ℃ Rating Symbol Value Units Termal Resistance:Junction to Ambient Operating junction Storage Temperature Range RJ BA TJ TS 40 to +150- -65 to +150 ℃/W Dimensions (DO-214AC) Electrical Characteristics (T =25 unless otherwise specified )A ℃ 0.065 1.65() 0.049 1.25() 0.185(4.70) 0.157(3.99) 0.112(2.85) 0.094(2.40) 0.090(2.29) 0.078(1.98) 0.208 5.28() 0.185 4.70() 0.012 0.305() 0.006 0.152() 0.060 1.52() 0.030 0.76() DO-214AC(SMA J-Bend) Dimensions in inches and(millimeters) 0.008(0.203)MAX. S.E.T/SPE06R Series SPE06R Part Number VBR IR @VRWM IHDevice Marking Code SPE06RA SPE06RB SPE06RAL SPE06RBL E06A E06B EBA ECA 6.5 6.5 6.5 6.5 8.0 8.0 8.0 8.0 15.0 15.0 15.0 15.0 Typical Application Circuit Video ChipSET.. 10-20ohm 75ohm 75ohm resistance is the original video matching resistance RS485 /UNI82af/UNI7247SET.. 10-20ohm 10-20ohm BNC/UNI89c6/UNI9891/UNI65b9/UNI6848 RS485/UNI65b9/UNI6848 Capacitance @1MHz,2V biasVRWM V(typ.) VS @100V/ µs V(max.) VT @IT V(max.)

/UNI77ac/UNI96f7/UNI7535/UNI5b50 SPSEMI Typical Characteristics Curves Fig.1 tr td Pulse Wave-form× Half Value Peak Value Waveform=t tr× d tr=rise time to peak value td=decay time to half value 100 150 I -Peak Pulse Current-%IPP PP t-Time(µs) tdtr Fig.2 ESD Discharge IEC61000-4-2 Current Waveform 100% t 90% tp=0.7-1ns IPeak Fig.3 Power Derating Curve Fig.4 Junction Capacitance vs. Reverse Voltage 02 5 5 07 5 100 125 150 175 100 T -Ambient Temperature( )A ℃ % of Rated Power or I PP C (V =0V)/C (V )(pF) J RJ R 0 1 Voltage-V (V)R 120 2 3 4 51 1.1 1.2 1.3 1.4 1.5 1.6 S.E.T/SPE06R Series Fig.5 Normalized vs Change Versus Junction Temperature Percent of V Change-% S -40 0 Junction Temerature(T )-J ℃ 20 40 120 140-8 -20 60 80 100 160 Fig.6 Normalized DC Holding Current 0.4 0.6 1.2 1.4 1.8 1.0 -40 0 Case Temerature(T )-C ℃ 20 40 120 140-20 60 80 100 160 0.8 1.6 Ratio of IH I( T= 2 5 )HC 2.0

/UNI77ac/UNI96f7/UNI7535/UNI5b50 SPSEMI Marking Code E06A ** Marking Code Logo Date Code Recommended Soldering Conditions Recommended Conditions Reflow Soldering ts tP tL Time time to peak temperature (t 25 to peak)℃ Temperature T (min)s T (max)s TL TP Preheat Ramp-down Ramp-up Critical Zone Tt o TLP Re”ow Condition Pb-Free assembly Pre Heat -Temperature Min(T ) s(min) -Temperature Max(T ) s(max) -Time(Min to Max)(t ) s Average ramp up rate (Liquidus Temp(T ) to peak)L T to T -Ramp-up Rates(max) L Re”ow -Temperature(T )(Liquidus)L -Temperature(t )L Peak Temp(T )P Time within 5 of actual Peak Temp(t )℃ P Ramp-down Rate Time 25 to Peak Temp(T )℃ P Do not exceed +150 ℃ +200 ℃ 60-180secs 3 /sec.Max.℃ 3 /sec.Max.℃ +217 ℃ 60-150secs +260(+0/-5) ℃ 30 secs.Max. 6 /sec.Max.℃ 8 min.Max. +260 ℃ S.E.T/SPE06R Series Tape And Reel Specification Symbol Ea Per Reel Reel Dia(mm) Industry Standard SPE06R 5000 330 EIA RS-481 0.157 (4.0) 0.47 (12.0) 0.157 (4.0) 0.47 (12.0) 13.0(330)