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© Semiconductor Components Industries, LLC, 2017 January, 2017 − Rev. 6

1 Publication Order Number:

ESD9L, SESD9L Series Transient Voltage Suppressors ESD Protection Diodes with Ultra−Low Capacitance The ESD9L Series is designed to protect voltage sensitive components that require ultra−low capacitance from ESD and transient voltage events. Excellent clamping capability, low capacitance, low leakage, and fast response time, make these parts ideal for ESD protection on designs where board space is at a premium. Because of its low capacitance, it is suited for use in high frequency designs such as USB 2.0 high speed and antenna line applications. Specification Features:

  • Ultra Low Capacitance 0.5 pF
  • Low Clamping V oltage
  • Small Body Outline Dimensions: 0.039″ x 0.024″ (1.00 mm x 0.60 mm)
  • Low Body Height: 0.016″ (0.4 mm)
  • Stand−off Voltage: 3.3 V , 5 V
  • Low Leakage
  • Response Time is Typically < 1.0 ns
  • IEC61000−4−2 Level 4 ESD Protection
  • S and SZ Prefixes for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable
  • These Devices are Pb−Free and are RoHS Compliant Mechanical Characteristics: CASE: V oid-free, transfer-molded, thermosetting plastic Epoxy Meets UL 94 V−0 LEAD FINISH: 100% Matte Sn (Tin) MOUNTING POSITION: Any QUALIFIED MAX REFLOW TEMPERATURE: 260°C Device Meets MSL 1 Requirements MAXIMUM RATINGS Rating Symbol Value Unit IEC 61000−4−2 (ESD) Contact Air ±10 ±15 kV Total Power Dissipation on FR−5 Board (Note 1) @ TA = 25°C °PD° 150 mW Storage Temperature Range Tstg −55 to +150 °C Junction Temperature Range TJ −55 to +150 °C Lead Solder Temperature − Maximum (10 Second Duration) TL 260 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. See Application Note AND8308/D for further description of survivability specs. Device Package Shipping †

ORDERING INFORMATION

SOD−923 CASE 514AB ESD9LxxxST5G SOD−923 (Pb−Free) 8000/Tape & Reel MARKING DIAGRAM See specific marking information in the device marking column of the Electrical Characteristics tables starting on page 2 of this data sheet. DEVICE MARKING INFORMATION †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification s Brochure, BRD8011/D. X = Specific Device Code M = Date Code www.onsemi.com X M *Date Code orientation and/or position may vary depending upon manufacturing location. PIN 1. CATHODE 2. ANODE SESD9LxxxST5G SOD−923 (Pb−Free) 8000/Tape & Reel SZESD9LxxxST5G SOD−923 (Pb−Free) 8000/Tape & Reel

ESD9L, SESD9L Series www.onsemi.com PACKAGE DIMENSIONS SOD−923 CASE 514AB ISSUE C NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. DIM MIN NOM MAX MILLIMETERS A 0.34 0.37 0.40 b 0.15 0.20 0.25 c 0.07 0.12 0.17 D 0.75 0.80 0.85 E 0.55 0.60 0.65 0.95 1.00 1.05 L 0.19 REF HE 0.013 0.015 0.016 0.006 0.008 0.010 0.003 0.005 0.007 0.030 0.031 0.033 0.022 0.024 0.026 0.037 0.039 0.041

0.007 REF

D E c A −Y− −X− DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* See Application Note AND8455/D for more mounting details 1.20 0.25 0.36 PACKAGE OUTLINE b2X

0.08 XY TOP VIEW

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