CHIPSESD LITTELFUSE | Alldatasheet

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Technical content

Littelfuse’s ChipSESD family of Silicon ESD devices, available in EIA-0201 and EIA-0402 sized rectangular SMT passive component packages, can help protect electronic circuits against damage from electrostatic discharge (ESD) events. The SESD0201P1BN-0400-090, 0201-sized ChipSESD device’s miniature footprint (0.6mm x 0.3mm x 0.3mm) is approximately 70% smaller than prior-generation devices. This offers designers flexibility in space constrained applications. The ChipSESD devices are high-capacitance, bi- directional devices that can be used for low-speed generic interfaces such as keypads, power buttons, speakers and microphone ports in a portable electronics. The bi- directional operation eliminates orientation constraints and the need for polarity inspections. The surface mount technology (SMT) passive component package allows the devices to be easily installed onto the printed circuit board using the standard PCB assembly process. Once soldered onto the boards, the ChipSESD’s solder fillets at the end terminals can easily be visually inspected. The ChipSESD devices offer 10kV contact and 16kV air discharge protection per the IEC61000-4-2, level 4 standard with a surge rating of 2A under 8x20μs pulse. BENEFITS

  • Silicon ESD devices in an EIA-0201 and EIA-0402 sized rectangular SMT passive component package
  • Bi-directional operation eliminates orientation constraints
  • Standard PCB assembly and rework process
  • ESD protection in space-constrained portable electronics and mobile handsets
  • Helps protect electronic circuits against damage from ESD
  • Assists equipment to pass IEC61000-4-2, level 4 testing

FEATURES

  • Input capacitance -4.0pF (typ) & 4.5pF (typ)
  • Low leakage current – 1.0μA (max)
  • Low working reverse voltage - 6.0V (max)
  • Capable of withstanding numerous ESD strikes
  • RoHS compliant
  • Halogen free (refers to: Br≥900ppm, Cl≥900ppm, Br+Cl≥1500ppm)

APPLICATIONS

  • Mobile phones and portable electronics
  • Digital cameras and camcorders
  • Notebooks, set top boxes, motherboards
  • USB 2.0 and computer I/O ports
  • Applications requiring high ESD performance in a small package RoHS Compliant, ELV Compliant HF Halogen Free Specifications subject to change without notice. ©2016 Littelfuse, Inc.

Replace of Figure SE1 & SE2 - Capacitance vs. Frequency for SESD Devices. Figure XX ESD Clamping Voltage - 8kV Contact for ChipSESD Devices 100 0 10 20 30 40 50 60 70 80 90 100 Voltage (V) Time (ns) ChipSESD ESD 8kV Contact per IEC6100-4-2 Level 4 ChipSESD T ypical Clamping Performance 8x20µs - 2A Surge Voltage (V) Time (s) Table CE2 — Electrical Characteristics @T=25°C Input Capacitance* Clamping Voltage (typ) VCL @ lpp=2A, Ty p Max Leakage Current (max) Breakdown Voltage (min) Working Reverse Voltage Part Number (pF) (pF) IL @ VRWM = 6.0V (µA) Vbr @ IT† = 1mA (V) VRWM @ peak (V) tp=(8/20µs) (V)* * @ Vr=0V , f=1MHz † Vbr is measured at test current IT Figure CE1 — ESD Clamping Voltage - 8kV Contact Figure CE2 — ESD Clamping Voltage - 8x20μs, 2A Surge Table CE1 — Maximum Ratings IEC61000-4-2, level 4 (ESD Withstand) T emperature Contact Air Operating Storage Part Number (kV) (kV) (°C) (°C) SESD0201P1BN-0400-090 ±10* ±16 -40 to +125 -40 to +125 SESD0402P1BN-0450-090 ±10* ±16 -40 to +125 -40 to +125 RoHS Compliant, ELV CompliantHF Halogen Free Specifications subject to change without notice. ©2016 Littelfuse, Inc. ChipSESD Devices

Table CE3 - Dimensions in Millimeters and (Mils)* Part Number A B C D Figure * Round off approximation A A A D D E D B C C B B 12D F C E G Bottom View Bottom View Top View SOD-923 Side View Side View A F GPad 1P ad 2 Pad 1P ad 2 D Figure CE3 Table CE4 - PCB Pad Layout in Millimeters and (Mils)* Part Number L S W Figure * Round off approximation Pad 1 PC Board Pin 1 Pin 1 cathode anode Pin 2 Typical SESD Protected Signal Recommended Landing Pattern ChipSESD Devices Can be Oriented Either Direction SESD0402S-005-054 Uni-directional Board Placement Orient Pin 1 to Pad 1 W LS L Pad 2 Figure CE4 RoHS Compliant, ELV Compliant HF Halogen Free Specifications subject to change without notice. ©2016 Littelfuse, Inc. ChipSESD Devices

(ø40mm min.) If present, tape slot in core for tape start: 4.5 ± 0.05 width x 10.0mm (min) depth W2 (Measured at hub) W3 (Includes flange distortion at outer edge) B W1 (Measured at hub) D (Hub diameter, maximum weight of reel and contents = 13.6kg) (Arbor hole diameter) B D Label AEC F G Table CE6 — Reel Specifications P0 P2 F B F W W øD1 øD0 Embossment User Direction of Unreeling [10 pitches cumulative tolerance on tape ±0.2mm] B1 is for tape feeder reference only, including draft concentric about B0 Center Lines of CavityCover Tape B0B1 T T A D E Table CE5 — Tape Specifications T ape Dimension EIA Mark SESD0201P1BN-0400-090 SESD0402P1BN-0450-090 Dimension (mm) Dimension (mm) A 0.35 ± 0.02 0.58 ± 0.03 B 0.67 ± 0.02 1 .20 ± 0.03 D 1 .55 ± 0.05 1 .55 ± 0.05 E 1 .75 ± 0.05 1 .75 ± 0.05 F 3.50 ± 0.05 3.50 ± 0.05 W 8.00 ± 0.10 8.00 ± 0.10 P0 4.00 ± 0.10 4.00 ± 0.10 P1 2.00 ± 0.05 2.00 ± 0.05 P2 2.00 ± 0.05 2.00 ± 0.05 T 0.42 ± 0.03 0.60 ± 0.03 Figure CE5 Reel Dimension EIA Mark Dimension (mm) A 178.0 ± 2.0 B 2.0 ± 0.5 C 13.0 ± 0.5 D 21 .0 ± 0.8 E 62.0 ± 1 .5 F 9.0 ± 0.5 G 13.0 ± 1 .0 Figure CE6 RoHS Compliant, ELV CompliantHF Halogen Free Specifications subject to change without notice. ©2016 Littelfuse, Inc. ChipSESD Devices

SESD 0201 P1BN - 0400 - 090 Breakdown Voltage (min) 090 = 9.0V Input Capacitance (typ) 0400 = 4.0pF 0450 = 4.5pF N - No Common Pin B - Bi-directional 1 - One Channel Package P - Packaged SMD EIA Size 0201 0402 Series Silicon ESD Part Numbering System Notice: Littelfuse products are not designed for, and shall not be used for, any purpose (including, without limitation, automotive, military, aerospace, medical, life-saving, life-sustaining or nuclear facility applications, devices intended for surgical implant into the body, or any other application in which the failure or lack of desired operation of the product may result in personal injury, death, or property damage) other than those expressly set forth in applicable Littelfuse product documentation. Warranties granted by Littelfuse shall be deemed void for products used for any purpose not expressly set forth in applicable Littelfuse documentation. Littelfuse shall not be liable for any claims or damages arising out of products used in applications not expressly intended by Littelfuse as set forth in applicable Littelfuse documentation. The sale and use of Littelfuse products is subject to Littelfuse Terms and Conditions of Sale, unless otherwise agreed by Littelfuse. Definition of Terms IL Reverse Leakage Current @ VRWM VRWM Working Peak Reverse Voltage Vbr Breakdown Voltage @ IT IT Test Current VCL Clamping Voltage RoHS Compliant, ELV Compliant HF Halogen Free Specifications subject to change without notice. ©2016 Littelfuse, Inc. ChipSESD Devices

RoHS Compliant, ELV CompliantHF Halogen Free Specifications subject to change without notice. ©2016 Littelfuse, Inc. ChipSESD Devices