SES5VT563-6 SURGE | Alldatasheet

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Surge Components, Inc.

95 East Jefryn Blvd

Deer Park, NY 11729 (631)595M1818 1.FEATURE /circle6 100 Watts Peak Power per Line(tp=8/20us) /circle6 SOTM563 package /circle6 Protects four bidirectional lines and five Unidire ctional lines /circle6 Monolithic structure /circle6 Working woltage: 5V /circle6 Low clamping voltage /circle6 ESD protection > 40KV /circle6 Low leakage current /circle6 RoHS compliant /circle6 Transient protection for data lines to IEC 61000M4 M2(ESD) ± 15KV (air), ± 8KV (contact); IEC 61000M4M4 (EFT) 40A (5/50ns) 2. APPLICATION /circle6 Communication system & Cellular phones /circle6 Printers /circle6 Notebooks and hand hold computers /circle6 PDAs /circle6 Video Equipment 3. ELECTRICAL CHARACTERISTICS PER LINE@25 ℃℃ ℃℃(UNLESS OTHERWISE SPECIFIED) NOTE 1 Parameter Symbol Conditions Min. Typ. Max. Units Reverse standMoff voltage V RWM 5 V Reverse Breakdown voltage V BR I t=1mA 6 V Reverse Leakage Current I R V RWM =5V T =25℃ 5 uA Clamping Voltage V C I PP =1A T P=8/20uS 8.8 V Clamping voltage V C I PP =10A T P=8/20uS 12.0 V Junction Capacitance C J V R=0V f=1MHz 40 pF /circle6 Note 1: Pin 1,3,4,5 or 6 to Pin 2

Surge Components, Inc. Deer Park, NY 11729 (631)595M1818 4. ABSOLUTE MAXIMUM RATING @25 ℃℃ ℃℃ NOTE 1 Rating Symbol Value Units Peak Pulse Power(t p=8/20µs) P PP 100 W Forward voltage@10mA V F 1.5 V Operating Temperature T j M55 to +150 ℃ Storage Temperature T STG M55 to +150 ℃ /circle6 Note 1: Pin 1,3,4,5 or 6 to Pin 2 5.TYPICAL CHARACTERISTICS

Surge Components, Inc. Deer Park, NY 11729 (631)595M1818 6. PRODUCT DIMENSION AND PAD SIZE. PACKAGE DIMENSION DIM MILIMETER INCHES MIN MA X MIN MAX A 1.50 1.70 0.059 0.067 B 1.1 1.3 0.043 0.051 C 0.50 0.60 0.020 0.024 D 0.17 0.27 0.007 0.011 G 0.50 BSC M 0.020 BSC M J 0.06 0.16 0.003 0.006 K 0.10 0.30 0.004 0.012 S 1.50 1.70 0.059 0.067 Mounting Pad TYPICAL DIM MILIMETER INCHES 1 0.30 0.012 2 1.02 0.040 3 0.51 0.020 4 1.40 0.055 5 0.51 0.020 NOTES: 1. Controlling Dimension Inches 2. Pin 3 is the cathode (Unidirectional only). 3. Dimensions are exclusive of mold lash and metal burrs

Surge Components, Inc. Deer Park, NY 11729 (631)595M1818 7. PACKING INFORMATION 8. APPLICATION NOTE The SES5VT563M5 is TVS arrays designed to protect I/O or data lines from the damaging effects of ESD or EFT. This product provides both unidirectional and bidir ectional protection, with a surage capability of 10 0 watts Ppp line for an 8/20µs wave shape and ESD protection > 25kv. CommonMmode unidirectional configuration(Figure 1) The SES5VT563M5 provides up to 4 lines of protection in a commonMmode unidirectional configuration as depicted in Figure 1. Circuit connectivity is as follows: ■ Line 1 is connected to Pin1. ■ Line 2 is connected to Pin3. ■ Line 3 is connected to Pin4. ■ Line 4 is connected to Pin5. ■ Pin2 is connected to ground. CommonMmode unidirectional configuration(Figure 2) The SES5VT563M5 provides up to 3 lines of protection in a commonMmode bidirectional configuration as depicted in Figure 2. Reel Dia Tape Width AO BO KO D E F W PO P2 P Imax

Surge Components, Inc. Deer Park, NY 11729 (631)595M1818 Circuit connectivity is as follows: ■ Line 1 is connected to Pin1. ■ Line 2 is connected to Pin3. ■ Line 3 is connected to Pin4. ■ Pin5 is connected to ground. ■ Pin2 is not connected. DifferentialMmode bidirectional configuration (Figure 3) The SES5VT553M5 provides up to 5 lines of protection in a DifferentialMmode bidirectional configuration as depicted in Figure 3. Circuit connectivity is as follows: ■ Line 1 is connected to Pin1. ■ Line 2 is connected to Pin3. ■ Line 3 is connected to Pin4. ■ Line 4 is connected to Pin6. ■ Line 5 is connected to Pin5. ■ Pin2 is not connected. Circuit board layout and protection device placement: Circuit board layout is critical for suppression of ESD transients. The following guidelines are recommended: 1. Place the protection devices as close to the inp ut terminal or connector as possible. 2. The path length between the protection device an d protected line should be minimized. 3. Keep parallel signal pats to a minimum. 4. Avoid running protection conductors in parallel with unprotected conductor. 5. Minimize all printedMcircuit board conductive loops including power and ground loops. 6. minimize the length of the transient return path to ground. 7. Avoid using shared transient return paths to com mon ground point. 8. Ground planes should be used whenever possible. For multilayer printedMcircuit boards, use ground vias.