SES5VSC70-5 SURGE | Alldatasheet

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Surge Components, Inc.

95 East Jefryn Blvd

Deer Park, NY 11729 (631) 595M1818 1.. FEATURE /circle6 100 Watts Peak Power per Line(tp=8/20us) /circle6 SCM70M5L package /circle6 Up to four lines of protection /circle6 Monolithic structure /circle6 Working woltage: 5V /circle6 Low clamping voltage /circle6 ESD protection > 25KV /circle6 Low leakage current /circle6 RoHS compliant /circle6 Transient protection for data lines to IEC 61000M4 M2(ESD) ± 15KV (air), ± 8KV (contact); IEC 61000M4M4 (EFT) 40A (5/50ns) 2. APPLICATION /circle6 Cellular phones /circle6 MP3 players /circle6 Notebook /circle6 PDAs /circle6 Digital cameras /circle6 Cellular phones station 3. ELECTRICAL CHARACTERISTICS PER LINE@25 ℃℃ ℃℃(UNLESS OTHERWISE SPECIFIED) note 1 Parameter Symbol Conditions Min. Typ. Max. Units Reverse standMoff voltage V RWM 5 V Reverse Breakdown voltage V BR I t=1mA 6 V Reverse Leakage Current I R VRWM =5V T =25℃ 5 uA Clamping Voltage V C I PP =1A T P=8/20uS 8.8 V Clamping voltage V C I PP =10A T P=8/20uS 10.0 V Junction Capacitance C J V R=0V f=1MHz 60 pF /circle6 Note 1: Pin 1,3,4,5 to Pin 2

Surge Components, Inc. Deer Park, NY 11729 (631) 595M1818 4. ABSOLUTE MAXIMUM RATING @25 ℃℃ ℃℃ note 1 Rating Symbol Value Units Peak Pulse Power(t p=8/20µs) P PP 100 W Forward voltage@1A, 8/20µs V F 1.5 V Operating Temperature T j M55 to +150 ℃ Storage Temperature T STG M55 to +150 ℃ /circle6 Note 1: Pin 1,3,4,5 to Pin 2 5.TYPICAL CHARACTERISTICS

Surge Components, Inc. Deer Park, NY 11729 (631) 595M1818

Surge Components, Inc. Deer Park, NY 11729 (631) 595M1818

Surge Components, Inc. Deer Park, NY 11729 (631) 595M1818 6. PRODUCT DIMENSION PACKAGE OUTLINE DIM MILIMETER INCHES MIN MAX MIN MAX A 1.90 2.15 0.075 0.085 B 1.15 1.35 0.045 0.053 C 0.80 1.00 0.031 0.039 D 0.15 0.30 0.006 0.012 E 0.65 BSC - 0.026 BSC - F 1.30 BSC - 0.051 BSC - G 0.80 1.10 0.031 0.043 J 0.08 0.25 0.003 0.010 K 1.90 2.15 0.075 0.085 L 0 0.10 0 0.004 M 0.26 0.46 0.010 0.018 MOUNTING PAD TYPICAL DIM Millimeter Inches 1 0.50 0.020 2 1.30 0.051 3 0.65 0.026 4 1.72 0.068 5 0.60 0.024 6 1.11 0.044 7 2.33 0.092 NOTES TAPE & REEL ORDERING NOMENCLA TURE 1. Surface mount product is taped and reeled in accordance with EIA-481. 2. 7 Inch Reel – 3,000 pieces per 8mm tape.

Surge Components, Inc. Deer Park, NY 11729 (631) 595M1818 7. PACKING INFORMATION 8.APPLICATION NOTE The SES5VSC70M5 is TVS arrays designed to protect I/O or data lines from the damaging effects of ESD or EFT. This product provides both unidirectional and bidirectional protection, with a surage capability of 100 watts Ppp line for an 8/20µs wave shape and ESD protection > 25kv. CommonMmode unidirectional configuration(Figure 1) The SES5VSC70M5 provides up to 4 lines of protection in a commonMmode unidirectional configuration as depicted in Figure 1. Circuit connectivity is as follows: ■ Line 1 is connected to Pin1. ■ Line 2 is connected to Pin3. ■ Line 3 is connected to Pin4. ■ Line 4 is connected to Pin5. ■ Pin2 is connected to ground. CommonMmode unidirectional configuration (Figure 2) The SES5VSC70M5 provides up to 3 lines of protection in a commonMmode bidirectional configuration Reel Dia Tape Width AO BO KO D E F W PO P2 P Imax

Surge Components, Inc. Deer Park, NY 11729 (631) 595M1818 as depicted in Figure 2. Circuit connectivity is as follows: ■ Line 1 is connected to Pin1. ■ Line 2 is connected to Pin3. ■ Line 3 is connected to Pin4. ■ Line 5 is connected to ground. ■ Pin2 is not connected. DifferentialMmode bidirectional configuration (Figure 3) The SES5VSC70M5 provides up to 4 lines of protection in a differentialMmode bidirectional configuration as depicted in Figure 3. Circuit connectivity is as follows: ■ Line 1 is connected to Pin1. ■ Line 2 is connected to Pin3. ■ Line 3 is connected to Pin4. ■ Line 4 is connected to Pin5. ■ Pin2 is not connected. Circuit board layout and protection device placement: Circuit board layout is critical for suppression of ESD transients. The following guidelines are recommended: 1. Place the protection devices as close to the inp ut terminal or connector as possible. 2. The path length between the protection device an d protected line should be minimized. 3. Keep parallel signal pats to a minimum. 4. Avoid running protection conductors in parallel with unprotected conductor. 5. Minimize all printedMcircuit board conductive loops including power and ground loops. 6. minimize the length of the transient return path to ground. 7. Avoid using shared transient return paths to com mon ground point. 8. Ground planes should be used whenever possible. For multilayer printedMcircuit boards, use ground vias