SE5534N

NE5534 ONSEMI | Alldatasheet

Document overview

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• PDF pages: 10

Technical content

Features

• Small-Signal Bandwidth: 10 MHz
• Output Drive Capability: 600 /C0087, 10 VRMS at VS = /C003418 V
• Input Noise V oltage: 4n V/C0324Hz/C0504
• DC V oltage Gain: 100000
• AC V oltage Gain: 6000 at 10 kHz
• Power Bandwidth: 200 kHz
• Slew Rate: 13 V//C0109s
• Large Supply V oltage Range: /C00343.0 to /C003420 V
• Pb−Free Packages are Available

Applications

• Audio Equipment
• Instrumentation and Control Circuits
• Telephone Channel Amplifiers
• Medical Equipment http://onsemi.com See detailed ordering and shipping information in the package dimensions section on page 8 of this data sheet.

ORDERING INFORMATION

SOIC−8 D SUFFIX CASE 751 Top View PDIP−8 N SUFFIX CASE 626 BALANCE/ COMPENSATION OUTPUT COMPENSATION BALANCE INVERTING INPUT NON-INVERTING D, N Packages See general marking information in the device marking section on page 8 of this data sheet. DEVICE MARKING INFORMATION

Figure 1. Equivalent Schematic

1. Diodes protect the inputs against overvoltage. Therefore, unless current-limiting resistors are used, large currents will flow if the differential input

voltage exceeds 0.6 V. Maximum current should be limited to /C003410 mA.

1. Output may be shorted to ground at VS = /C003415 V, Tamb = 25°C. Temperature and/or supply voltages must be limited to ensure dissipation rating

NE5534, SA5534, SE5534, NE5534A, SA5534A, SE5534A http://onsemi.com DC ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = /C003415 V, unless otherwise noted.) (Notes 3, 4 and 5) Characteristic Symbol Test Conditions NE/SA5534/5534A SE5534/5534A UnitMin Typ Max Min Typ Max VOS − 0.5 4.0 − 0.5 2.0 mV Offset Voltage Overtemperature − − 5.0 − − 3.0 mV IOS − 20 300 − 10 200 nA Offset Current Overtemperature − − 400 − − 500 nA /C0068IOS//C0068T − 200 − − 200 − pA/°C IB − 500 1500 − 400 800 nA Input Current Overtemperature − − 2000 − − 1500 nA Supply Current Per Op Amp ICC Overtemperature 4.0 8.0 4.0 6.5 9.0 mA Common Mode Input Range VCM /C003412 /C003413 − /C003412 /C003413 − V Common Mode Rejection Ratio CMRR 70 100 − 80 100 − dB Power Supply Rejection Ratio PSRR − 10 100 − 10 50 /C0109V/V Large-Signal Voltage Gain AVOL RL ≥ 600 /C0087, VO = /C003410 V Overtemperature 100 100 V/mV Output Swing VOUT RL /C0119 600 /C0087 /C003412 /C003413 − /C003412 /C003413 − V Overtemperature /C003410 /C003412 − /C003410 /C003412 − RL /C0119 600 /C0087; VS = /C003418 V /C003415 /C003416 − /C003415 16 − RL /C0119 2.0 k/C0087 /C003413 /C003413.5 − /C003413 /C003413.5 − Overtemperature /C003412 /C003412.5 − /C003412 /C003412.5 − Input Resistance RIN 30 100 − 50 100 − k/C0087 Output Short Circuit Current ISC − 38 − − 38 − mA 3. For NE5534/5534A, T MIN = 0°C, TMAX = 70°C. 4. For SA5534/5534A, T MIN = −40°C, TMAX = +85°C. 5. For SE5534/5534A, T MIN = −55°C, TMAX = +125°C.

NE5534, SA5534, SE5534, NE5534A, SA5534A, SE5534A http://onsemi.com AC ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = /C003415 V, unless otherwise noted.) Characteristic Symbol Test Conditions NE/SA5534/5534A SE5534/5534A UnitMin Typ Max Min Typ Max Output Resistance ROUT AV = 30 dB closed-loop f = 10 kHz; RL = 600 /C0087; CC = 22 pF Transient Response Voltage-follower , VIN = 50 mV RL = 600 /C0087/C0044 CC = 22 pF, CL = 100 pF Rise Time tR − 20 − − 20 − ns Overshoot − − 20 − − 20 − % Transient Response VIN = 50 mV, RL = 600 /C0087/C0044 CC = 47 pF, CL = 500 pF Rise Time tR − 50 − − 50 − ns Overshoot − − 35 − − 35 − % Gain AV f = 10 kHz, CC = 0 − 6.0 − − 6.0 − V/mV f = 10 kHz, CC = 22 pF − 2.2 − − 2.2 − Gain Bandwidth Product GBW CC = 22 pF, CL = 100 pF − 10 − − 10 − MHz Slew Rate SR CC = 0 − 13 − − 13 − V//C0109s Power Bandwidth − VOUT = /C003410 V, CC = 0 pF − 200 − − 200 − kHz VOUT = /C003410 V, CC = 22 pF − 95 − − 95 − VOUT = /C003414 V, RL = 600 /C0087/C0044 CC = 22 pF, VCC = /C003418 V − 70 − − 70 − ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = 15 V, unless otherwise noted.) Characteristic Symbol Test Conditions NE/SA/SE5534 NE/SA/SE5534A UnitMin Typ Max Min Typ Max Input Noise Voltage VNOISE fO = 30 Hz fO = 1.0 kHz 7.0 4.0 5.5 3.5 7.0 4.5 nV/√Hz Input Noise Current INOISE fO = 30 Hz fO = 1.0 kHz 2.5 0.6 1.5 0.4 pA/√Hz Broadband Noise Figure − f = 10 Hz to 20 kHz; RS = 5.0 k/C0087 Channel Separation − f = 1.0 kHz; RS = 5.0 k/C0087 − 110 − − 110 − dB

NE5534, SA5534, SE5534, NE5534A, SA5534A, SE5534A http://onsemi.com SA5234xN AWL YYWWG PDIP−8 N SUFFIX CASE 626 SOIC−8 D SUFFIX CASE 751 x = Blank or A A = Assembly Location WL, L = Wafer Lot YY , Y = Year WW, W = Work Week G or /C0071= Pb−Free Package MARKING DIAGRAMS N5234 ALYWA /C0071 S5234 ALYWA /C0071 S5234 ALYW /C0071 NE5234xN AWL YYWWG SE5234xN AWL YYWWG Device Description Temperature Range Shipping† NE5534AD 8−Pin Plastic Small Outline (SO−8) Package 0 to +70°C 98 Units / Rail NE5534ADG 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) 0 to +70°C 98 Units / Rail NE5534ADR2 8−Pin Plastic Small Outline (SO−8) Package 0 to +70°C 2500 / Tape & Reel NE5534ADR2G 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) 0 to +70°C 2500 / Tape & Reel NE5534AN 8−Pin Plastic Dual In−Line Package (PDIP−8) 0 to +70°C 50 Units / Rail NE5534ANG 8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free) 0 to +70°C 50 Units / Rail NE5534D 8−Pin Plastic Small Outline (SO−8) Package 0 to +70°C 98 Units / Rail NE5534DG 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) 0 to +70°C 98 Units / Rail NE5534DR2 8−Pin Plastic Small Outline (SO−8) Package 0 to +70°C 2500 / Tape & Reel NE5534DR2G 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) 0 to +70°C 2500 / Tape & Reel NE5534N 8−Pin Plastic Dual In−Line Package (PDIP−8) 0 to +70°C 50 Units / Rail NE5534NG 8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free) 0 to +70°C 50 Units / Rail SA5534AD 8−Pin Plastic Small Outline (SO−8) Package −40 to +85°C 98 Units / Rail SA5534ADG 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) −40 to +85°C 98 Units / Rail SA5534ADR2 8−Pin Plastic Small Outline (SO−8) Package −40 to +85°C 2500 / Tape & Reel SA5534ADR2G 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) −40 to +85°C 2500 / Tape & Reel SA5534AN 8−Pin Plastic Dual In−Line Package (PDIP−8) −40 to +85°C 50 Units / Rail SA5534ANG 8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free) −40 to +85°C 50 Units / Rail SA5534N 8−Pin Plastic Dual In−Line Package (PDIP−8) −40 to +85°C 50 Units / Rail SA5534NG 8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free) −40 to +85°C 50 Units / Rail SE5534AN 8−Pin Plastic Dual In−Line Package (PDIP−8) −55 to +125°C 50 Units / Rail SE5534ANG 8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free) −55 to +125°C 50 Units / Rail SE5534N 8−Pin Plastic Dual In−Line Package (PDIP−8) −55 to +125°C 50 Units / Rail SE5534NG 8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free) −55 to +125°C 50 Units / Rail †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.

NE5534, SA5534, SE5534, NE5534A, SA5534A, SE5534A http://onsemi.com PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AG SEATING PLANE N J X 45/C0095 K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751 −01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A B S DH C 0.10 (0.004) DIM A MIN MAX MIN MAX INCHES 4.80 5.00 0.189 0.197 MILLIMETERS B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.053 0.069 D 0.33 0.51 0.013 0.020 G 1.27 BSC 0.050 BSC H 0.10 0.25 0.004 0.010 J 0.19 0.25 0.007 0.010 K 0.40 1.27 0.016 0.050 M 0 8 0 8 N 0.25 0.50 0.010 0.020 S 5.80 6.20 0.228 0.244 −X− −Y− G MYM0.25 (0.010) −Z− YM0.25 (0.010) Z S X S M /C0095/C0095/C0095/C0095 1.52 0.060 7.0 0.275 0.6 0.024 1.270 0.050 4.0 0.155 /C0466mm inches/C0467SCALE 6:1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT*

NE5534, SA5534, SE5534, NE5534A, SA5534A, SE5534A http://onsemi.com PACKAGE DIMENSIONS 8−Pin Plastic Dual In−Line Package (PDIP−8) N SUFFIX CASE 626−05 ISSUE L NOTES: 1. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 2. PACKAGE CONTOUR OPTIONAL (ROUND OR SQUARE CORNERS). 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. F NOTE 2 −A− −B− −T− SEATING PLANE H J G D K N C L M MAM0.13 (0.005) B MT DIM MIN MAX MIN MAX INCHESMILLIMETERS A 9.40 10.16 0.370 0.400 B 6.10 6.60 0.240 0.260 C 3.94 4.45 0.155 0.175 D 0.38 0.51 0.015 0.020 F 1.02 1.78 0.040 0.070 G 2.54 BSC 0.100 BSC H 0.76 1.27 0.030 0.050 J 0.20 0.30 0.008 0.012 K 2.92 3.43 0.115 0.135 L 7.62 BSC 0.300 BSC N 0.76 1.01 0.030 0.040 /C0095/C0095 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, in cluding without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney f ees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 NE5534/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.