SE5532AD8

NE5532 ONSEMI | Alldatasheet

Document overview

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• PDF pages: 10

Technical content

Features

• Small-Signal Bandwidth: 10 MHz
• Output Drive Capability: 600 /C0087, 10 VRMS
• Input Noise V oltage: 5.0 nV/C0324Hz/C0504 (Typical)
• DC V oltage Gain: 50000
• AC V oltage Gain: 2200 at 10 kHz
• Power Bandwidth: 140 kHz
• Slew Rate: 9.0 V//C0109s
• Large Supply V oltage Range: /C00343.0 to /C003420 V
• Compensated for Unity Gain
• Pb−Free Packages are Available http://onsemi.com See detailed ordering and shipping information in the package dimensions section on page 7 of this data sheet.

ORDERING INFORMATION

SOIC−8 D SUFFIX CASE 751 PDIP−8 N SUFFIX CASE 626 SOIC−16 WB D SUFFIX CASE 751G N, D8 Packages D Package* *SOL and non-standard pinout. BA OUTB −INB +INB OUTA −INA +INA Top View −INA +INA NC NC NC +IN B −INB NC NC NC OUTA 8 9 OUT B NC NC Top View See general marking information in the device marking section on page 6 of this data sheet. DEVICE MARKING INFORMATION

Figure 1. Equivalent Schematic (Each Amplifier)

16 D Packagee

1. Diodes protect the inputs against overvoltage. Therefore, unless current-limiting resistors are used, large currents will flow if the differential input

voltage exceeds 0.6 V. Maximum current should be limited to /C003410 mA.

NE5532, SA5532, SE5532, NE5532A, SE5532A http://onsemi.com DC ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = /C003415 V, unless otherwise noted.) (Notes 2, 3 and 4) Characteristic Symbol Test Conditions SE5532/A NE5532/A, SA5532 UnitMin Typ Max Min Typ Max Offset Voltage VOS − − 0.5 2.0 − 0.5 4.0 mV − Overtemperature − − 3.0 − − 5.0 mV Offset Current IOS − − − 100 − 10 150 nA − Overtemperature − − 200 − − 200 nA /C0068IOS//C0068T − − 200 − − 200 − pA/°C Input Current IB − − 200 400 − 200 800 nA − Overtemperature − − 700 − − 1000 nA Supply Current ICC − − 8.0 10.5 − 8.0 16 mA − Overtemperature − − 13 − − − Common-Mode Input Range VCM − /C003412 /C003413 − /C003412 /C003413 − V Common-Mode Rejection Ratio CMRR − 80 100 − 70 100 − dB Power Supply Rejection Ratio PSRR − − 10 50 − 10 100 /C0109V/V Large-Signal Voltage Gain AVOL RL /C01192.0 k/C0087; VO = /C003410 V 50 100 − 25 100 − V/mV Overtemperature 25 − − 15 − − RL /C0119600 /C0087; VO = /C003410 V 40 50 − 15 50 − Overtemperature 20 − − 10 − − Output Swing VOUT RL /C0119 600 /C0087 /C003412 /C003413 − /C003412 /C003413 − V Overtemperature /C003410 /C003412 − /C003410 /C003412 − RL /C0119 600 /C0087; VS = /C003418 V /C003415 /C003416 − /C003415 /C003416 − Overtemperature /C003412 /C003414 − /C003412 /C003414 − RL /C0119 2.0 k/C0087 /C003413 /C003413.5 − /C003413 /C003413.5 − Overtemperature /C003412 /C003412.5 − /C003410 /C003412.5 − Input Resistance RIN − 30 300 − 30 300 − k/C0087 Output Short Circuit Current ISC − 10 38 60 10 38 60 mA 2. Diodes protect the inputs against overvoltage. Therefore, unless current-limiting resistors are used, large currents will flow if the differential input voltage exceeds 0.6 V. Maximum current should be limited to /C003410 mA. 3. For operation at elevated temperature, derate packages based on the package thermal resistance. 4. Output may be shorted to ground at V S = /C003415 V, Tamb = 25°C. Temperature and/or supply voltages must be limited to ensure dissipation rating is not exceeded.

NE5532, SA5532, SE5532, NE5532A, SE5532A http://onsemi.com AC ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = /C003415 V, unless otherwise noted.) Characteristic Symbol Test Conditions NE/SE5532/A, SA5532 UnitMin Typ Max Output Resistance ROUT AV = 30 dB Closed-loop f = 10 kHz, RL = 600 /C0087 − 0.3 − /C0087 Overshoot − Voltage-Follower % VIN = 100 mVP-P − 10 − CL = 100 pF; RL = 600 /C0087 Gain AV f = 10 kHz − 2.2 − V/mV Gain Bandwidth Product GBW CL = 100 pF; RL = 600 /C0087 − 10 − MHz Slew Rate SR − − 9.0 − V//C0109s Power Bandwidth − VOUT = /C003410 V − 140 − kHz VOUT = /C003414 V; RL = 600 /C0087 − 100 − VCC = /C003418 V ELECTRICAL CHARACTERISTICS (Tamb = 25°C; VS = /C003415 V, unless otherwise noted.) Characteristic Symbol Test Conditions NE/SE5532 NE/SA/SE5532A UnitMin Typ Max Min Typ Max Input Noise Voltage VNOISE fO = 30 Hz − 8.0 − − 8.0 12 nV/√Hz Input Noise Current INOISE fO = 30 Hz − 2.7 − − 2.7 − pA/√Hz Channel Separation − f = 1.0 kHz; RS = 5.0 k/C0087− 110 − − 110 − dB

Figure 10. Test Circuits

NE5532, SA5532, SE5532, NE5532A, SE5532A http://onsemi.com Device Description Temperature Range Shipping† NE5532AD8 8−Pin Plastic Small Outline (SO−8) Packagee 0 to 70°C 98 Units / Rail NE5532AD8G 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) 0 to 70°C 98 Units / Rail NE5532AD8R2 8−Pin Plastic Small Outline (SO−8) Packagee 0 to 70°C 2500 / Tape & Reel NE5532AD8R2G 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) 0 to 70°C 2500 / Tape & Reel NE5532AN 8−Pin Plastic Dual In−Line Package (PDIP−8) 0 to 70°C 50 Units / Rail NE5532ANG 8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free) 0 to 70°C 50 Units / Rail NE5532D 16−Pin Plastic Small Outline (SO−16 WB) Package 0 to 70°C 47 Units / Rail NE5532DG 16−Pin Plastic Small Outline (SO−16 WB) Package (Pb−Free) 0 to 70°C 47 Units / Rail NE5532DR2 16−Pin Plastic Small Outline (SO−16 WB) Package 0 to 70°C 1000 Tape & Reel NE5532DR2G 16−Pin Plastic Small Outline (SO−16 WB) Package (Pb−Free) 0 to 70°C 1000 Tape & Reel NE5532D8 8−Pin Plastic Small Outline (SO−8) Packagee 0 to 70°C 98 Units / Rail NE5532D8G 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) 0 to 70°C 98 Units / Rail NE5532D8R2 8−Pin Plastic Small Outline (SO−8) Packagee 0 to 70°C 2500 / Tape & Reel NE5532D8R2G 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) 0 to 70°C 2500 / Tape & Reel NE5532N 8−Pin Plastic Dual In−Line Package (PDIP−8) 0 to 70°C 50 Units / Rail NE5532NG 8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free) 0 to 70°C 50 Units / Rail SA5532N 8−Pin Plastic Dual In−Line Package (PDIP−8) −40 to +85°C 50 Units / Rail SA5532NG 8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free) −40 to +85°C 50 Units / Rail SE5532AD8 8−Pin Plastic Small Outline (SO−8) Packagee −55 to +125°C 98 Units / Rail SE5532AD8G 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) −55 to +125°C 98 Units / Rail SE5532AD8R2 8−Pin Plastic Small Outline (SO−8) Packagee −55 to +125°C 2500 / Tape & Reel SE5532AD8R2G 8−Pin Plastic Small Outline (SO−8) Package (Pb−Free) −55 to +125°C 2500 / Tape & Reel SE5532N 8−Pin Plastic Dual In−Line Package (PDIP−8) −55 to +125°C 50 Units / Rail SE5532NG 8−Pin Plastic Dual In−Line Package (PDIP−8) (Pb−Free) −55 to +125°C 50 Units / Rail †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.

NE5532, SA5532, SE5532, NE5532A, SE5532A http://onsemi.com PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AG SEATING PLANE N J X 45/C0095 K NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751 −01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A B S DH C 0.10 (0.004) DIM A MIN MAX MIN MAX INCHES 4.80 5.00 0.189 0.197 MILLIMETERS B 3.80 4.00 0.150 0.157 C 1.35 1.75 0.053 0.069 D 0.33 0.51 0.013 0.020 G 1.27 BSC 0.050 BSC H 0.10 0.25 0.004 0.010 J 0.19 0.25 0.007 0.010 K 0.40 1.27 0.016 0.050 M 0 8 0 8 N 0.25 0.50 0.010 0.020 S 5.80 6.20 0.228 0.244 −X− −Y− G MYM0.25 (0.010) −Z− YM0.25 (0.010) Z S X S M /C0095/C0095/C0095/C0095 1.52 0.060 7.0 0.275 0.6 0.024 1.270 0.050 4.0 0.155 /C0466mm inches/C0467SCALE 6:1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT*

NE5532, SA5532, SE5532, NE5532A, SE5532A http://onsemi.com PACKAGE DIMENSIONS 8−Pin Plastic Dual In−Line Package (PDIP−8) N SUFFIX CASE 626−05 ISSUE L NOTES: 1. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 2. PACKAGE CONTOUR OPTIONAL (ROUND OR SQUARE CORNERS). 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. F NOTE 2 −A− −B− −T− SEATING PLANE H J G D K N C L M MAM0.13 (0.005) B MT DIM MIN MAX MIN MAX INCHESMILLIMETERS A 9.40 10.16 0.370 0.400 B 6.10 6.60 0.240 0.260 C 3.94 4.45 0.155 0.175 D 0.38 0.51 0.015 0.020 F 1.02 1.78 0.040 0.070 G 2.54 BSC 0.100 BSC H 0.76 1.27 0.030 0.050 J 0.20 0.30 0.008 0.012 K 2.92 3.43 0.115 0.135 L 7.62 BSC 0.300 BSC N 0.76 1.01 0.030 0.040 /C0095/C0095

NE5532, SA5532, SE5532, NE5532A, SE5532A http://onsemi.com PACKAGE DIMENSIONS SOIC−16 WB D SUFFIX CASE 751G−03 ISSUE C D 14X B16X SEATING PLANE SAM0.25 B ST 16 9 h X 45/C0095 MBM0.25 H8X E B A e T A L C /C0113 NOTES: 1. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. 3. DIMENSIONS D AND E DO NOT INLCUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF THE B DIMENSION AT MAXIMUM MATERIAL CONDITION. DIM MIN MAX MILLIMETERS A 2.35 2.65 A1 0.10 0.25 B 0.35 0.49 C 0.23 0.32 D 10.15 10.45 E 7.40 7.60 e 1.27 BSC H 10.05 10.55 h 0.25 0.75 L 0.50 0.90 q 0 7 /C0095/C0095 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, in cluding without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney f ees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 NE5532/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder For additional information, please contact your local Sales Representative.