LM161_14 TI1 | Alldatasheet
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LM161,LM361 www.ti.com SNOSBJ5C –MAY 1999–REVISED MARCH 2013 LM161/LM361HighSpeedDifferentialComparators Check forSamples: LM161 ,LM361 1FEATURES DESCRIPTION The LM161/LM361 isa very high speed differential 2• Independentstrobes input,complementaryTTL outputvoltagecomparator• Ensured high speed: 20 ns max withimprovedcharacteristicsovertheSE529/NE529
- Tightdelaymatching on both outputs forwhich itisa pin-for-pinreplacement.The device has been optimizedforgreaterspeed performance• Complementary TTL outputs and lowerinputoffsetvoltage.Typicallydelayvaries• Operates from op amp supplies: ±15V only3 ns forover-drivevariationsof5 mV to500 mV.
- Low speed variationwithoverdrivevariation Itmay be operatedfromop amp supplies(±15V).
- Low inputoffsetvoltage Complementary outputshaving maximum skew are
- Versatilesupply voltagerange provided.Applicationsinvolvehigh speed analog to digitalconvertersand zero-crossingdetectorsindisk filesystems. CONNECTION DIAGRAMS SOIC or PDIP Package Figure1. Top View Figure2. Package Number LME0010C Pleasebe aware thatan importantnoticeconcerningavailability,standardwarranty,and use incriticalapplicationsof Texas Instrumentssemiconductorproductsand disclaimerstheretoappearsattheend ofthisdatasheet. 2Alltrademarksarethepropertyoftheirrespectiveowners. PRODUCTION DATA informationiscurrentas ofpublicationdate. Copyright© 1999–2013,Texas InstrumentsIncorporatedProductsconform to specificationsper the terms of the Texas Instrumentsstandardwarranty.Productionprocessingdoes not necessarilyincludetestingofallparameters.
LM161,LM361 SNOSBJ5C –MAY 1999–REVISED MARCH 2013 www.ti.com LOGIC DIAGRAM *Outputislowwhen currentisdrawn fromstrobepin. These deviceshave limitedbuilt-inESD protection.The leadsshouldbe shortedtogetherorthedeviceplacedinconductivefoam duringstorageorhandlingtopreventelectrostaticdamage totheMOS gates. AbsoluteMaximum Ratings (1) PositiveSupplyVoltage,V+ +16V NegativeSupplyVoltage,V− −16V Gate SupplyVoltage,VCC +7V OutputVoltage +7V DifferentialInputVoltage ±5V InputCommon Mode Voltage ±6V Power Dissipation 600 mW StorageTemperatureRange −65°C to+150°C OperatingTemperatureRange TMIN TMAX LM161 −55°C to+125°C −25°C to+85°C LM361 0°C to+70°C Lead Temp. (Soldering,10 seconds) 260°C ForAny DeviceLead Below V− 0.3V (1) The devicemay be damaged by use beyond themaximum ratings. OperatingConditions Min Typ Max LM161 5V 15V SupplyVoltageV+ LM361 5V 15V LM161 −6V −15V SupplyVoltageV− LM361 −6V −15V LM161 4.5V 5V 5.5V SupplyVoltageVCC LM361 4.75V 5V 5.25V ESD Tolerance(1) 1600V seconds) Infrared(15seconds) 220°C (1) Human body model,1.5kΩ inserieswith100 pF. (2) See AN-450 “SurfaceMountingMethods and TheirEffecton ProductReliability”forothermethods ofsolderingsurfacemount devices.
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LM161,LM361 www.ti.com SNOSBJ5C –MAY 1999–REVISED MARCH 2013 ElectricalCharacteristics(1)(2)(1) (V+ = +10V, VCC = +5V, V− = −10V,TMIN ≤ TA ≤ TMAX ,unlessnoted) Parameter Conditions Limits Units LM161 LM361 Min Typ Max Min Typ Max InputOffsetVoltage 1 3 1 5 mV 5 10 μA InputBiasCurrent TA=25°C 20 30 μA 2 2 μA InputOffsetCurrent TA=25°C 3 5 μA VoltageGain TA=25°C 3 3 V/mV InputResistance TA=25°C, f=1kHz 20 20 kΩ VCC =4.75V,Logical“0”OutputVoltage 0.4 0.4 VISINK=6.4mA StrobeInput“1”Current VCC =5.25V, 200 200 μA(OutputEnabled) VSTROBE =2.4V StrobeInput“0”Current VCC =5.25V, −1.6 −1.6 mA(OutputDisabled) VSTROBE =0.4V StrobeInput“0”Voltage VCC =4.75V 0.8 0.8 V StrobeInput“1”Voltage VCC =4.75V 2 2 V OutputShortCircuitCurrent VCC =5.25V,VOUT =0V −18 −55 −18 −55 mA SupplyCurrentI+ V+=10V, V−=−10V, 4.5 mA VCC =5.25V, −55°C ≤TA≤125°C SupplyCurrentI+ V+=10V, V−=−10V, 5 mA VCC =5.25V, 0°C ≤TA≤70°C SupplyCurrentI− V+=10V, V−=−10V, 10 mA VCC =5.25V, −55°C ≤TA≤125°C SupplyCurrentI− V+=10V, 10 mA V−=−10V,VCC =5.25V, 0°C ≤TA≤70°C SupplyCurrentICC V+=10V, V−=−10V, 18 mA VCC =5.25V, −55°C ≤TA≤125°C SupplyCurrentICC V+=10V, V−=−10V, 20 mA VCC =5.25V, 0°C ≤TA≤70°C TransientResponse VIN = 50 mV overdrive(3) PropagationDelayTime (tpd(0)) TA=25°C 14 20 14 20 ns PropagationDelayTime (tpd(1)) TA=25°C 14 20 14 20 ns DelayBetween OutputA and B TA=25°C 2 5 2 5 ns StrobeDelayTime (tpd(0)) TA=25°C 8 8 ns StrobeDelayTime (tpd(1)) TA=25°C 8 8 ns (1) Typicalthermalimpedancesareas follows: (2) RefertoRETS161X forLM161H and LM161J militaryspecifications. (3) Measurements usingAC Testcircuit,Fanout= 1.The devicesarefasteratlowsupplyvoltages. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 3 ProductFolderLinks:LM161 LM361
LM161,LM361 SNOSBJ5C –MAY 1999–REVISED MARCH 2013 www.ti.com TypicalPerformance Characteristics InputCurrents vs Ambient OffsetVoltage Temperature Figure3. Figure4. Supply Currentvs InputCharacteristics Ambient Temperature Figure5. Figure6. Supply Currentvs PropagationDelay vs Supply Voltage Ambient Temperature Figure7. Figure8.
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LM161,LM361 www.ti.com SNOSBJ5C –MAY 1999–REVISED MARCH 2013 TypicalPerformance Characteristics(continued) StrobeDelay Delay ofOutput 1 With vs Respect toOutput 2 vs Ambient Ambient Temperature Temperature Figure9. Figure10. Common-Mode PropagationDelay vs Pulse Response Supply Voltage Figure11. Figure12. Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 5 ProductFolderLinks:LM161 LM361
LM161,LM361 SNOSBJ5C –MAY 1999–REVISED MARCH 2013 www.ti.com AC TEST CIRCUIT VIN = ±50 mV FANOUT = 1 FANOUT = 4 V− = −10V C=15 pF C = 30 pF V+ = +10V R = 2.4k R = 680Ω VCC = 5.25V
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LM161,LM361 www.ti.com SNOSBJ5C –MAY 1999–REVISED MARCH 2013 SCHEMATIC DIAGRAM LM161 R10, R16: 85 R11, R17: 205 Copyright© 1999–2013,Texas InstrumentsIncorporated SubmitDocumentationFeedback 7 ProductFolderLinks:LM161 LM361
LM161,LM361 SNOSBJ5C –MAY 1999–REVISED MARCH 2013 www.ti.com
REVISION HISTORY
Changes from RevisionB (March 2013)toRevisionC Page
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www.ti.com 9-Aug-2013 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) Device Marking (4/5) Samples LM361H ACTIVE TO-100 LME 10 500 TBD Call TI Call TI 0 to 70 LM361H LM361H/NOPB ACTIVE TO-100 LME 10 500 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM 0 to 70 LM361H LM361M ACTIVE SOIC D 14 55 TBD Call TI Call TI 0 to 70 LM361M LM361M/NOPB ACTIVE SOIC D 14 55 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM361M LM361MX ACTIVE SOIC D 14 2500 TBD Call TI Call TI 0 to 70 LM361M LM361MX/NOPB ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM361M LM361N ACTIVE PDIP NFF 14 25 TBD Call TI Call TI 0 to 70 LM361N LM361N/NOPB ACTIVE PDIP NFF 14 25 Green (RoHS & no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 70 LM361N LM529CH ACTIVE TO-100 LME 10 500 TBD Call TI Call TI 0 to 70 LM361H LM529CN ACTIVE PDIP NFF 14 25 TBD Call TI Call TI 0 to 70 LM361N NE529A ACTIVE PDIP NFF 14 25 TBD Call TI Call TI 0 to 70 LM361N NE529K ACTIVE TO-100 LME 10 500 TBD Call TI Call TI 0 to 70 LM361H SE529K ACTIVE TO-100 LME 10 500 TBD Call TI Call TI 0 to 70 LM361H (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
www.ti.com 9-Aug-2013 Addendum-Page 2 Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) (mm) (mm) (mm) (mm) W (mm) Pin1 Quadrant PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 Pack Materials-Page 1
*All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM361MX SOIC D 14 2500 367.0 367.0 35.0 LM361MX/NOPB SOIC D 14 2500 367.0 367.0 35.0 PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 Pack Materials-Page 2
MMBC006 – MARCH 2001 1POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 LME (O–MBCY–W10) METAL CYLINDRICAL PACKAGE 4202488/A 03/01 0.335 (8,51) 0.370 (9,40) 0.335 (8,51) 0.305 (7,75) 0.185 (4,70) 0.165 (4,19) 0.500 (12,70) MIN 0.010 (0,25) 0.040 (1,02) 0.040 (1,02) 0.010 (0,25) 0.016 (0,41) 0.021 (0,53) 0.045 (1,14) 0.029 (0,74) 0.028 (0,71) 0.034 (0,86) 0.120 (3,05) 0.110 (2,79) ø ø ø ø Seating Plane 36° 10 9 4 5 0.230 (5,84) NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Leads in true position within 0.010 (0,25) R @ MMC at seating plane. D. Pin numbers shown for reference only. Numbers may not be marked on package. E. Falls within JEDEC MO–006/TO-100.
www.ti.com N14A (Rev G)
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Click to View Pricing, Inventory, Delivery & Lifecycle Information: Texas Instruments: LM361H LM361H/NOPB LM361M LM361M/NOPB LM361MX LM361MX/NOPB LM361N LM361N/NOPB NE529K LM529CN NE529A SE529K LM529CH