SE12DB_V01 VISHAY | Alldatasheet

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SE12DB, SE12DD, SE12DG, SE12DJ www.vishay.com Vishay General Semiconductor Revision: 26-Feb-2020 1 Document Number: 89984 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Surface-Mount ESD Capability Rectifiers ADDITIONAL RESOURCES

FEATURES

  • Very low profile - typical height of 1.7 mm
  • Ideal for automated placement
  • Oxide planar chip junction
  • Low forward voltage drop
  • ESD capability
  • AEC-Q101 qualified
  • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
  • Material categorization: fo r definitions of compliance please see www.vishay.com/doc?99912 TYPICAL APPLICATIONS General purpose, powe r line polarity protection, in both consumer and automotive applications. MECHANICAL DATA Case: SMPD (TO-263AC) Molding compound meets UL 94 V-0 flammability rating Base P/N-M3 - halogen-free, RoHS-compliant, and commercial grade Base P/NHM3 - halogen-free, RoHS-compliant, and AEC-Q101 qualified Terminals: matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 M3 suffix meets JESD 201 class 2 whisker test, HM3 suffix meets JESD 201 class 2 whisker test Polarity: as marked Notes (1) With heatsink (2) Free air, mounted on recommended copper pad area PRIMARY CHARACTERISTICS IF(AV) 12 A VRRM 100 V, 200 V, 400 V, 600 V IFSM 125 A VF at IF = 12 A (TA = 125 °C) 0.96 V IR 20 μA TJ max. 175 °C Package SMPD (TO-263AC) Circuit configuration Single SE12DX Top View Bottom View K Anode 1 Anode 2 K Cathode eSMP® Series SMPD (TO-263AC) 333DDD3 D 3D Models Available MAXIMUM RATINGS (TA = 25 °C unless otherwise noted) PARAMETER SYMBOL SE12DB SE12DD SE12DG SE12DJ UNIT Maximum repetitive peak reverse voltage V RRM 100 200 400 600 V Maximum DC forward current IF (1) 12 A IF (2) 3.2 Peak forward surge current 10 ms single half sine-wave superimposed on rated load IFSM 125 A Operating junction and storage temperature range T J, TSTG -55 to +175 °C

SE12DB, SE12DD, SE12DG, SE12DJ www.vishay.com Vishay General Semiconductor Revision: 26-Feb-2020 2 Document Number: 89984 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Notes (1) Pulse test: 300 μs pulse width, 1 % duty cycle (2) Pulse test: Pulse width ≤ 40 ms Notes (1) The heat generated must be less than the thermal conductivity from junction-to-ambient: dPD/dTJ < 1/RθJA (2) Free air, mounted on recommended PCB, 2 oz. pad area; thermal resistance RθJA - junction to ambient (3) With infinite heatsink Note (1) AEC-Q101 qualified ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted) PARAMETER TEST CONDITIONS SYMBOL TYP. MAX. UNIT Instantaneous forward voltage IF = 6 A TA = 25 °C VF (1) 0.95 - V IF = 12 A 1.04 1.15 IF = 6 A TA = 125 °C 0.85 - IF = 12 A 0.96 1.10 Reverse current Rated V R TA = 25 °C IR (2) -2 0 μA TA = 125 °C 27 150 Typical reverse recovery time I F = 0.5 A, IR = 1.0 A, Irr = 0.25 A t rr 3000 - ns Typical junction capacitance 4.0 V, 1 MHz C J 90 - pF THERMAL CHARACTERISTICS (TA = 25 °c unless otherwise noted) PARAMETER SYMBOL SE12DB SE12DD SE12DG SE12DJ UNIT Typical thermal resistance RθJA (1)(2) 60 °C/W RθJC (3) 1.6 IMMUNITY TO ELECTRICAL STATIC DISCHARGE TO THE FOLLOWING STANDARDS (TA = 25 °C unless otherwise noted) STANDARD TEST TYPE TEST CONDITIONS SYMBOL CLASS VALUE AEC-Q101-001 Human body model (con tact mode) C = 100 pF, R = 1.5 k Ω V C H3B > 8 kV ORDERING INFORMATION (Example) STANDARD PREFERRED P/N UNIT WEIGHT (g) PREFERRED PACKAGE CODE BASE QUANTITY DELIVERY MODE SMPD (TO-263AC) SE12DJ-M3/I 0.54 I 2000/reel 13" diameter plastic tape and reel SMPD (TO-263AC) SE12DJHM3/I (1) 0.54 I 2000/reel 13" diameter plastic tape and reel

SE12DB, SE12DD, SE12DG, SE12DJ www.vishay.com Vishay General Semiconductor Revision: 26-Feb-2020 3 Document Number: 89984 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted) Fig. 1 - Forward Current Derating Curve Fig. 2 - Forward Power Loss Characteristics Fig. 3 - Typical Instantaneous Forward Characteristics Fig. 4 - Typical Reverse Leakage Characteristics Fig. 5 - Typical Junction Capacitance Fig. 6 - Typical Transient Thermal Impedance 0 25 50 75 100 125 150 175 Average Forward Rectified Current (A) Mount Temperature (°C) RthJC = 1.6 oC/W Free air, TA, RthJA= 60 oC/W 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 11.0 12.0 13.0 14.0 15.0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Average Power Loss (W) Average Forward Current (A) D = 0.1 D = 0.2 D = 0.3 D = 0.5 D = 1.0 D = 0.8 D = tp/T T tp 100 1000 10000 0.01 0.1 100 Axis Title 1st line 2nd line Instantaneous Forward Current (A) Instantaneous Forward Voltage (V) TJ = -40 °C TJ= 175 °C TJ = 25 °C TJ = 150 °C TJ = 125 °C TJ = 75 °C 100 1000 10000 0.001 0.01 0.1 100 1000 10 20 30 40 50 60 70 80 90 100 Axis Title 1st line 2nd line Instantaneous Reverse Current (µA) Percent of Rated Peak Reverse Voltage (%) TJ = 150 °C TJ= 125 °C TJ = 75 °C TJ = 25 °C TJ = 175 °C TJ = -40 °C 100 1000 0.1 1 10 100 Junction Capacitance (pF) Reverse Voltage (V) TJ = 25 °C f = 1.0 MHz V sig = 50 mVp-p 100 0.01 0.1 1 10 100 Transient Thermal Impedance (°C/W) t - Pulse Duration (s) Junction to Ambient

SE12DB, SE12DD, SE12DG, SE12DJ www.vishay.com Vishay General Semiconductor Revision: 26-Feb-2020 4 Document Number: 89984 For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PACKAGE OUTLINE DIMENSIONS in inches (millimeters) 0.059 (1.50) REF. 0.339 (8.60) 0.323 (8.20) 0.063 (1.60) 0.047 (1.20) 0.048 (1.21) 0.032 (0.81) 0.020 (0.52) 0.011 (0.27) 0.071 (1.80) 0.063 (1.60) 0.069 (1.74) 0.053 (1.34) 0.020 (0.52) 0.011 (0.27) 0.052 (1.23) 0.028 (0.72) 0.276 (7.00) 0.260 (6.60) Mounting Pad Layout 0.420 (10.66) MIN. 0.080 (2.03) MIN. 0.120 (3.05) REF. 0.105 (2.67) 0.095 (2.41) SMPD (TO-263AC) NOM.0.194 (4.93) NOM. 0 to 0.01 (0 to 0.254) REF.0.330 (8.38) 0.604 (15.33) 0.525 (13.33) 0.200 (5.08) 0.354 (8.99) 0.338 (8.59) 0.509 (12.93) 0.485 (12.33) 0.402 (10.20) 0.386 (9.80)

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