SE051A2HQ1/Z01XEZ

NXP Semiconductors

Plug & Trust Secure Element Rev. 2.0 8 July 2024

Manufacturer: NXP Semiconductors

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PDF pages: 32

Technical content

Datasheet sections

1 Introduction
1.1 SE051 use cases
1.2 SE051 target applications
1.3 SE051 naming convention
2 Features and benefits
2.1 Key benefits
2.2 Key features
3 Functional description
3.1 Functional diagram
3.2 IoT Applet Functionality
3.2.1 Supported secure object types
3.2.2 Access control
3.2.3 Locking the Device Configuration
3.2.4 Sessions and multi-threading
3.2.5 Attestation and trust provisioning
3.2.6 Application support
3.2.7 Random number generator
3.2.8 Credential Storage & Memory
3.3 PERSO applet
3.4 SEMS Lite
3.5 Applet Updatability
3.6 Secure UWB ranging
3.7 Matter
3.8 Ease of use configuration
3.9 Startup behaviour
4 Communication interfaces
4.1 I2C Interfaces
4.1.1 Supported I2C frequencies
4.1.2 Default I2C Communication Parameters
4.2 ISO7816 and ISO14443 Interface
5 Power-saving modes
5.1 Power-down mode
5.2 Deep Power-down mode
6 Ordering information
7 Pinning information
7.1 Pinning
7.1.1 Pinning HX2QFN20
8 Package
9 Marking
10 Packing information
10.1 Reel packing
11 Electrical and timing characteristics
12 Limiting values
13 Recommended operating conditions
14 Characteristics
14.1 Thermal Characteristics
14.2 DC characteristics
14.2.1 General and General Purpose I/O interface
14.2.2 I2C Interface
14.2.3 Power consumption
14.3 AC characteristics
14.4 I2C Bus Timings
14.5 EMC/EMI
15 Abbreviations
16 References
17 Revision history

Plug & Trust Secure Element Rev. 2.0 — 8 July 2024 Product data sheet 577320

1 Introduction

The SE051 is a ready-to-use IoT secure element solution. It provides a root of trust at the IC level and it gives an IoT system state-of-the-art, edge-to-cloud security capability right out of the box. SE051 is updatable on applet level for feature updates or security maintenance purposes. SE051 allows for securely storing and provisioning credentials and performing cryptographic operations for security critical communication and control functions. SE051 is versatile in IoT security use cases such as secure connection to public/private clouds, device-to-device authentication or protection of sensor data. SE051 has an independent Common Criteria EAL 6+ security certification up to OS level and supports both RSA & ECC asymmetric cryptographic algorithms with high key length and future proof ECC curves. The latest security measures protect the IC even against sophisticated non-invasive and invasive attack scenarios. The SE051 is a turnkey solution that comes with Java Card operating system and an updatable applet optimized for IoT security use cases pre-installed. This is complemented by a comprehensive product support package, enabling fast time to market and easy design-in with Plug & Trust middleware for host applications, easy to use development kits, reference designs, and extensive documentation for product evaluation. The SE051 is a product platform that comes in several pin-to-pin compatible product variants, see [4]. Additional information on the integration can be found in several application notes on the NXP website. See [3]. For additional information on guidelines for the usability of SE051 and the security recommendations for using the module, see [7]. To implement inclusive language, the terms "master/slave" has been replaced by "controller/target", following the recommendation of MIPI.

1.1 SE051 use cases

Secure connection to public/private clouds, edge computing platforms, infrastructure
Device-to-device authentication
Secure data protection
Secure commissioning support
Secure CL/MIFARE/Wi-Fi interactions
Device ID for blockchain
Secure key storage
Secure provisioning of credentials
Ecosystem protection

Qi 1.3 wireless charging authentication
Matter protocol
Device onboarding via NFC

1.2 SE051 target applications

Smart Industry
Smart Home
Smart Cities
Smart Supply Chains a a a - 0 3 7 4 7 9 H O S T M C U / M P U P L U G A N D T R U S T M W I 2 C S D A S C L N F C D E V I C E R E A D E R S E N S O R/ C L K R S T I O 2 : S C L I O : S D A L BL AS D AS C L S E 0 5 1 I o T A P P L E T S E M S L it e A p p le t P E R S O A p p le t J C O P O S 1 4 4 4 3 1 4 4 4 3 7 8 1 6 I 2 C target S W I 2 C controller I 2 C ACTUATOR

Figure 1. SE051 solution block diagram providing a wireless interface to an external device like a smartphone.

1.3 SE051 naming convention

The following table explains the naming conventions of the commercial product name of the SE051 platform. Every SE051 product gets assigned a commercial name, which includes application specific data. The SE051 commercial names have the following format. All letters are explained in Table 1 . Table 1. SE051 commercial name format SE051 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.

Table 1. SE051 commercial name format...continued

2 Features and benefits

2.1 Key benefits

Plug & Trust for fast and easy design with complete product support package
Updatability for feature upgrades and security maintenance in the field
Easy integration with different MCU & MPU platforms and OSs (Linux, RTOS, Windows, Android, etc.)
Turnkey solution ideal for system-level security without the need to write security code
Secure credential injection for root of trust at IC level
Secure, zero-touch connectivity to public & private clouds
Real end-to-end security, from sensor to cloud
Ready-to-use example code for each of the key use cases

2.2 Key features

this document the superset is described.

SE051A/C includes pre-installed IoT applet for fast deployment
SE051P supports proprietary applet development for custom products
SE051W for secure UWB ranging comes with related applets and the IoT applet pre-installed
SE051H for Matter comes with an extended IoT applet and T4T applet pre-installed The SE051 operates fully autonomously based on an integrated Javacard operating system and applets. Direct memory access is possible by the fixed functionalities of the NXP IoT applet only. With that, the content from the memory is fully isolated from the host system.
Built on NXP Integral Security Architecture 3.0
CC EAL 6+ certified HW and OS as environment to run NXP IoT applications, supporting fully encrypted communications and secured lifecycle management
Suitable for industrial IoT use cases with IEC62443-4-2 certified for the applicable requirements and product development lifecycle is compliant to IEC62443-4-1 certified secure process with maturity level 3
Effective protection against advanced attacks, including Power Analysis and Fault Attacks of various kinds
Multiple logical and physical protection layers, including metal shielding, end-to-end encryption, memory encryption, tamper detection
Applet updatability feature for multicast applet updates or upgrades and additional applet loading in the field (see [8])
Support for secure UWB ranging in combination with Trimension products (FIRA compliant)
Matter Ready: SE051 provides the necessary cryptographic functions to support the upcoming Matter standard for connecting smart home devices. SE051 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved. Product data sheet Rev. 2.0 — 8 July 2024 Document feedback 577320 3 / 32

Plug & Trust Secure Element

Support for RSA and ECC asymmetric cryptography algorithms, future proof curves and high key length, e.g. Brainpool, Edwards and Montgomery curves
Support for AES and DES symmetric cryptographic algorithms for encryption and decryption
Support for AES Modes:CBC, EBC, CTR, GCM, CCM
HMAC, CMAC, GMAC, SHA-1, SHA-224/256/384/512 operations
Various options for key derivation functions, including HKDF, MIFARE KDF, PRF (TLS-PSK)
Optional extended temperature range for industrial applications (-40 °C to 105 °C)
SPAKE2+ Password Authenticated Key Exchange algorithm
Small footprint HX2QFN20 package (3 mm x 3 mm)
Standard physical interface I2C target (High-speed mode, 3.4 Mbit/s), I2C controller (Fast mode, 400 kbit/s). Both can be active at the same time
Dedicated ISO14443-A passive contactless wireless interface for IoT use cases simplifying configuration set- up, maintenance in the field and late stage configuration
Secured user flash memory ranging from 45 kB full featured up to 101 kB for secure data or key storage
Support for SCP03 protocol (bus encryption and encrypted credential injection) to securely bind the host with the secure element
TRNG compliant to NIST SP800-90B
DRBG compliant to NIST SP800-90A
Support for applet level secure messaging channels to allow end-to-end encrypted communication in multi- tenant ecosystems
Support for automatic detection of the I2C T=1 protocol implementation based on the initial message prologue. Supported protocols: – NXP SE05x T=1 Over I2C Specification. See [1]. – APDU Transport over SPI/I2C v1.0 | GPC_SPE_172. See [6].
SESIP Level 3 (with Applet version 6.x.x) certified with full physical attack resistance for the NXP IoT applications and secure lifecycle management SE051 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved. Product data sheet Rev. 2.0 — 8 July 2024 Document feedback 577320 4 / 32

3 Functional description

3.1 Functional diagram

Figure 2. SE051 functional diagram - example Open SSL including complete source code on the SE051 website. file operations such as write, read, delete and update. SE051 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.

Plug & Trust Secure Element

3.2 IoT Applet Functionality

3.2.1 Supported secure object types

A secure object is an entry in the file system of SE051. Each secure object has certain features and capabilities. The following secure object types are available (for more details on the objects refer to [3]:

Symmetric Key (AES, 3DES)
ECC Key
RSA Key
HMAC Key
Binary File
User ID
Counter
Hash-Extend register

3.2.2 Access control

Each secure object can be linked to object specific access control policies. An access control policy associates a user identified by an authentication with a set of privileges such as read, write, allowed cryptographic operations and more. For details refer to [3]. To scale the functionality into a broad range of ecosystems, a set of different authentication options is provided:

User-ID based authentication
Symmetric key based authentication with secure messaging
Asymmetric key based authentication with secure messaging At creation of a secure object, an optional set of policies is associated with that secure object. Each policy assigns a set of allowed operations on that object to an authentication object.

3.2.3 Locking the Device Configuration

The creation of new secure objects as well as the deletion or modification of existing secure objects can be controlled via a credential.

3.2.4 Sessions and multi-threading

The SE051 IoT applet is prepared for ecosystems where multi-threading and multi-tenant use cases are needed on APDU level. To enable that, the applet supports 2 simultaneous sessions that can span full secure messaging sessions, self-authenticated APDUs for tenants not requiring long-lasting sessions and on top one default session for single tenant use cases .

3.2.5 Attestation and trust provisioning

SE051 applet comes with a set of trust provisioned root credentials allowing the owner of the device to securely attest all generated secure keys. Next to that, a customer has the possibility to define own attestation keys. Attestation certificates signed by an attestation CA are included in certain SE051 configurations as documented in [4]. SE051 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved. Product data sheet Rev. 2.0 — 8 July 2024 Document feedback 577320 6 / 32

Plug & Trust Secure Element

3.2.6 Application support

For specific ecosystems, SE051 IoT applet has built-in crypto features to simplify the deployment of specific use cases such as

MIFARE SAM functionality
Wi-Fi password protection
ECC-Key and RSA-Key based cloud connectivity (TLS)
Secure Sensor readout using I2C controller
Remote attestation and trust provisioning
Platform Configuration Registers

3.2.7 Random number generator

The SE051 IoT Applet provides random numbers using an AIS20 compliant pseudo random number generator (PRNG) with class DRG.4 generator initialized by a TRNG compliant to AIS31 class PTG.2. The PRNG is implemented according to NIST SP800-90Arev1. DRG.3 functionality is a subset of DRG.4, therefore the TOE is also compliant to DRG.3.

3.2.8 Credential Storage & Memory

Within SE051, all credentials and secure objects are stored inside a dynamic file structure. At creation, a user has to associate a file identifier with the object created. This identifier is then used in subsequent operations to access the object. The number of objects that can be allocated is only limited by the available memory in the system. After usage, objects can be deleted and the associated memory is freed up again. There is also the possibility to create transient objects. Transient objects have an object descriptor stored in non-volatile memory, but the object content is stored in RAM. Together with the import/export functionality of SE051, transient objects can be used securely store secret keys in a remote memory system.

3.3 PERSO applet

The NXP Perso applet provides the possibility to reconfigure SE051 devices. The configuration options include communication parameter settings of I2C, ISO14443 and ISO7816 interface as well as the deletion of unused operating system (cryptography) modules in order to gain additional credential memory. Please refer to [6] for details.

3.4 SEMS Lite

SEMS Lite is a capability built in SE051. NXP may issue security updates at its discretion. OEMs can leverage SEMS to deploy these applet updates in the field, after having fully assessed impact, as well as tested and validated the update on their product. Security upgrades including an upgrade of functionality of SE051 are subject to commercial agreements with NXP on a case by case basis and are only available on specific SE051 variants.

3.5 Applet Updatability

The Applet Updatability feature is introduced with SE051 enabled by the SEMS-Lite feature and provides upgrade functionality of applets whilst preserving on device credentials. This can be used for security maintenance in the field by enabling applet updates with additional security features or bug fixes. This feature can also be used to upload additional applets in the field. See [8]. On the P Product Configuration, this feature is leveraged to allow customer applet development on the SE051. SE051 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved. Product data sheet Rev. 2.0 — 8 July 2024 Document feedback 577320 7 / 32

Plug & Trust Secure Element

3.6 Secure UWB ranging

EdgeLock SE051W is a ready-to-use IoT secure element securing ultra wide band (UWB) connections. Secure UWB use cases, for example, are physical or logical access or indoor localization. Applications can be found in Smart Home like Secure UWB Door Locks, Secure UWB Login to computing or gaming devices or in the industrial IoT. SE051W is based on a SE051 product with the feature set listed in [4]. In addition, there is SUS and FiRa available for secure ranging. For more information, see [4].

3.7 Matter

EdgeLock SE051H is a ready-to-use IoT secure element optimized for the Matter protocol for smart home and for device commissioning via NFC. EdgeLock SE051H is based on a SE051 product with the feature set listed in [4]. In addition, EdgeLock SE051H includes the T4T Applet for implementing type-4 tag capability within the secure element, see [10]. For more information, see [4].

3.8 Ease of use configuration

SE051 variants with pre-provisioned credentials for ease of use are available and can be used during development phase or in the field. With this customers have all keys pre-injected in SE051 that are required for the main use cases as e.g. cloud onboarding. For more information, see: [4]

3.9 Startup behaviour

If a supply voltage is applied to pins Vin, VCC within the specified supply voltage operating range or a RF field according to ISO/IEC 14443 is applied to antenna pins LA, LB the IC boots up. During boot the IC checks for active interface according list below (in the order of the list):

ISO7816: If interface available for this product type, check CLK to be toggling, then wait for RST to be high
ISO14443: If interface available for this product type, check of RF field on LA, LB antenna pins
I2C: If interface available for this product type, check if both I2C_SDA, I2C_SCL pins are at high level (internal weak pull-up active) The chosen interface is the only interface the SE051 will receive commands for processing. To select a different interface the IC needs to be reset. SE051 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved. Product data sheet Rev. 2.0 — 8 July 2024 Document feedback 577320 8 / 32

4 Communication interfaces

4.1 I2C Interfaces

The SE051 has one I2C interface supporting target and one I2C interface supporting controller mode. Mode (HS). The I2C interface is using the Smartcard T=1 over I2C protocol. The default target address of the SE051 is configured to 0x48. Figure 3. target address read. This interface features a maximum SCL clock rate of 400 kHz. I2C controller can only be used when the I2C target interface is active.

4.1.1 Supported I2C frequencies

when clock stretching is enabled. In case clock stretching is disabled the maximum supported SCL clock frequency is 1.0 MHz. The SE051 I2C controller interface supports maximum 400 kHz SCL clock frequency.

4.1.2 Default I2C Communication Parameters

The used I2C protocol is detected automatically on the first received frame amongst the two possible protocols: – NXP SE05x T=1 Over I2C Specification. See [1]. – APDU Transport over SPI/I2C v1.0 | GPC_SPE_172. See [5].
Clock Stretching is disabled, which allows SCL frequencies up to 1 MHz
Manual and automatic method of entering of the Power-down mode is disabled by default. In order to change the I2C settings of the device the PERSO applet can be used. The installed applets of every product variant are defined in the SE051 config sheet.[4]

4.2 ISO7816 and ISO14443 Interface

T=CL is used. The supported resonance input capacitance is 56 pF. 1 ISO7816 is not enabled in generic SE051 configurations (see [4], AN12973) but available on customer request. SE051 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.

Plug & Trust Secure Element The RST_N pin can only be used as external reset source if the ISO7816 interface is enabled. If only the I2C interface is enabled, the RST_N pad has no effect. If the SE051 is kept in reset state the current consumption is as defined for idle, see Table 11. SE051 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved. Product data sheet Rev. 2.0 — 8 July 2024 Document feedback 577320 10 / 32

5 Power-saving modes

Power-down mode (with state retention).
Deep Power-down mode (no state retention).

Availability requires VCC pin to be supplied like described in Section 5.2.

5.1 Power-down mode

All internal clocks are frozen
CPU enters power-saving mode with program execution being stopped
CPU registers keep their contents
RAM keeps its contents Power-down mode is entered via the command; "End of APDU session request" (according to [1]) respectively "RELEASE request" (according to GP T=1oI2C [5]). In Power-down mode, all internal clocks are frozen. The IOs hold the logical states they had at the time Power-down mode was activated. To exit from the Power-down mode an external interrupt edge must be triggered by a falling edge on I2C_SDA2.

5.2 Deep Power-down mode

(ENA) to a logic zero level. To leave the Deep Power-down mode pad ENA has to be pulled up to to a logic „1" level. supplied by pin Vout, as described in [7].

6 Ordering information

935445154472 SE051H2HQ1/Z0112 SE051H2 SE051H2HQ1/Z0112Z

935414457472 SE051C2HQ1/Z01XD SE051C2 SE051C2HQ1/Z01XDZ

935414458472 SE051A2HQ1/Z01XE SE051A2 SE051A2HQ1/Z01XEZ

935428464472 SE051W2HQ1/Z019T SE051W2 SE051W2HQ1/Z019TZ

935409596472 SE051P2HQ1/Z011A SE051P2 SE051P2HQ1/Z011AZ

7 Pinning information

7.1 Pinning

7.1.1 Pinning HX2QFN20

Figure 4. Pin configuration for HX2QFN20 (SOT1969-1) I2C_SDA 9 I2C target data, if not used n.c. I2C_SCL 10 I2C target clock, if not used n.c. Table 3. Pin description HX2QFN20 SE051 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.

Power-down mode is used. n.c. if not used. Table 3. Pin description HX2QFN20...continued

8 Package

SE051 is offered in HX2QFN20 package. The dimensions are 3 mm x 3 mm x 0,32 mm with a 0,4 mm pitch. Please refer to the package data sheet [2], SOT1969-1.

9 Marking

Table 4. Marking codes

10 Packing information

10.1 Reel packing

for I2C are in accordance with the NXP I2C specification (see [1]).

12 Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to VSS (ground = 0 V). Table 6. Limiting values supply voltages above 3.6 V, Deep Power-down mode current <5 µA is not guaranteed. [2] MIL Standard 883-D method 3015; human body model; C = 100 pF, R = 1.5 kΩ; Tamb = -40 °C to 105 °C. [3] JESD22-C101, JEDEC Standard Field induced charge device model test method. [4] Depending on appropriate thermal resistance of the package. SE051 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.

13 Recommended operating conditions

The SE051 is characterized by its specified operating supply voltage range of 1.62 V to 3.6 V. Table 7. Recommended operating conditions [1] Maximum supported supply voltage is 6 V. In case of supply voltages above 3.6 V, Deep Power-down mode current <5 µA is not guaranteed. [3] The field strength is valid for an Class 1 antennas. [4] All product properties and values specified within this data sheet are only valid within the operating ambient temperature range. Figure 5. Characteristic supply voltage operating range SE051 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.

14 Characteristics

14.1 Thermal Characteristics

Table 8. Thermal characteristics

14.2 DC characteristics

respect to the ground contact pad VSS. All currents flowing into the device are considered positive.

14.2.1 General and General Purpose I/O interface

0.3 VCC < Vin ≤ VCC; Test conditions for

0 V ≤ Vin ≤ VCC; Test conditions for the

Table 9. Electrical DC characteristics of Input/Output: IO1/IO2. Conditions: VCC = 1.62 V to 3.6 V (see ; VSS = 0 V; SE051 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.

input voltage VI is approximately 0.5 VCC. Current IIL is tested at input voltage VI= 0.3 V. [2] External pull-up resistor 20 kΩ to VCC assumed. The worst case test condition for parameter VOH is present at minimum VCC. Figure 6. Input characteristic of RST_N SE051 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.

0 V VILmax VIHmin

Figure 7. Input characteristic of IO1/IO2 Figure 8. Input characteristic of CLK when the IC is not in reset Figure 9. Input characteristic of CLK during IC reset SE051 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.

14.2.2 I2C Interface

SCL, SDA pads are in open-drain mode. Table 10. Electrical DC characteristics of I2C pads SDA, SCL. Conditions: VCC, Vin = 1.62 V to 3.6 V; VSS = 0 V; Tamb

14.2.3 Power consumption

Table 11. Electrical characteristics of IC supply voltage VCC; VSS = 0 V; Tamb = -40 °C to 105 °C

14.3 AC characteristics

Conditions: VCC = 1.62 V to 3.6 V; VSS = 0 V; Tamb = -40 °C to 105 °C, unless otherwise specified. Table 12. Non-volatile memory timing characteristics SE051 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.

Plug & Trust Secure Element Conditions: VCC = 1.62 V to 3.6 V; VSS = 0 V; Tamb = -40 °C to 105 °C, unless otherwise specified. Symbol Parameter Conditions Min Typ[1] Max Unit NEEC FLASH endurance (maximum number of programming cycles applied to the whole memory block, performed by NXP static and dynamic wear leveling algorithm) 20 × 106 100 × 106 - cycles Table 12. Non-volatile memory timing characteristics...continued [1] Typical values are only referenced for information. They are subject to change without notice. [2] Given value specifies physical access times of FLASH memory only. SCL, SDA pads in open-drain mode.

applications

tCLKW, Tamb and VCC in their specified limits - - 3.4 MHz tPD Power down duration time (I2C wake-up) CPU clock = 48 MHz [3] - 67 - µs tWKPD Wake-up from power down duration time (I2C wake-up) CPU clock = 48 MHz [4] - 97 - µs CPIN Pin capacitances RST_N, I2C_SDA, /I2C_SCL Test frequency = 1 MHz; Tamb = 25 °C - - 10.5 pF tENalt ENA low time and Vout, VCC low time for entering deep power down mode [5] - 2 - µs Ron Resistance of power switch Tamb = 105 °C, Iload = 25 mA, Vin = 1.62 V - - 1.1 Ω Iout maximum current driving capability of pin Vout Tamb = 105 °C - - 25 mA Inputs: RST_N (active only if ISO7816 UART interface is enabled) tRW Reset pulse width (RST_N low) without entering Power-down mode 40 - 400 μs tRDSLP Reset pulse width (RST_N low) to enter Power-down mode 500 - - μs tWKP Wake-up time from Power-down mode fCLKmin < fCLK < fCLKmax - 8 10 µs level triggered ext.int. - 8 10 μstWKPIO Pad LOW time for wake-up from Power-down mode edge triggered ext.int. - 8 10 µs tWKPRST RST_N LOW time for wake-up from Power-down mode 40 - - µs Table 13. Electrical AC characteristics of I2C_SDA, I2C_SCL, and RST_N[1]; VCC = 1.8 V ± 10 % or 3 V ± 10 % V; SE051 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.

Plug & Trust Secure Element SCL, SDA pads in open-drain mode. Symbol Parameter Conditions Min Typ Max Unit CPIN Pin capacitances RST_N, I2C_SDA, /I2C_SCL Test frequency = 1 MHz; Tamb = 25 °C - - 10.5 pF [1] All appropriately marked values are typical values and only referenced for information. They are subject to change without notice. [2] tr is defined as rise time between 30 % and 70 % of the signal amplitude. tf is defined as fall time between 70 % and 30 % of the signal amplitude.

An empty I2C write frame is sent
A valid (non-empty) I2C write is sent while SE051 transitions into power down mode [4] Wakeup from power down: if clock stretching disabled and I2C_SCL=1 MHz; the wakeup time will not be sufficient to receive the first host command; the SE will send an R block to request retransmission from the host [5] Low glitches below 0.4 V on pin ENA and Vin, Vout, VCC larger than 30 ns cause Power-On-Reset, respectively entering deep power-down mode. aaa-037451 70 % level Vhigh tCLKW CLK (et al) Vlow

0.5 VDD

V to VCC for a HIGH input level. Clock period and signal pulse (duty cycle) timing is measured at 50 % of VCC. Figure 10. External clock drive and AC test timing reference points of I2C_SDA, I2C_SCL, and RST_N (see 1) and 2)) values are only referenced for information. They are subject to change without notice. tCLKW, tamb and VCC in their specified limits [5] 0.85 - 11.5 MHz Table 14. Electrical AC characteristics of IO1, IO2, CLK and RST_N (ISO7816 interface) SE051 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.

values are only referenced for information. They are subject to change without notice. Table 14. Electrical AC characteristics of IO1, IO2, CLK and RST_N (ISO7816 interface)...continued minimum etu duration of 16 CLK cycles at a maximum CLK frequency of 5 MHz (TA1=0x96, (Fi/Di)=(512/32)), for example. [2] tr is defined as rise time between 10 % and 90 % of the signal amplitude. max, matching the (Fi/Di)=(512/64) speed enhancement requirements of ETSI TS 102 221. max, matching the (Fi/Di)=(512/64) speed enhancement requirements of ETSI TS 102 221. yields the allowed limits of 0.85 MHz and 11.5 MHz. [6] During AC testing the inputs CLK, RST_N, and IO1 are driven at 0 V to +0.3 V for a LOW input level and at VCC − 0.3 V to VCC for a HIGH input level. Clock period and signal pulse (duty cycle) timing is measured at 50 % of VCC, see Figure 18. [7] The ETSI TS102 221/GSM 11.1x specifications specify a maximum reset signal (RST_N) rise time and fall time of 400,000 μs, respectively. Note: tf is defined as fall time between 90 % and 10 % of the signal amplitude. Table 15. Electrical AC characteristics of LA, LB; Conditions: Tamb = -40 °C to 105 °C, unless otherwise [1] Typical values (± 10 %) are only referenced for information. They are subject to change without notice. [2] The CLALB and RLALB values stated here assume a parallel RC equivalent circuit for the chip. [3] The value stated here was measured at estimated start of chip operation and is comparable to the values stated in other family member data sheets. [4] Measured with sine wave at LA, LB. [5] Parameter is valid in contactless ISO14443 compliant operation valid only. SE051 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved.

14.4 I2C Bus Timings

Parameters defined in this chapter replace the parameter definitions of I2C bus, for specification see [9]. Figure 11. I2C Bus Timings Table 16. I2C Bus Timing Specification

14.5 EMC/EMI

15 Abbreviations

Plug & Trust Secure Element

16 References

[1] NXP SE05x T=1 Over I2C Specification User Manual, document number 11225. Available on NXP website [2] SOT1969-1; HX2QFN20; Reel packing and package data sheet. Available on NXP website. [3] SE051 IoT Applet APDU Specification, document number AN 12543. Available on NXP website. [4] SE051 configurations Application Note, document number AN12973. Available on NXP website. [5] APDU Transport over SPI/I2C v1.0 | GPC_SPE_172. Available Globalplatform. [6] How to use EdgeLock SE051 PERSO applet, SE051 Application Note AN13015. Document number in Secure files 7808xx (xx is the version number) [7] SE051 - User Guidelines Application Note, document number AN12730. Available on NXP website. [8] Secure update of EdgeLock SE051 IoT applet, document number AN12907. Available on NXP website. [9] I2C-bus specification and user manual, document number UM10204. Available on NXP website. [10] Enable Matter in smart home solutions using EdgeLock SE05x/A5000, document number AN13445. SE051 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved. Product data sheet Rev. 2.0 — 8 July 2024 Document feedback 577320 26 / 32

Updated Section 5 Corrected default power down mode setting
updated the legal information SE051 v.1.9 18 october 2023 Product data sheet SE051 v.1.8 Modifications • Adjusted the timing value in Table 12 the value of the erase time and program time where switched around
Corrected the layout of some tables
Corrected the notation of some symbols, and added a space where mandatory
updated the legal information SE051 v.1.8 18 January 2023 Product data sheet SE051 v.1.7 Modifications • Update Section 1
Update Section 3.7
Update Section 9 SE051 v.1.7 22 November 2022 Product data sheet SE051 v.1.6 Modifications • Update Section 9
Section 6 SE051 v.1.6 27 October 2022 Product data sheet SE051 v.1.5 Modifications • Update Section 3.2.7 SE051 v.1.5 08 June 2022 Product data sheet SE051 v.1.4 Modifications • Update Section 1
Update Section 2.2 SE051 v.1.4 28 March 2022 Product data sheet SE051 v.1.3 Modifications • Update Figure 2
Add Section 3.6
Update references in whole document
Update Section 6
Update Section 2.2 SE051 v.1.3 02 January 2022 Product data sheet SE051 v.1.2 Modifications • Updated Section 2.2
Updated Features in detail
Updated Section 3.2.7
Updated Section 6
Updated Section 14.3
Updated Section 1
Updated Figure 2 Updates for intermediate update on 210415
Updated Section 2.2
Moved technical information on secure objects in Section 3.2.1 to the APDU specification [3]
Replace "master/slave" by "controller/target"
Update Figure 1

Updated legal disclaimer and references
Figure 2 SE051 v.1.1 17 January 2011 Product data sheet SE051 v.1.0 Modifications Corrected Table 1 SE051 v.1.0 08 February 2010 Objective data sheet - Modifications Initial version

Plug & Trust Secure Element Legal information Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL https://www.nxp.com. Definitions Draft — A draft status on a document indicates that the content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included in a draft version of a document and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at https://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. SE051 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved. Product data sheet Rev. 2.0 — 8 July 2024 Document feedback 577320 29 / 32

Plug & Trust Secure Element Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Suitability for use in non-automotive qualified products — Unless this document expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document, including the legal information in that document, is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Security — Customer understands that all NXP products may be subject to unidentified vulnerabilities or may support established security standards or specifications with known limitations. Customer is responsible for the design and operation of its applications and products throughout their lifecycles to reduce the effect of these vulnerabilities on customer’s applications and products. Customer’s responsibility also extends to other open and/or proprietary technologies supported by NXP products for use in customer’s applications. NXP accepts no liability for any vulnerability. Customer should regularly check security updates from NXP and follow up appropriately. Customer shall select products with security features that best meet rules, regulations, and standards of the intended application and make the ultimate design decisions regarding its products and is solely responsible for compliance with all legal, regulatory, and security related requirements concerning its products, regardless of any information or support that may be provided by NXP. NXP has a Product Security Incident Response Team (PSIRT) (reachable at PSIRT@nxp.com) that manages the investigation, reporting, and solution release to security vulnerabilities of NXP products. NXP B.V. — NXP B.V. is not an operating company and it does not distribute or sell products. Trademarks Notice: All referenced brands, product names, service names, and trademarks are the property of their respective owners. NXP — wordmark and logo are trademarks of NXP B.V. EdgeLock — is a trademark of NXP B.V. I2C-bus — logo is a trademark of NXP B.V. JCOP — is a trademark of NXP B.V. MIFARE — is a trademark of NXP B.V. SE051 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved. Product data sheet Rev. 2.0 — 8 July 2024 Document feedback 577320 30 / 32

Plug & Trust Secure Element Tables Tab. 9. Electrical DC characteristics of Input/ Output: IO1/IO2. Conditions: VCC = 1.62 V to 3.6 V (see ; VSS = 0 V; Tamb = -40 °C to Tab. 10. Electrical DC characteristics of I2C pads SDA, SCL. Conditions: VCC, Vin = 1.62 V to 3.6 V; VSS = 0 V; Tamb = -40 °C to 105 Tab. 11. Electrical characteristics of IC supply voltage VCC; VSS = 0 V; Tamb = -40 °C to Tab. 13. Electrical AC characteristics of I2C_SDA, I2C_SCL, and RST_N; VCC = 1.8 V ± 10 % or 3 V ± 10 % V; VSS = 0 V; Tamb = -40 Tab. 14. Electrical AC characteristics of IO1, IO2, Tab. 15. Electrical AC characteristics of LA, LB; Conditions: Tamb = -40 °C to 105 °C, Figures Fig. 2. SE051 functional diagram - example Open Fig. 4. Pin configuration for HX2QFN20 Fig. 5. Characteristic supply voltage operating Fig. 8. Input characteristic of CLK when the IC is Fig. 10. External clock drive and AC test timing reference points of I2C_SDA, I2C_SCL, and RST_N (see 1) and 2)) in open-drain SE051 All information provided in this document is subject to legal disclaimers. © 2024 NXP B.V. All rights reserved. Product data sheet Rev. 2.0 — 8 July 2024 Document feedback 577320 31 / 32

Product Information

SE051A2HQ1/Z01XEZ specifications and overview.

Summary

Plug & Trust Secure Element Rev. 2.0 8 July 2024

Description

Plug & Trust Secure Element Rev. 2.0 8 July 2024

Source title SE051A2HQ1/Z01XEZ Datasheet(PDF) - NXP Semiconductors

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