DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 13

Technical content

Features

  • Simplifies Circuit Design
  • Reduces Board Space
  • Reduces Component Count
  • The SC−75/SOT−416 Package Can be Soldered Using Wave or Reflow
  • The Modified Gull−Winged Leads Absorb Thermal Stress During Soldering Eliminating the Possibility of Damage to the Die
  • Pb−Free Packages are Available
  • S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable MAXIMUM RATINGS (TA = 25°C unless otherwise noted) Rating Symbol Value Unit Collector-Base Voltage VCBO 50 Vdc Collector-Emitter Voltage VCEO 50 Vdc Collector Current IC 100 mAdc THERMAL CHARACTERISTICS Rating Symbol Value Unit Total Device Dissipation, FR−4 Board (Note 1) @ TA = 25°C Derate above 25°C PD 200 1.6 mW mW/°C Thermal Resistance, Junction−to−Ambient (Note 1) R/C0113JA 600 °C/W Total Device Dissipation, FR−4 Board (Note 2) @ TA = 25°C Derate above 25°C PD 300 2.4 mW mW/°C Thermal Resistance, Junction−to−Ambient (Note 2) R/C0113JA 400 °C/W Junction and Storage Temperature Range TJ, Tstg −55 to +150 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. FR −4 @ Minimum Pad 2. FR −4 @ 1.0 × 1.0 Inch Pad NPN SILICON BIAS RESISTOR TRANSISTORS PIN 3 COLLECTOR (OUTPUT) PIN 2 EMITTER (GROUND) PIN 1 BASE (INPUT) See detailed ordering, marking, and shipping information in the package dimensions section on page 2 of this data sheet.

ORDERING INFORMATION

http://onsemi.com SC−75 (SOT−416) CASE 463 STYLE 1 MARKING DIAGRAM xx M /C0071 /C0071 xx = Specific Device Code xx = (Refer to page 2) M = Date Code* /C0071 =P b −Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location.

DTC114EET1 Series, SDTC114EET1 Series http://onsemi.com ORDERING INFORMATION, DEVICE MARKING and RESISTOR VALUES Device Marking R1 (K) R2 (K) Package Shipping† DTC114EET1 8A 10 10 SC−75/SOT−416 3000 Tape & Reel DTC114EET1G SC−75/SOT−416 (Pb−Free)

3000 Tape & Reel

SC−75/SOT−416 3000 Tape & Reel DTC124EET1G SC−75/SOT−416 (Pb−Free) SC−75/SOT−416 3000 Tape & Reel DTC144EET1G SC−75/SOT−416 (Pb−Free) SC−75/SOT−416 3000 Tape & Reel DTC114YET1G SC−75/SOT−416 (Pb−Free) 94 10 ∞ SC−75/SOT−416 3000 Tape & Reel DTC114TET1G SC−75/SOT−416 (Pb−Free) 8F 4.7 ∞ SC−75/SOT−416 3000 Tape & Reel DTC143TET1G SC−75/SOT−416 (Pb−Free) 8H 2.2 2.2 SC−75/SOT−416 3000 Tape & Reel DTC123EET1G SC−75/SOT−416 (Pb−Free) 8J 4.7 4.7 SC−75/SOT−416 3000 Tape & Reel DTC143EET1G SC−75/SOT−416 (Pb−Free) 8K 4.7 47 SC−75/SOT−416 3000 Tape & Reel DTC143ZET1G SC−75/SOT−416 (Pb−Free) SC−75/SOT−416 3000 Tape & Reel DTC124XET1G SC−75/SOT−416 (Pb−Free) 8M 2.2 47 SC−75/SOT−416 3000 Tape & Reel DTC123JET1G SC−75/SOT−416 (Pb−Free) SC−75/SOT−416 3000 Tape & Reel DTC115EET1G SC−75/SOT−416 (Pb−Free) SC−75/SOT−416 3000 Tape & Reel DTC144WET1G SC−75/SOT−416 3000 Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.

DTC114EET1 Series, SDTC114EET1 Series http://onsemi.com ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICS Collector−Base Cutoff Current (VCB = 50 V, IE = 0) ICBO − − 100 nAdc Collector−Emitter Cutoff Current (VCE = 50 V, IB = 0) ICEO − − 500 nAdc Emitter−Base Cutoff Current DTC114EET1, SDTC114EET1 (VEB = 6.0 V, IC = 0) DTC124EET1, SDTC124EET1 DTC144EET1 DTC114YET1, SDTC114YET1 DTC114TET1 DTC143TET1 DTC123EET1 DTC143EET1 DTC143ZET1 DTC124XET1 DTC123JET1 DTC115EET1 DTC144WET1 IEBO − 0.5 0.2 0.1 0.2 0.9 1.9 2.3 1.5 0.18 0.13 0.2 0.05 0.13 mAdc Collector−Base Breakdown Voltage (IC = 10 /C0109A, IE = 0) V(BR)CBO 50 − − Vdc Collector−Emitter Breakdown Voltage (Note 3) (IC = 2.0 mA, IB = 0) V(BR)CEO 50 − − Vdc ON CHARACTERISTICS (Note 3) DC Current Gain DTC114EET1, SDTC114EET1 (VCE = 10 V, IC = 5.0 mA) DTC124EET1, SDTC124EET1 DTC144EET1 DTC114YET1, SDTC114YET1 DTC114TET1 DTC143TET1 DTC123EET1 DTC143EET1 DTC143ZET1 DTC124XET1 DTC123JET1 DTC115EET1 DTC144WET1 hFE 35 160 160 8.0 100 140 140 350 350 200 150 140 150 140 Collector−Emitter Saturation Voltage (IC = 10 mA, IB = 0.3 mA) (IC = 10 mA, IB = 5 mA) DTC123EET1 (IC = 10 mA, IB = 1 mA) DTC143TET1/DTC114TET1/ DTC143EET1/DTC143ZET1/DTC124XET1 VCE(sat) − − 0.25 Vdc Output Voltage (on) (VCC = 5.0 V, VB = 2.5 V, RL = 1.0 k/C0087) DTC114EET1, SDTC114EET1 DTC124EET1, SDTC124EET1 DTC114YET1, SDTC114YET1 DTC114TET1 DTC143TET1 DTC123EET1 DTC143EET1 DTC143ZET1 DTC124XET1 DTC123JET1 CC = 5.0 V, VB = 3.5 V, RL = 1.0 k/C0087) DTC144EET1 (VCC = 5.0 V, VB = 5.5 V, RL = 1.0 k/C0087) DTC115EET1 (VCC = 5.0 V, VB = 4.0 V, RL = 1.0 k/C0087) DTC144WET1 VOL 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 0.2 Vdc Output Voltage (off) (VCC = 5.0 V, VB = 0.5 V, RL = 1.0 k/C0087) (VCC = 5.0 V, VB = 0.25 V, RL = 1.0 k/C0087) DTC143TET1 DTC143ZET1 DTC114TET1 VOH 4.9 − − Vdc 3. Pulse Test: Pulse Width < 300 /C0109s, Duty Cycle < 2.0%

DTC114EET1 Series, SDTC114EET1 Series http://onsemi.com PACKAGE DIMENSIONS SC−75/SOT−416 CASE 463 ISSUE F STYLE 1: PIN 1. BASE 2. EMITTER 3. COLLECTOR NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. M0.20 (0.008) D −E− −D− b e 3 PL 0.20 (0.008) E C L A HE DIM MIN NOM MAX MILLIMETERS A 0.70 0.80 0.90 A1 0.00 0.05 0.10 b C 0.10 0.15 0.25 D 1.55 1.60 1.65 E e 1.00 BSC 0.027 0.031 0.035 0.000 0.002 0.004 0.004 0.006 0.010 0.059 0.063 0.067

0.04 BSC

L 0.10 0.15 0.20 1.50 1.60 1.70 0.004 0.006 0.008 0.061 0.063 0.065 0.787 0.031 0.508 0.020 1.000 0.039 /C0466mm inches/C0467SCALE 10:1 0.356 0.014 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* 1.803 0.071 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 DTC114EET1/D LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your loca l Sales Representative