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Technical content

Features

 7.5mm Width 4-Pin Small Outline Package  Creepage > 8mm  High Input-to-Output Isolation (5kV RMS MIN)  CTR Range: 50% - 600%  High Collector-Emitter Voltage (V CE = 70V MIN)  Long Life / High Reliability  RoHS / Pb-Free / REACH Compliant NOTES: Suffixes listed above are not included in marking on device for part number identification 2 3 4(+) Input (-) Input Emitter Collector SDT460

© 2013 Solid State Optronics • San José, CA Page 2 of 8 SDT460 /TR Rev 1.00 (05/17/2013) 001575 SDT460 DC Input 70V Wide Body Photo-Transistor Optocoupler Parameter Symbol Min. Typ. Max. Units Test Conditions Input Specifications LED Forward Voltage V F - 1.25 1.6 V I F = 50mA Terminal Capacitance C t - 50 - pF V=0, f=1MHz Reverse Current I R - - 10 A VR=4V Output Specifications Collector-Emitter Voltage V CEO 70 - - V IC=100A Emitter-Collector Voltage V COE 7 - - V IE=10A Collector Dark Current I CEO - 10 100 nA V CE=20V, IF=0mA Floating Capacitance C f - 0.3 - pF V=0, f=1MHz Cut-Off Frequency f C - 80 - kHz VCE=5V, IC=2mA, RL=100-3dB Saturation Voltage V CE(sat) - - 0.3 V I F=10mA, IC=1mA Coupled Specifications Rise Time T R - 3 18 S IC=2mA, VCC=5V, RL=100 Fall Time T F - 4 18 S IC=2mA, VCC=5V, RL=100 Current Transfer Ratio (Open Bin / No Suffix) CTR 50 - 600 % I F=5mA, VCE=5V (-A Binning) CTR 63 - 125 % I F=10mA, VCE=5V (-B Binning) CTR 100 - 200 % I F=10mA, VCE=5V (-C Binning) CTR 50 - 150 % I F=5mA, VCE=5V (-D Binning) CTR 100 - 300 % I F=5mA, VCE=5V (-E Binning) CTR 80 - 160 % I F=5mA, VCE=5V (-F Binning) CTR 130 - 260 % I F=5mA, VCE=5V (-G Binning) CTR 200 - 400 % I F=5mA, VCE=5V Isolation Specifications Isolation Voltage V ISO 5000 - - V RMS RH ≤ 50%, t=1min Input-Output Resistance R I-O - 10 -  VI-O = 500VDC Electrical Characteristics, TA = 25°C (unless otherwise specified) Test Circuit: Response Time Test Circuit: Frequency Response

© 2013 Solid State Optronics • San José, CA Page 5 of 8 SDT460 /TR Rev 1.00 (05/17/2013) 001575 SDT460 DC Input 70V Wide Body Photo-Transistor Optocoupler Process Step Description Parameter A Preheat Start Temperature (ºC) 150ºC B Preheat Finish Temperature (ºC) 180ºC C Preheat Time (s) 90 - 120s D Melting Temperature (ºC) 230ºC E Time above Melting Temperature (s) 30s F Peak Temperature, at Terminal (ºC) 260ºC G Dwell Time at Peak Temperature (s) 10s H Cool-down (ºC/s) <6ºC/s SDT460 Solder Reflow Temperature Profile Recommendations (1) Infrared Reflow: Refer to the following figure as an example of an optimal temperature profile for single occurrence infrared reflow. Soldering process should not exceed temperature or time limits expressed herein. Su rface temperature of device package should not exceed 250ºC: A B C D F E G H (2) Wave Solder: (3) Hand Solder: Maximum Temperature: 260ºC (at terminal) Maximum Time: 10s Pre-heating: 100 - 150ºC (30 - 90s) Single Occurrence Maximum Temperature: 350ºC (at tip of soldering iron) Maximum Time: 3s Single Occurrence

© 2013 Solid State Optronics • San José, CA Page 6 of 8 SDT460 /TR Rev 1.00 (05/17/2013) 001575 SDT460 DC Input 70V Wide Body Photo-Transistor Optocoupler

4 PIN SOP (WIDE) Package Note:

All dimensions in millimeters [mm]

4 PIN SOP (WIDE) Footprint

© 2013 Solid State Optronics • San José, CA Page 7 of 8 SDT460 /TR Rev 1.00 (05/17/2013) 001575 SDT460 DC Input 70V Wide Body Photo-Transistor Optocoupler SDT460 Packaging Specifications Tape & Reel Specifications (T&R) Note: All dimensions in millimeters [mm] Specification Symbol Dimensions, mm ( inches ) Tape Width W 16  0.3 ( 0.63 ) Sprocket Hole Pitch P0 4  0.1 ( 0.15 ) Compartment Location F 2  0.1 ( 0.079 ) Compartment Pitch P1 8  0.1 ( 0.315 )

© 2013 Solid State Optronics • San José, CA Page 8 of 8 SDT460 /TR Rev 1.00 (05/17/2013) 001575 SDT460 DC Input 70V Wide Body Photo-Transistor Optocoupler Solid State Optronics (SSO) makes no warranties or representations with regards to the completeness and accuracy of this document. SSO reserves the right to make changes to product description, specifications at any time without further notices. SSO shall not assume any liability arising out of the application or use of any product or circuit described herein. Neither circuit patent licenses nor indemnity are expressed or implied. Except as specified in SSO’s Standard Terms & Conditions, SSO disclaims liability for consequential or other damage, and we make no other warranty, expressed or implied, including merchantability and fitness for particular use. DISCLAIMER SSO does not authorize use of its devices in life support applications wherein failure or malfunction of a device may lead to personal injury or death. Users of SSO devices in life support applications assume all risks of such use and agree to indemnify SSO against any and all damages resulting from such use. Life support devices are defined as devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when used properly in accordance with instructions for use can be reasonably expected to result in significant injury to the user, or (d) a critical component of a life support device or system whose failure can be reasonably expected to cause failure of the life support device or system, or to affect its safety or effectiveness. LIFE SUPPORT POLICY SDT460 YWW Date Code Pin 1 BIN Marking X