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TTL Compatible High Bit Rate: 10MBd High CMR Performance (15kV/ S) High Isolation Voltage (5000V RMS) High Common Mode Interference Immunity RoHS / Pb-Free / REACH Compliant ** A 0.1μF bypass Capacitor must be connected between pins 5 & 8 (GND & VCC) Truth Table (Positive Logic) LED ENABLE OUTPUT ON H L OFF H H ON L H OFF L H ON NC L OFF NC H
8 VCC
© 2012 Solid State Optronics • San José, CA Page # 2 SDN137/H/S/TR Rev 1.10 (08/09/2012) 001512 SDN137 Digital High Speed Optocoupler 10MBd, Logic Output Parameter Symbol Min. Typ. Max. Units Test Conditions Input Specifications Input Forward Voltage V F - 1.36 1.70 V IF = 10mA Input Forward Voltage Temp Coefficient VF/T - -1.5 - mV/°C IF = 10mA Input Reverse Voltage BV R 5 - - V IR = 10A Input Threshold Current I TH - 1.1 5 mA VE=2V, VCC=5.5V, IOL(sinking)=13mA Input Capacitance C IN - 34 - pF f=1MHz, VF=0V Output Specifications, VCC = 5V (unless otherwise specified) High Level Supply Current I CCH - 7.4 10 mA VE=0.5V, VCC=5.5V, IF=0mA Low Level Supply Current I CCL - 10 13 mA VE=0.5V, VCC=5.5V, IF=10mA High Level Enable Current I EH - -0.6 -1.6 mA VE=2V Low Level Enable Current I EL - -0.9 -1.6 mA VE=0.5V High Level Enable Voltage V EH 2 - - V Low Level Enable Voltage V EL - - 0.8 High Level Output Current I OH - - 100 A VE=2V, VCC=5.5V, VO=5.5V, IF=250A Low Level Output Voltage V OL - 0.28 0.60 V VE=2V, VCC=5.5V, IF=5mA IOL(sinking)=13mA Switching Specifications, VCC = 5V, IF=7.5mA (unless otherwise specified) Propagation Delay Time to Low Output Level tPHL 25 35 100 nS RL=350, CL=15pF Propagation Delay Time to High Output Level tPLH 25 45 100 nS RL=350, CL=15pF Pulse Width Distortion | t PLH - tPHL | - 10 35 nS RL=350, CL=15pF Propagation Delay Skew t PSK - 8 40 nS RL=350, CL=15pF Output Rise Time (10% - 90%) t r - 20 - nS RL=350, CL=15pF Output Fall Time (90% - 10%) t f - 8 - nS RL=350, CL=15pF Propagation Delay Time of enable from VEH to VEL tELH - 22 - nS RL=350, CL=15pF, VEL=0V, VEH=3V Propagation Delay Time of enable from VEL to VEH tEHL - 12 - nS RL=350, CL=15pF, VEL=0V, VEH=3V Logic High Common Mode Transient Immunity |CMH| 5,000 - - V/S |VCM|=20V, VCC=5V, IF=0mA, VO (MIN)=2V, RL=350 Logic Low Common Mode Transient Immunity |CML| 5,000 - - V/S |VCM|=20V, VCC=5V, IF=7.5mA, VO (MIN)=0V, RL=350 Electrical Characteristics, TA = 25°C (unless otherwise specified)
© 2012 Solid State Optronics • San José, CA Page # 3 SDN137/H/S/TR Rev 1.10 (08/09/2012) 001512 SDN137 Digital High Speed Optocoupler 10MBd, Logic Output Electrical Characteristics, continued… TA = 25°C (unless otherwise specified) Parameter Symbol Min. Typ. Max. Units Test Conditions Isolation Specifications Input-Output Insulation Leakage Current I I-O - - 1.0 μA 45% RH, t=5s, VI-O=3kV Withstand Insulation Test Voltage V ISO 5000 - - V RMS RH ≤ 50%, t=1min Input-Output Resistance R I-O - 10 - VI-O = 500VDC Input-Output Capacitance C I-O - 1.0 - pF f=1MHz Notes 1. A 0.1 F or bigger bypass capacitor for VCC is needed as shown in Figure 1 2. Peaking driving circuit may be used to speed up the LED. The peak drive current of LED may go up to 50mA and maximum pulse width 50ns, as long as average current doesn’t exceed 20mA. 3. t PLH (propagation delay) is measured from the 3.75 mA point on the falling edge of the input pulse to the 1.5 V point on the rising edge of the output pulse. 4. t PHL (propagation delay) is measured from the 3.75 mA point on the rising edge of the input pulse to the 1.5 V point on the falling edge of the output pulse. 5. The t ELH enable propagation delay is measured from the 1.5 V point on the falling edge of the enable input pulse to the 1.5 V point on the rising edge of the output pulse. 6. The t EHL enable propagation delay is measured from the 1.5 V point on the rising edge of the enable input pulse to the 1.5 V point on the falling edge of the output pulse. 7. CM H is the maximum tolerable rate of rise of the common mode voltage to assure that the output will remain in a high logic state ( i.e., VO > 2.0 V). 8. CM L is the maximum tolerable rate of fall of the common mode voltage to assure that the output will remain in a low logic state (i .e., VO < 0.8 V). 9. No external pull up is required for a high logic state on the enable input. If the enable pin is not used, tying it to VCC. 10. Device is considered a two-terminal device: pins 1, 2, 3, and 4 shorted together, and pins 5, 6, 7, and 8 shorted together. 11. In accordance with UL1577, each optocoupler is proof tested by applying an insulation test voltage 3000 V RMS for one second (leakage current less than 5 A). This test is performed before the 100% production test for partial discharge 12. In accordance with UL 1577, each optocoupler is proof tested by applying an insulation test voltage 6000 V RMS for one second (leakage current less than 5 A). This test is performed before the 100% production test for partial discharge Recommended Operating Conditions, TA = 25°C (unless otherwise specified) Parameter Symbol Min. Typ. Max. Units Test Conditions Operating Temperature °C -40 - 85 °C Supply Voltage V CC 4.5 - 5.5 V Low Level Input Current I FL 0 - 250 A High Level Input Current I FH 5 - 15 mA Low Level Enable Voltage V EL 0 - 0.8 V High Level Enable Voltage V EH 2 - V CC V Output Pull Up Resistor R L 330 - 4k Fan Out N - - 5 - RL = 1k
© 2012 Solid State Optronics • San José, CA Page # 7 SDN137/H/S/TR Rev 1.10 (08/09/2012) 001512 SDN137 Digital High Speed Optocoupler 10MBd, Logic Output Process Step Description Parameter A Preheat Start Temperature (ºC) 150ºC B Preheat Finish Temperature (ºC) 180ºC C Preheat Time (s) 90 - 120s D Melting Temperature (ºC) 230ºC E Time above Melting Temperature (s) 30s F Peak Temperature, at Terminal (ºC) 260ºC G Dwell Time at Peak Temperature (s) 10s H Cool-down (ºC/s) <6ºC/s SDN137 Solder Reflow Temperature Profile Recommendations (1) Infrared Reflow: Refer to the following figure as an example of an optimal temperature profile for single occurrence infrared reflow. Soldering process should not exceed temperature or time limits expressed herein. Su rface temperature of device package should not exceed 250ºC: A B C D F E G H (2) Wave Solder: (3) Hand Solder: Maximum Temperature: 260ºC (at terminal) Maximum Time: 10s Pre-heating: 100 - 150ºC (30 - 90s) Single Occurrence Maximum Temperature: 350ºC (at tip of soldering iron) Maximum Time: 3s Single Occurrence Figure 16
© 2012 Solid State Optronics • San José, CA Page # 8 SDN137/H/S/TR Rev 1.10 (08/09/2012) 001512 SDN137 Digital High Speed Optocoupler 10MBd, Logic Output All dimensions in millimeters [mm] with inches in parenthesis ()
© 2012 Solid State Optronics • San José, CA Page # 9 SDN137/H/S/TR Rev 1.10 (08/09/2012) 001512 SDN137 Digital High Speed Optocoupler 10MBd, Logic Output
8 PIN WIDE Lead Space Package (-H) Note:
All dimensions in millimeters [mm] with inches in parenthesis ()
© 2012 Solid State Optronics • San José, CA Page # 10 SDN137/H/S/TR Rev 1.10 (08/09/2012) 001512 SDN137 Digital High Speed Optocoupler 10MBd, Logic Output 8 PIN SMD Surface Mount Package (-S) Note: All dimensions in millimeters [mm] with inches in parenthesis ()
© 2012 Solid State Optronics • San José, CA Page # 11 SDN137/H/S/TR Rev 1.10 (08/09/2012) 001512 SDN137 Digital High Speed Optocoupler 10MBd, Logic Output SDN137 Packaging Specifications Tape & Reel Specifications (T&R) Note: All dimensions in millimeters [mm] with inches in parenthesis () Specification Symbol Dimensions, mm ( inches ) Tape Width W 16 0.3 ( 0.63 ) Sprocket Hole Pitch P0 4 0.1 ( 0.15 ) Compartment Location F 2 0.1 ( 0.079 ) Compartment Pitch P1 12 0.1 ( 0.472 )
© 2012 Solid State Optronics • San José, CA Page # 12 SDN137/H/S/TR Rev 1.10 (08/09/2012) 001512 SDN137 Digital High Speed Optocoupler 10MBd, Logic Output Solid State Optronics (SSO) makes no warranties or representations with regards to the completeness and accuracy of this document. SSO reserves the right to make changes to product description, specifications at any time without further notices. SSO shall not assume any liability arising out of the application or use of any product or circuit described herein. Neither circuit patent licenses nor indemnity are expressed or implied. Except as specified in SSO’s Standard Terms & Conditions, SSO disclaims liability for consequential or other damage, and we make no other warranty, expressed or implied, including merchantability and fitness for particular use. DISCLAIMER SSO does not authorize use of its devices in life support applications wherein failure or malfunction of a device may lead to personal injury or death. Users of SSO devices in life support applications assume all risks of such use and agree to indemnify SSO against any and all damages resulting from such use. Life support devices are defined as devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when used properly in accordance with instructions for use can be reasonably expected to result in significant injury to the user, or (d) a critical component of a life support device or system whose failure can be reasonably expected to cause failure of the life support device or system, or to affect its safety or effectiveness. LIFE SUPPORT POLICY