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Technical content
Features
TTL Compatible High Bit Rate: 1Mb/s Bandwidth: 2.0MHz Open Collector Output High Isolation Voltage (5000V RMS) High Common Mode Interference Immunity RoHS / Pb-Free / REACH Compliant Truth Table (Positive Logic) LED V O ON LOW OFF HIGH ** A 0.1μF bypass Capacitor must be connected between pins 5 & 8 (GND & VCC)
8 VCC
© 2012 Solid State Optronics • San José, CA Page # 2 SDN136/H/S/TR Rev 1.10 (08/09/2012) 001511 SDN136 Analog High Speed Optocoupler 1MBd, Photodiode with Transistor Output Parameter Symbol Min. Typ. Max. Units Test Conditions Input Specifications LED Forward Voltage V F - 1.4 1.7 V I F = 16mA LED Reverse Voltage BV R 5 - - V I R = 10μA Detector Specifications Current Transfer Ratio CTR 19 24 50 % I F=16mA, VCC=4.5V, VO=0.4V Logic Low Output Voltage V OL - 0.25 0.4 V I F=0mA, VO=VCC=4.5V, IO=3mA Logic High Output Current I OH - - 1 A IF=0mA, VO=VCC=5.5V Logic Low Supply Current I CCL - 400 - A IF=16mA, VO=OPEN (VCC=15V) Logic High Supply Current I CCH - - 1 A IF=0mA, VO=OPEN (VCC=15V) Offset Voltage Switching Specifications, TA = 0~70°C, VCC = 5V (unless otherwise specified) Propagation Delay Time to Low Output Level tPHL - 0.1 0.8 S T A=25°C (RL=1.9K, IF=16mA) Propagation Delay Time to High Output Level tPLH - 0.4 0.8 S T A=25°C (RL=1.9K, IF=16mA) Logic High Common Mode Transient Immunity |CMH| 1 - - KV/ S I F=0mA, VCM=10VP-P, RL=1.9K Logic High Common Mode Transient Immunity |CML| 1 - - KV/ S I F=16mA, VCM=10VP-P, RL=1.9K Coupled Capacitance S Contact Transient Ratio S Isolation Specifications Input-Output Insulation Leakage Current I I-O - - 1.0 μA 45% RH, t=5s, V I-O=3kV Withstand Insulation Test Voltage V ISO 5000 - - V RMS RH ≤ 50%, t=1min Input-Output Resistance R I-O - 10 - VI-O = 500VDC Notes 1. Current Transfer Ratio (CTR) as a percentage is defined as the ratio of output collector current (IO) to the forward LED input current (IF) times 100 2. A 0.1µF or bigger bypass capacitor for V CC is needed as shown in Figure 1 on following page Electrical Characteristics, TA = 25°C (unless otherwise specified)
© 2012 Solid State Optronics • San José, CA Page # 5 SDN136/H/S/TR Rev 1.10 (08/09/2012) 001511 SDN136 Analog High Speed Optocoupler 1MBd, Photodiode with Transistor Output Figure 10: Load Resistance (RL) vs. Propagation Delay Time (tp)Figure 9: Propagation Delay Time (tp) vs. Temperature (°C) SDN136 Performance & Characteristics Plots, TA = 25°C, VCC=5V (unless otherwise specified) TPLH SDN135 TPLH SDN136 TPHL SDN136 TPHL SDN135
© 2012 Solid State Optronics • San José, CA Page # 6 SDN136/H/S/TR Rev 1.10 (08/09/2012) 001511 SDN136 Analog High Speed Optocoupler 1MBd, Photodiode with Transistor Output Process Step Description Parameter A Preheat Start Temperature (ºC) 150ºC B Preheat Finish Temperature (ºC) 180ºC C Preheat Time (s) 90 - 120s D Melting Temperature (ºC) 230ºC E Time above Melting Temperature (s) 30s F Peak Temperature, at Terminal (ºC) 260ºC G Dwell Time at Peak Temperature (s) 10s H Cool-down (ºC/s) <6ºC/s SDN136 Solder Reflow Temperature Profile Recommendations (1) Infrared Reflow: Refer to the following figure as an example of an optimal temperature profile for single occurrence infrared reflow. Soldering process should not exceed temperature or time limits expressed herein. Su rface temperature of device package should not exceed 250ºC: A B C D F E G H (2) Wave Solder: (3) Hand Solder: Maximum Temperature: 260ºC (at terminal) Maximum Time: 10s Pre-heating: 100 - 150ºC (30 - 90s) Single Occurrence Maximum Temperature: 350ºC (at tip of soldering iron) Maximum Time: 3s Single Occurrence Figure 11
© 2012 Solid State Optronics • San José, CA Page # 7 SDN136/H/S/TR Rev 1.10 (08/09/2012) 001511 SDN136 Analog High Speed Optocoupler 1MBd, Photodiode with Transistor Output All dimensions in millimeters [mm] with inches in parenthesis ()
© 2012 Solid State Optronics • San José, CA Page # 8 SDN136/H/S/TR Rev 1.10 (08/09/2012) 001511 SDN136 Analog High Speed Optocoupler 1MBd, Photodiode with Transistor Output
8 PIN WIDE Lead Space Package (-H) Note:
All dimensions in millimeters [mm] with inches in parenthesis ()
© 2012 Solid State Optronics • San José, CA Page # 9 SDN136/H/S/TR Rev 1.10 (08/09/2012) 001511 SDN136 Analog High Speed Optocoupler 1MBd, Photodiode with Transistor Output 8 PIN SMD Surface Mount Package (-S) Note: All dimensions in millimeters [mm] with inches in parenthesis ()
© 2012 Solid State Optronics • San José, CA Page # 10 SDN136/H/S/TR Rev 1.10 (08/09/2012) 001511 SDN136 Analog High Speed Optocoupler 1MBd, Photodiode with Transistor Output SDN136 Packaging Specifications Tape & Reel Specifications (T&R) Note: All dimensions in millimeters [mm] with inches in parenthesis () Specification Symbol Dimensions, mm ( inches ) Tape Width W 16 0.3 ( 0.63 ) Sprocket Hole Pitch P0 4 0.1 ( 0.15 ) Compartment Location F 2 0.1 ( 0.079 ) Compartment Pitch P1 12 0.1 ( 0.472 )
© 2012 Solid State Optronics • San José, CA Page # 11 SDN136/H/S/TR Rev 1.10 (08/09/2012) 001511 SDN136 Analog High Speed Optocoupler 1MBd, Photodiode with Transistor Output Solid State Optronics (SSO) makes no warranties or representations with regards to the completeness and accuracy of this document. SSO reserves the right to make changes to product description, specifications at any time without further notices. SSO shall not assume any liability arising out of the application or use of any product or circuit described herein. Neither circuit patent licenses nor indemnity are expressed or implied. Except as specified in SSO’s Standard Terms & Conditions, SSO disclaims liability for consequential or other damage, and we make no other warranty, expressed or implied, including merchantability and fitness for particular use. DISCLAIMER SSO does not authorize use of its devices in life support applications wherein failure or malfunction of a device may lead to personal injury or death. Users of SSO devices in life support applications assume all risks of such use and agree to indemnify SSO against any and all damages resulting from such use. Life support devices are defined as devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when used properly in accordance with instructions for use can be reasonably expected to result in significant injury to the user, or (d) a critical component of a life support device or system whose failure can be reasonably expected to cause failure of the life support device or system, or to affect its safety or effectiveness. LIFE SUPPORT POLICY