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FENG-JUI TECHNOLOGY CO., LTD SLIM INDUCTOR-RoHS Your Perfect Inductor Rev.1701 SDIA5030 TYPE

  • FEATURE 1. Low profile and small size (Height: 3.00mm Max)
  • Applications 1. LCD panels 2. Digital camera , PDA and others
  • Shape and Dimension ●Schematics and Land Patterns(mm) A=5.00±0.40m/m ; B=3.00 m/m Max(do not include solder) ; C= 2.00m/m REF
  • Specification Part Number L(uH) STAMP DCR( Ω±30%) Isat(A) Irms SDIA5030-R47N 0.47 R47 0.010 9.00 5.00 SDIA5030-1R0N 1.0 1R0 0.015 6.60 4.00 SDIA5030-2R2N 2.2 2R2 0.023 4.20 3.50 SDIA5030-3R3M 3.3 3R3 0.030 3.60 3.00 SDIA5030-4R7M 4.7 4R7 0.035 3.10 2.60 SDIA5030-6R8M 6.8 6R8 0.052 2.50 2.30 SDIA5030-100M 10 100 0.070 2.10 1.70 SDIA5030-150M 15 150 0.125 1.60 1.40 SDIA5030-220M 22 220 0.180 1.40 1.05 SDIA5030-330M 33 330 0.300 1.15 0.80 SDIA5030-470M 47 470 0.450 0.95 0.70 Note1. Measurement frequency of Inductance value : at 100KHz, 0.25V Note2. Measurement ambient temperature of L, DCR and IDC : at 25℃ Note3. Inductance Tolerance: N: ±30% ; M: ±20% Note4. Isat : △L/L≦30%(This indicates the value of current when the inductances is 30% lower than its initial value at D.C. superimposition) Note6.Packaging: Taping ; Quantity: 2000 Pieces/reel

FENG-JUI TECHNOLOGY CO., LTD SLIM INDUCTOR-RoHS Your Perfect Inductor Rev.1701 GENERAL CHARACTERISTICS 1. Operating temperature range: -40 TO + 105 (I ncludes temperature when the coil is heated)℃ 2. External appearance: On visual inspection, the coil has no external defects. 3. Terminal strength: After soldering. Between copper plat e and terminals of coil. Push in two directions of X.Y withstanding at below conditions. Terminal should not peel off. (refer to figure at right) 5. 0N 60 sec. 4. Insulating resistance: Over 100M Ω at 100V D.C. between coil and core. 5. Dielectric strength: No dielectric breakdow n at 100V D.C. for 1 minute between coil and core. 6. Temperature characteristics: Indu ctance coefficient (0~2,000)x10-6/℃(-25~+80℃ degree Celsius), inductance deviation within±5.0%, after 96 hours. 7. Humidity characteristics(Moisture Resistance): Indu ctance deviation within ±5%, after 96 hours in 90~95% relative humidity at 40 ±2℃and 1 hour drying under normal condition. 8. Vibration resistance: Inductance deviation within ±5%, af ter vibration for 1 hour. In each of three orientations at sweep vibration (10~55~10 Hz) with 1.5mm P-P amplitudes. 9. Shock resistance: Inductance deviation within ±5 %, after being dropped once with 981m/s2 (100G) shock attitude upon a rubber block method shock testing machine, in three different orientations. 10. Resistance to Soldering Heat: 260℃, 10 seconds(See attached recommend reflow) 11. Storage condition: Temperature Range: 0 ℃ ~ 35 ℃；-40℃ ~ 105 ℃ (after PCB) ，Humidity Range: 50% ~ 70% RH 12. Use components within 12 months. If 12 months or more have elapsed, check solderability before use. 13. Reflow profile recommend: 260 ℃ 230 ℃ 300 250 200 150 100 T( ℃ ) T(s 300240180120600 Lead-free heat endurance test 245℃ Peak 230℃ 170±10℃,60-120 S 300 250 200 150 100 T(℃) T(s) 300240180120600 Lead-free the recommended reflow condition