DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 2

Technical content

FENG-JUI TECHNOLOGY CO., LTD SLIM INDUCTOR -RoHS Your Perfect Inductor Rev.1 801 SDIA3012 TYPE

  • FEATURE 1. Low profile and small size (Height: 1.20mm Max) 2. Low DC resistance
  • Applications 1. LCD panels 2. Digital camera , PDA and others
  • Shape and Dimension ●Schematics and Land Patterns(mm)
  • Specification Part Number L(uH) DCR(ΩMax) Isat(mA) Irms(mA) SDIA3012-1R0N 1.0±30% 0.0672 1500 1490 SDIA3012-1R5N 1.5±30% 0.072 1360 1400 SDIA3012-2R2M 2.2±20% 0.096 1100 1200 SDIA3012-3R3M 3.3±20% 0.120 910 1050 SDIA3012-4R7M 4.7±20% 0.192 770 980 SDIA3012-6R8M 6.8±20% 0.282 670 740 SDIA3012-100M 10±20% 0.348 540 630 SDIA3012-150M 15±20% 0.540 440 485 SDIA3012-220M 22±20% 0.756 375 420 SDIA3012-330M 33±20% 1.236 310 330 SDIA3012-470M 47±20% 1.740 250 280 Note1. Measurement frequency of Inductance value : at 100KHz, 0.25V Note2. Measurement ambient temperature of L, DCR and IDC : at 25℃ Note3. Isat : △L/L≦30%(This indicates the value of current when the inductances is 30% lower than its initial value at D.C. superimposition) Note5.Packaging: Taping ; Quantity: 2000 Pieces/reel

FENG-JUI TECHNOLOGY CO., LTD SLIM INDUCTOR -RoHS Your Perfect Inductor Rev.1 801 GENERAL CHARACTERISTICS 1. Operating temperature range: -40 TO + 105℃(Includes temperature when the coil is heated) 2. External appearance: On visual inspection, the coil has no external defects. 3. Terminal strength: After soldering. Between copper plate and terminals of coil. Push in two directions of X.Y withstanding at below conditions. Terminal should not peel off. (refer to figure at right) 5. 0N 60 sec. 4. Insulating resistance: Over 100MΩ at 100V D.C. between coil and core. 5. Dielectric strength: No dielectric breakdown at 100V D.C. for 1 minute between coil and core. 6. Temperature characteristics: Inductance coefficient (0~2,000)x10-6/℃(-25~+80℃). 7. Humidity characteristics(Moisture Resistance): Inductance deviation within ±5%, after 96 hours in 90~95% relative humidity at 40 ±2℃and 1 hour drying under normal condition. 8. Vibration resistance: Inductance deviation within ±5%, after vibration for 1 hour. In each of three orientations at sweep vibration (10~55~10 Hz) with 1.5mm P-P amplitudes. 9. Shock resistance: Inductance deviation within ±5%, after being dropped once with 981m/s2 (100G) shock attitude upon a rubber block method shock testing machine, in three different orientations. 10. Resistance to Soldering Heat: 260℃, 10 seconds(See attached recommend reflow) 11. Storage environment: Storage condition: Temperature Range: 10℃ ~ 35℃ (Generally: 21℃ ~ 31℃) , Humidity Range: 50% ~ 80% RH (Generally: 65% ~ 75%) ; Transportation condition: Temperature Range: -35℃ ~ 85℃ , Humidity Range: 50% ~ 95% RH 12. Use components within 6 months. If 6 months or more have elapsed, check solderability before use. 13. Reflow profile recommend: 260 ℃ 230 ℃ 300 250 200 150 100 T( ℃ ) T(s 300240180120600 Lead-free heat endurance test 245 ℃ Peak 230 ℃ 170 ± 10℃ ,6 0-120S 300 250 200 150 100 T( ℃ ) T(s) 300240180120600 Lead-free the recom m ended refl ow condi ti on