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FENG-JUI TECHNOLOGY CO., LTD SLIM INDUCTOR -RoHS Your Perfect Inductor Rev.1 801 SDIA3010 TYPE
- FEATURE 1. Low profile and small size (Height: 1.00mm Max) 2. Low DC resistance
- Applications 1. LCD panels 2. Digital camera , PDA and others
- Shape and Dimension ●Schematics and Land Patterns(mm)
- Specification Part Number L(uH) DCR(ΩMax) Isat(mA) Irms(mA) SDIA3010-1R0N 1.0±30% 0.078 1300 1400 SDIA3010-1R5N 1.5±30% 0.096 1200 1300 SDIA3010-2R2M 2.2±20% 0.114 1200 1200 SDIA3010-3R3M 3.3±20% 0.168 870 1000 SDIA3010-4R7M 4.7±20% 0.228 900 900 SDIA3010-6R8M 6.8±20% 0.360 610 630 SDIA3010-100M 10±20% 0.540 500 510 SDIA3010-150M 15±20% 0.888 400 400 SDIA3010-220M 22±20% 0.924 350 350 SDIA3010-330M 33±20% 1.860 260 275 SDIA3010-470M 47±20% 2.460 220 235 Note1. Measurement frequency of Inductance value : at 100KHz, 0.25V Note2. Measurement ambient temperature of L, DCR and IDC : at 25℃ Note3. Isat : △L/L≦30%(This indicates the value of current when the inductance is 30% lower than it’s initial value at D.C. superimposition) Note5.Packaging: Taping ; Quantity: 2000 Pieces/reel
FENG-JUI TECHNOLOGY CO., LTD SLIM INDUCTOR -RoHS Your Perfect Inductor Rev.1 801 GENERAL CHARACTERISTICS 1. Operating temperature range: -40 TO + 105℃(Includes temperature when the coil is heated) 2. External appearance: On visual inspection, the coil has no external defects. 3. Terminal strength: After soldering. Between copper plate and terminals of coil. Push in two directions of X.Y withstanding at below conditions. Terminal should not peel off. (refer to figure at right) 5. 0N 60 sec. 4. Insulating resistance: Over 100MΩ at 100V D.C. between coil and core. 5. Dielectric strength: No dielectric breakdown at 100V D.C. for 1 minute between coil and core. 6. Temperature characteristics: Inductance coefficient (0~2,000)x10-6/℃(-25~+80℃). 7. Humidity characteristics(Moisture Resistance): Inductance deviation within ±5%, after 96 hours in 90~95% relative humidity at 40 ±2℃and 1 hour drying under normal condition. 8. Vibration resistance: Inductance deviation within ±5%, after vibration for 1 hour. In each of three orientations at sweep vibration (10~55~10 Hz) with 1.5mm P-P amplitudes. 9. Shock resistance: Inductance deviation within ±5%, after being dropped once with 981m/s2 (100G) shock attitude upon a rubber block method shock testing machine, in three different orientations. 10. Resistance to Soldering Heat: 260℃, 10 seconds(See attached recommend reflow) 11. Storage environment: Storage condition: Temperature Range: 10℃ ~ 35℃ (Generally: 21℃ ~ 31℃) , Humidity Range: 50% ~ 80% RH (Generally: 65% ~ 75%) ; Transportation condition: Temperature Range: -35℃ ~ 85℃ , Humidity Range: 50% ~ 95% RH 12. Use components within 12 months. If 12 months or more have elapsed, check solderability before use. 13. Reflow profile recommend: 260 ℃ 230 ℃ 300 250 200 150 100 T( ℃ ) T(s 300240180120600 Lead-free heat endurance test 245 ℃ Peak 230 ℃ 170 ± 10℃ ,6 0-120S 300 250 200 150 100 T( ℃ ) T(s) 300240180120600 Lead-free the recom m ended refl ow condi ti on