SDE0403A-390K

SDE0403A BOURNS | Alldatasheet

Document overview

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Technical content

Features

n Inductance range: 1.0 to 68 µH n Heating current up to 2.7 A n Dimensions: 4.5 x 4 x 3.2 mm n AEC-Q200 qualified n RoHS compliant* and halogen free**

Applications

n Automotive systems: - Driver assistant - Information - Entertainment - Lighting n DC/DC converters n Power supplies SDE0403A Series - SMD Power Inductors Operating Temperature (Temperature rise included) Storage Temperature Resistance to Solder Heat Temperature Rise Irms Electrical Specifications @ 25 °C Bourns Part Number Inductance SRF (MHz) Typ. DCR (W) Typ. DCR (W) Max. I rms (A) I sat (A) ***K- FactorL (µH) Tol. (%) SDE0403A-100M 10 ± 20 36 0.127 0.172 1.05 1.4 148 SDE0403A-120M 12 ± 20 32 0.146 0.197 1.0 1.3 135 SDE0403A-150M 15 ± 20 29 0.192 0.259 0.85 1.2 120 SDE0403A-180M 18 ± 20 28 0.237 0.309 0.75 1.1 112 SDE0403A-220M 22 ± 20 25 0.27 0.351 0.7 0.95 98 SDE0403A-270M 27 ± 20 22 0.322 0.419 0.65 0.85 90 SDE0403A-330K 33 ± 10 20 0.373 0.485 0.6 0.8 83 SDE0403A-390K 39 ± 10 18 0.449 0.561 0.55 0.7 75 SDE0403A-470K 47 ± 10 16 0.505 0.631 0.5 0.65 68 SDE0403A-560K 56 ± 10 15 0.736 0.92 0.45 0.6 62 SDE0403A-680K 68 ± 10 13 0.822 1.028 0.4 0.55 56 General Specifications Materials Product Dimensions *RoHS COMPLIANT *RoHS COMPLIANT & AEC-Q200 QUALIFIED *RoHS COMPLIANT AEC APPROVED (Select Models) LEAD FREE *RoHS COMPLIANTVERSIONS AVAILABLE LEAD FREE VERSIONS ARE RoHS COMPLIANT* Recommended Layout DIMENSIONS: MM (INCHES) * RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011. Bourns follows the prevailing definition of “halogen free” in the industry. Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less. Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. 4.50 ± 0.3 (.177 ± .012) 4.00 ± 0.3 (.157 ± .012) 4.50 (.177 ± .012) 3.20 ± 0.3 (.126 ± .012)1.60 (.063) REF. 1.50 (.059) 5.00 (.197) 100 *K-Factor: To calculate core flux density, Bp-p (gauss) = K x L(µH) x Δ I (peak-to-peak ripple current, A), determine core loss from Core Loss vs. Flux Density plot. Core Loss vs. Flux Density Flux Density Bp-p (gauss) 100 10 100

1 MHz

800 KHz

500 KHz

400 KHz

300 KHz

200 KHz

0.1 0.01

0.001 Core Loss (mW)

100 KHz

SDE0403A Series - SMD Power Inductors Inductance vs. IDC Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. Temperature Rise vs. IDC 0.0 0.5 1.0 1.5 2.0 2.5 IDC (A) L (µH) IDC (A) ΔT (°C) L @ 25 °C L @ 125 °C ΔT @ 25 °C 0.0 10.0 20.0 30.0 40.0 50.0 60.0 0.0 6.0 3.0 9.0 12.0 15.0 18.0 IDC (A) L (µH) IDC (A) ΔT (°C) L @ 25 °C L @ 125 °C ΔT @ 25 °C 0.0 10.0 20.0 30.0 40.0 50.0 60.0 0.0 25.0 20.0 30.0 35.0 5.0 10.0 15.0 40.0 0.0 50.0 40.0 60.0 70.0 20.0 10.0 30.0 80.0 IDC (A) L (µH) IDC (A) ΔT (°C) L @ 25 °C L @ 125 °C ΔT @ 25 °C 0.0 10.0 20.0 30.0 40.0 50.0 60.0 IDC (A) L (µH) IDC (A) ΔT (°C) L @ 25 °C L @ 125 °C ΔT @ 25 °C 0.0 20.0 10.0 30.0 40.0 50.0 60.0 70.0 SDE0403A-2R2M SDE0403A-150M SDE0403A-330K SDE0403A-680K SDE0403A-2R2M SDE0403A-150M SDE0403A-330K SDE0403A-680K Electrical Schematic How to Order SDE0403A - 100M Model Value Code (see table)

Specifications are subject to change without notice. The device characteristics and parameters in this data sheet can and do vary in different applications and actual device performance may vary over time. Users should verify actual device performance in their specific applications. SDE0403A Series - SMD Power Inductors DIMENSIONS: MM (INCHES) Packaging Specifications EMBOSSED CARRIER EMBOSSED CAVITY 0.10 (.004) THICKNESS MAX. 12.0 (.472) 14.0 +0 (.551 +.000) 18.4 (.724) 2.0 ± 0.5 (.079 ± .020) 50.0 -0 (1.969 - .000) 330 (12.99) DIA. 13.0 ± 0.5 (.512 ± .020)DIA. 13.0 ± 0.5 (.512 ± .020) DIA. 21.0 ± 0.8 (.827 ± .031) QTY: 2,000 PCS. PER REEL REV. 02/17 (.157) (.315)END START USER DIRECTION OF FEED 200 (7.874) NO COMPONENT NO COMPONENT COMPONENTS 400 (15.748) 100 100 100 100 100 100 Soldering Profile 200 Max. Peak Temperature -5 ഒ 30 sec. max. Max. Time Above 217 ഒ: 60~150 sec. max. Peak Temperature 250 ഒ max. 250 150 200 100 Temperature (°C) 10050 150 Time (Seconds) Temperature Rising Area Preheat Area Reflow Area Forced Cooling Area 250 Peak Temperature: 250 °C 217 °C 60~120 Sec. 60 Sec. Max. 60~150 Sec. Peak Temperature: 250 ° C max. Max. Peak Temperature -5 °C: 30 sec. max. Max. Time Above 217 °C: 90-150 sec. max.