SD7030 EATON | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 4

Technical content

  • Low profile 7.0 mm x 7.0 mm x 3.0 mm surface mount package
  • Ferrite material shielded drum core
  • Inductance range from 1.5 µH to 680 µH
  • Current range from 0.21A to 5.5 A
  • Frequency range up to 1 MHz

Applications

  • Storage temperature range (component): -40 °C to +125 °C
  • Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise)
  • Solder reflow temperature: J-STD-020 (latest revision) compliant SD7030 Low profile shielded drum core power inductors
  • Notebook, laptop computers
  • Digital cameras
  • LED Drivers
  • TFT LCD Bias supplies
  • Wireless handsets
  • Handheld instruments
  • Gaming consoles
  • GPS devices
  • Battery power, Li-lon, 2-cell Environmental data Pb HALOGEN HFFREE

Low profile shielded drum core power inductors www.eaton.com/electronicsTechnical Data 4330 Effective August 2017 Product specifications arts per reel. Dimensions-mm Packaging information-mm 1 Open Circuit Inductance Test Parameters: 100 kHz, 0.1 Vrms, 0.0 Adc. 2I rms: DC current for an approximate ΔT of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow , and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst case operating conditions verified in the end application. 3I sat Amps peak for approximately 35% rolloff (@ +25 °C) 4 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K*L*ΔI, Bp-p(mT), K: (K factor from table), L: (Inductance in μH), ΔI (Peak-to-peak ripple current in Amps).

5 Part Number Definition:

SD7030 = Product code and size; -xxx = Inductance value in μH; R = decimal point; If no R is present, third character equals number of zeros. -R suffix = RoHS compliant Part Number5 OCL1 μH ± 30% Irms 2 (A) Isat 3 (A) Typ. DCR mΩ @ +25 °C Max DCR mΩ @ +25 °C K-factor 4 SD7030-1R5-R 1.5 5.5 4.5 10 12 32 SD7030-3R3-R 3.3 3.7 3.00 20 24 22 SD7030-3R9-R 4.1 3.4 2.60 22 27 19 SD7030-5R0-R 4.9 3.2 2.40 26 31 17 SD7030-6R0-R 5.8 2.8 2.25 29 35 16 SD7030-7R3-R 7.0 2.3 2.10 45 54 13 SD7030-8R0-R 7.8 2.2 1.85 48 58 12 SD7030-100-R 10.0 2.1 1.70 54 65 11 SD7030-120-R 11.5 1.9 1.55 58 70 10 SD7030-150-R 14.6 1.7 1.40 70 84 9.3 SD7030-180-R 17.3 1.7 1.32 79 95 8.8 SD7030-220-R 21.0 1.4 1.20 107 128 7.6 SD7030-260-R 24.9 1.3 1.05 118 142 6.9 SD7030-300-R 30.0 1.2 0.97 138 165 6.4 SD7030-390-R 39.7 1.1 0.86 175 210 5.7 SD7030-440-R 43.4 1.1 0.80 198 238 5.3 SD7030-560-R 54.4 0.99 0.73 231 277 4.9 SD7030-680-R 66.6 0.85 0.65 253 304 4.3 SD7030-820-R 81.4 0.82 0.60 325 390 4.0 SD7030-101-R 95.5 0.70 0.54 446 535 3.6 SD7030-121-R 115.2 0.67 0.50 629 755 3.3 SD7030-151-R 145 0.57 0.44 715 858 2.9 SD7030-181-R 174 0.54 0.40 805 966 2.7 SD7030-221-R 211 0.51 0.36 1102 1322 2.4 SD7030-271-R 264 0.44 0.33 1259 1475 2.2 SD7030-331-R 317 0.38 0.30 1438 1725 2.0 SD7030-391-R 381 0.36 0.27 1857 2228 1.8 SD7030-471-R 460 0.34 0.25 2150 2581 1.7 SD7030-561-R 561.0 0.29 0.23 2857 3428 1.5 SD7030-681-R 677.2 0.28 0.21 3206 3847 1.4 Top View Bottom View Front View Recommended Pad Layout Schematic Left View Part Marking: xxx = inductance value in μH. R = decimal point. If no “R” is present, third character = # of zeros. wwlly or wwllyy = date code. R = revision level Do not route traces or vias underneath the inductor Supplied in tape-and-reel packaging, 1500 parts per reel, 13” diameter reel.

3www.eaton.com/electronics Technical Data 4330 Effective August 2017 SD7030 Low profile shielded drum core power inductors Core loss vs Bp-p Temperature rise vs total loss Inductance characteristics 500kHz 1MHz 300kHz 200kHz 100kHz -40°C +25°C +85°C

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Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 4330 BU-SB111167 August 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Solder Reflow Profile Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s TTaabbllee 11 -- SSttaannddaarrdd SSnnPPbb SSoollddeerr ((TTcc)) VolumeVolume Package mm 3 mm3 Thickness <350 _>350 <2.5mm 235°C 220°C TTaabbllee 22 -- LLeeaadd ((PPbb)) FFrreeee SSoollddeerr ((TTcc)) Volume Volume Volume Package mm 3 mm3 mm3 Thickness <350 350 - 2000 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C Reference JDEC J-STD-020 Standard SnPb Solder Lead (Pb) Free SolderProfile Feature Preheat and Soak eT mperature min. (Tsmin) 100°C 150°C  Temperature max. (Tsmax) 150°C 200°C  Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 217°C 60-150 Seconds 60-150 Seconds Table 1 able 2T

20 Seconds 30 Seconds

6°C/ Second Max. 6°C/ Second Max. Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (T c) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Minutes Max.6 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Technical Data 4330 Effective August 2017 SD7030 Low profile shielded drum core power inductors