SD6030 EATON | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 4

Technical content

  • 6.0 mm x 6.0 mm x 3.0 mm surface mount package
  • Ferrite core material
  • Shielded drum core reduces EMI
  • Inductance range from 2.7 µH to 660 µH
  • Current range from 0.16 A to 4.08 A
  • Frequency range up to 1 MHz

Applications

  • Storage temperature range (component): -40 °C to +125 °C
  • Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise)
  • Solder reflow temperature: J-STD-020 (latest revision) compliant SD6030 Low profile shielded drum core power inductors
  • Notebook, laptop computers
  • Digital cameras
  • LED Drivers
  • TFT LCD Bias supplies
  • Wireless handsets
  • Handheld instruments
  • Gaming consoles
  • GPS devices
  • Battery backup/power Environmental data Pb HALOGEN HFFREE

Low profile shielded drum core power inductors www.eaton.com/electronics Product specifications Dimensions-mm Packaging information-mm arts per reel. Part Number5 OCL 1 µH ± 30% Irms 2 (A) Isat 3.(A) Typ. DCR mW□@ +20 °C Max DCR mW @ +20 °C K-factor4 SD6030-2R7-R 2.7 4.08 2.60 13 18 34 SD6030-3R3-R 3.3 3.54 2.40 18 24 30 SD6030-4R2-R 4.1 3.11 2.20 23 31 27 SD6030-5R0-R 4.9 2.81 1.90 28 38 24 SD6030-5R8-R 5.8 2.58 1.80 33 45 22 SD6030-7R8-R 7.8 2.38 1.60 39 53 19 SD6030-100-R 9.3 2.15 1.30 48 65 17 SD6030-120-R 11.3 1.99 1.20 56 76 16 SD6030-150-R 14.1 1.71 1.10 76 103 14 SD6030-180-R 17.1 1.65 1.00 82 110 13 SD6030-220-R 20.4 1.57 0.90 90 122 12 SD6030-270-R 26.0 1.31 0.85 130 175 11 SD6030-330-R 32.4 1.26 0.75 140 189 9.3 SD6030-360-R 34.4 1.19 0.70 157 212 8.7 SD6030-440-R 44.0 1.10 0.62 185 250 7.9 SD6030-520-R 52.0 0.99 0.58 226 305 7.2 SD6030-680-R 65.6 0.92 0.52 263 355 6.5 SD6030-820-R 81.6 0.80 0.46 343 463 5.9 SD6030-101-R 94.4 0.76 0.42 385 520 5.6 SD6030-121-R 110.1 0.70 0.40 517 620 5.6 SD6030-151-R 144.5 0.64 0.35 608 730 5.0 SD6030-181-R 175.7 0.55 0.32 817 980 4.5 SD6030-221-R 210.9 0.50 0.30 1000 1200 4.0 SD6030-271-R 264.2 0.44 0.27 1300 1560 3.6 SD6030-331-R 313.5 0.38 0.25 1733 2080 3.3 SD6030-391-R 373.7 0.35 0.22 2083 2500 3.0 SD6030-471-R 460.0 0.33 0.20 2250 2700 2.8 SD6030-561-R 546.2 0.30 0.18 2767 3320 2.5 SD6030-681-R 659.4 0.27 0.16 3458 4150 2.3 1) Open Circuit Inductance Test Parameters: 100 kHz, 0.1 Vrms, 0.0 Adc. 2I rms: DC current for an approximate DT of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst case operating conditions veri- fied in the end application.

3 Isat Amps peak for 35% rolloff (@ +25 °C)

4 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K*L*DI, Bp-p (mT), K: (K factor from table), L: (Inductance in mH), DI (Peak to peak ripple current in Amps).

5 Part Number Definition: SD6030-xxx-R

SD6030 = Product code and size; -xxx = Inductance value in mH; R = decimal point; If no R is present, third character equals number of zeros. -R suffix = RoHS compliant Part Marking: xxx = Inductance value in uH. R = decimal point. If no R is present third character = # of zeros, wwlly or wwllyy = Date code, R = Revision level. Do not route traces or vias underneath the inductor Parts packaged on 13" diameter reel, 2000 parts per reel.

3www.eaton.com/electronics Technical Data 4314 Effective August 2017 SD6030 Low profile shielded drum core power inductors Core loss vs Bp-p Temperature rise vs total loss Inductance characteristics 500kHz 1MHz 300kHz 200kHz 100kHz0.1 0.01 0.001 0.0001 1 10 100 1000 Bp-p ( mT) C ore Lo ss (W) -40°C +25°C +85°C

1000 Eaton Boulevard

Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 4314 BU-SB111167 August 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Solder Reflow Profile Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s TTaabbllee 11 -- SSttaannddaarrdd SSnnPPbb SSoollddeerr ((TTcc)) VolumeVolume Package mm 3 mm3 Thickness <350 _>350 <2.5mm 235°C 220°C TTaabbllee 22 -- LLeeaadd ((PPbb)) FFrreeee SSoollddeerr ((TTcc)) Volume Volume Volume Package mm 3 mm3 mm3 Thickness <350 350 - 2000 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C Reference JDEC J-STD-020 Standard SnPb Solder Lead (Pb) Free SolderProfile Feature Preheat and Soak eT mperature min. (Tsmin) 100°C 150°C  Temperature max. (Tsmax) 150°C 200°C  Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 217°C 60-150 Seconds 60-150 Seconds Table 1 able 2T

20 Seconds 30 Seconds

6°C/ Second Max. 6°C/ Second Max. Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (T c) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Minutes Max.6 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Technical Data 4314 Effective August 2017 SD6030 Low profile shielded drum core power inductors