SD53 EATON | Alldatasheet

Document overview

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  • PDF pages: 4

Technical content

  • Octagonal shape utilizes board space
  • Shielded drum core
  • Inductance range from 1.1 uH to 100 uH
  • Current range from 0.44 A to 4.8 A
  • 5.7 mm x 5.2 mm footprint surface mount package in a 3.0 mm height
  • Ferrite core material
  • Halogen free, lead free, RoHS compliant

Applications

  • Desktop computers
  • Notebook and laptop regulators
  • LED and White LED drivers
  • Digital cameras, media devices
  • Battery power systems Environmental Data
  • Storage temperature range (component): -40 °C to +125 °C
  • Operating temperature range: -40 °C to +125 °C (Ambient plus self temperature rise)
  • Solder reflow temperature: J-STD-020D compliant Pb HALOGEN HFFREE SD53 Low profile shielded power inductors

Low profile shielded power inductors www.eaton.com/elx Product Specifications Part Number5 OCL1 (μH) ±20% Part marking Irms (A) Isat (A) DCR (Ω) typical @ 20 °C DCR (Ω) maximum @ 20 °C K-factor4 SD53-101-R 100 L 0.44 0.45 0.689 0.801 5 2. Irms: DC current for an approximate ∆T of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed 125 °C under worst case operating conditions verified in the end application 3. lsat: Peak current for approximately 30% rolloff @ 25 °C. 4. K-factor: Used to determine B p-p for core loss (see graph). B p-p = K*L* ∆I, B p-p(mT), K: (K factor from table), L: (Inductance in uH), ∆I (Peak to peak ripple current in Amps). 5. Part Number Definition: SD53-xxx-R SD53 = Product code and size; -xxx = Inductance value in uH; R = decimal point; If no R is present then third character equals the number of zeros. -R suffix = RoHS compliant. Dimensions (mm) Packaging information (mm) Parts packaged on 13” diameter reel, 2,600 parts per reel. Part Marking: Line 1: (1st digit= inductance value per Part Marking Designator); (2nd digit= Bi-weekly production date code); (3rd digit= Last digit of the year produced), (4th digit= Internal manufacturing code). Line 2: 53=product size code) Do not route traces or vias underneath the inductor

Low profile shielded power inductors www.eaton.com/elx Core loss vs. Bp-p T emperature rise vs. total loss Inductance characteristics 1M Hz 500k Hz 300k Hz 200k Hz 1 00kHz 0.00000 1 0.00 001 0.0001 0.001 0.01 0.1 1001011 000 Bp-p (mT) CoreL oss( W)

1000 Eaton Boulevard

Cleveland, OH 44122 United States www.eaton.com/elx © 2015 Eaton All Rights Reserved Printed in USA Publication No. 4149 November 2015 Eaton is a registered trademark. All other trademarks are property of their respective owners. SD53 Low profile shielded power inductors Technical Data 4149 Effective November 2015 Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Solder reflow profile Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C

  • Temperature max. (Tsmax) 150°C 200°C
  • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183°C 60-150 Seconds 217°C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp) within 5 °C of the specified classification temperature (T c) 20 Seconds 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 ≥350 ≥2.5mm 220°C 220°C Table 2 - Lead (Pb) Free Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C