SD52 EATON | Alldatasheet

Document overview

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Technical content

  • Octagonal shape shielded drum core
  • Inductance range from 1.2 uH to 150 uH
  • Current range from 0.28 A to 3.14 A
  • 5.6 mm x 5.2 mm footprint surface mount package in a 2.0 mm height
  • Ferrite core material
  • Halogen free, lead free, RoHS compliant

Applications

  • Desktop computers
  • Notebook and laptop regulators
  • Graphics cards
  • Digital cameras, media devices Environmental Data
  • Storage temperature range: -40 °C to +125 °C
  • Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise).
  • Solder reflow temperature: J-STD-020D compliant Pb HALOGEN HFFREE SD52 High power density, low profile shielded power inductors

High power density, low profile shielded power inductors www.eaton.com/elx Product Specifications Part Number6 OCL1 (μH) ±20% Part marking Irms (A) Isat (A) DCR4 (Ω) typ. (V us) typ. SD52-101-R 100 N 0.39 0.35 1.0000 13.37 SD52-151-R 150 O 0.31 0.28 1.6100 17.00 1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.25 Vrms, 0.0 Adc. 2. Irms: DC current for an approximate ∆T of 40 °C without core loss. De-rating is necessary for AC currents. Temperature rise is dependent upon several factors, including the PCB pad layout, trace thickness and width, air-flow and proximity to other heat generating components. It is recommended the part temperature not exceed 125 °C under worst case operating conditions and therefore, the temperature rise should be verified in the end use application. 3. Isat: Peak current for approximately 30% rolloff at +20 °C. 4. DCR limits @ 20°C. 5. Applied Volt-Time product (V-us) across the inductor at 100 kHz necessary to generate a core loss equal to 10% of the total losses for 40 °C temperature rise. 6. Part number definition: SD52-xxx-R SD52= Product code and size -xxx=Inductance value in µH, R= decimal point - If no R is present, then last character equals the number of zeros Dimensions (mm) Packaging information (mm) Parts packaged on 13” Diameter reel, 3,500 parts per reel. RECOMMENDED PCB LAYOUT SCHEMATIC 2.0 2 plcs 6.0 1.3 2 plcs 5.2 max 5.2 maxm Pin #1 indicator Part marking 2.0 maxm 5.6 maxm 0.65 ±0.10 xxxx Direction of feed Ko SECTION A-A

1.5 Dia

min. BoB AoA 8.08 0 4.00 2.00 ± 0.05 1.5 Dia. +0.1/-0.0 A A 1.75 5.50 12.0 +/-0.3010.203.0 Ao=5.72mm Bo=5.72mm Ko=2.30mm Part Marking: 1st digit= the inductance value per part marking designator, 2nd digit = bi-weekly production date code, 3rd digit = last digit of the year produced, 4th digit= internal manufacturing code. 52 = the product size code. Do not route traces or vias underneath the inductor.

High power density, low profile shielded power inductors www.eaton.com/elx DC current vs.temperature SD52-1R2 0.0 10.0 20.0 30.0 40.0 50.0 60.0 70.0 80.0 90.0 100.0 IDC (A) TemperatureR ise( Deg. C) SD52-101 0.0 10.0 20.0 30.0 40.0 50.0 60.0 70.0 80.0 90.0 100.0 IDC (A) Temperature Rise (Deg.C ) Inductance characteristics OCL vs Isat S D52 100 01 02 03 04 05 06 07 08 09 01 00 1101 20 1301 40 %o fI sat OCL (%) Core loss Irms DERATING WITH CORE LOSS % of applied V us %o fL ossesf romI rms (maximum)

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Cleveland, OH 44122 United States www.eaton.com/elx © 2015 Eaton All Rights Reserved Printed in USA Publication No. 4311 November 2015 Eaton is a registered trademark. All other trademarks are property of their respective owners. SD52 High power density, low profile shielded power inductors Technical Data 4311 Effective November 2015 Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Solder reflow profile Reference JDEC J-STD-020D Profile Feature Standard SnPb Solder Lead (Pb) Free Solder Preheat and Soak • Temperature min. (Tsmin) 100°C 150°C

  • Temperature max. (Tsmax) 150°C 200°C
  • Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds Average ramp up rate Tsmax to Tp 3°C/ Second Max. 3°C/ Second Max. Liquidous temperature (Tl) Time at liquidous (tL) 183°C 60-150 Seconds 217°C 60-150 Seconds Peak package body temperature (TP)* Table 1 Table 2 Time (tp) within 5 °C of the specified classification temperature (T c) 20 Seconds 30 Seconds** Average ramp-down rate (Tp to Tsmax) 6°C/ Second Max. 6°C/ Second Max. Time 25°C to Peak Temperature 6 Minutes Max. 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 ≥350 ≥2.5mm 220°C 220°C Table 2 - Lead (Pb) Free Solder (Tc) Package Thickness Volume mm3 <350 Volume mm3 350 - 2000 Volume mm3 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C