SD3960F

2C3960 SEMICOA | Alldatasheet

Document overview

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Technical content

Data Sheet No. 2C3960 Generic Packaged Part: 2N3960 Chip type 2C3960 by Semicoa Semi- conductors provides performance similar to these devices. Product Summary: Part Numbers: 2N3960 , 2N3960UB, SD3960F, SQ3960, SQ3960F APPLICATIONS: Designed for high-speed current-mode logic switching. Features: Top Al - 15 kÅ min. Backside Au - 6.5 kÅ nom. Emitter 2.7 mils x 2.7 mils Base 2.7 mils x 2.7 mils Die Thickness Chip Area Top Surface 16 mils x 16 mils Silox Passivated Mechanical Specifications Metallization Bonding Pad Size 8 mils nominal Parameter Test conditions Min Max Unit BV CEO IC = 10.0 mA 12 --- V dc BV CBO IC = 10 µA 20 --- V dc BV EBO IE = 10.0 mA 4.5 --- V dc ICEX V CE = 10 V, V EB = 2.0 V --- 5.0 nA h FE1 IC = 1.0 mA dc, V CE = 1.0 V 25 --- --- h FE2 IC = 10 mA dc, V CE = 1.0 V 40 400 --- h FE3 IC = 30 mA dc, V CE = 1.0 V 25 --- --- V CE(sat) IC = 30 mA dc, I B = 3.0 mA --- 0.3 V dc

Electrical Characteristics

T A = 25 o C Due to limitations of probe testing, only dc parameters are tested. This must be done with pulse width less than 300 µs, duty cycle less than 2%.