SD3112-101-R

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Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 4

Technical content

• 3.1 mm x 3.1 mm x 1.2 mm shielded drum core
• Ferrite core material
• Inductance range from 1.0 uH to 220 uH
• Current range from 1.65 A to 0.113 A
• Frequency range up to 4 MHz

Applications

• Storage temperature range (component): -40 °C to +125 °C
• Operating temperature range: -40 °C to +125 °C (ambient plus self-temperature rise)
• Solder reflow temperature: J-STD-020 (latest revision) compliant SD3112 Low profile metalized shielded drum core power inductors
• Mobile phones
• Digital cameras
• Media players
• Small LCD displays
• LED driver and LED flash circuits
• Hard disk drives
• LCD Backlighting Environmental data SMD Device Discontinued, Effective July 31, 2016 or until inventory is depleted. Please review SD3114 data sheet (4128)as an alternate replacement.

www.eaton.com/electronics Product specifications Dimensions- mm SD3112 Low profile metalized shielded drum core power inductors Packaging information- mm Part Number Rated OCL (1) Part Irms (2) Isat (3) DCR ( Ω) K-factor Inductance (µH) Marking (A) (A) typ. @ (4) (µH) Designator +20 °C (1) Open Circuit Inductance Test Parameters: 100 kHz, 0.1 V, 0.0 Adc. (2) Irms: DC current for an approximate DT of 40 ° C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst case operating conditions verified in the end application. (3) Isat Amperes peak for approximately 30% rolloff (@+20 ° C) (4) K-factor: Used to determine B p-p for core loss (see graph). B p-p = K*L*∆ I, B p-p(mT), K: (K factor from table), L: (Inductance in uH), ∆(Peak to peak ripple current in Amps). Dimensions are in millimeters. Part Marking: 3 Digit Marking: (1st digit: Indicates inductance value per letter in Part Marking Designator); (2nd digit: Bi-weekly production date code); (3rd digit: Last digit of the year produced). Do not route traces or vias underneath the inductor Parts packaged on 13" Diameter reel, 4,100 parts per reel. Discontinued, Effective July 31, 2016 or until inventory is depleted. Please review SD3114 data sheet (4128)as an alternate replacement.

3www.eaton.com/electronics Technical Data 4137 Effective October 2017 SD3110 Low profile metalized shielded drum core power inductors Temperature rise vs total loss loss Core loss vs Bp-p Inductance characteristics Total Loss (W) TemperautreRise (°C) 1MHz 500kHz 0.1 300kHz 200kHz 100kHz 0.01 50kHz 0.001 0.0001 0.00001 0.000001 1 10 100 1000 Bp-p (mT) Core Loss (W) %% ooffOOCCLL -40°C 25°C 85°C 0% 0% 10 10% % 20 20% % 30 30% % 40 40% % 50 50% % 60 60% % 70 70% % 80 80% % 90 90% % 10 100% 0% 11 110% 0% 12 120% 0% %% ofof I Issaatt Discontinued, Effective July 31, 2016 or until inventory is depleted. Please review SD3114 data sheet (4128)as an alternate replacement.

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Cleveland, OH 44122 United States www.eaton.com/electronics © 2017 Eaton All Rights Reserved Printed in USA Publication No. 4127 October 2017 Eaton is a registered trademark. All other trademarks are property of their respective owners. Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Compan . Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant inju y to the user. Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin. Technical Data 4127 Effective October 2017 SD3112 Low profile metalized shielded drum core power inductors Solder Reflow Profile Temperature t tP ts TC -5°C Time 25°C to Peak Time 25°C Tsmin Tsmax TL TP Preheat A Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s TTaabbllee 11 -- SSttaannddaarrdd SSnnPPbb SSoollddeerr ((TTcc)) VolumeVolume Package mm 3 mm3 Thickness <350 _>350 <2.5mm 235°C 220°C TTaabbllee 22 -- LLeeaadd ((PPbb)) FFrreeee SSoollddeerr ((TTcc)) Volume Volume Volume Package mm 3 mm3 mm3 Thickness <350 350 - 2000 >2000 <1.6mm 260°C 260°C 260°C 1.6 – 2.5mm 260°C 250°C 245°C >2.5mm 250°C 245°C 245°C Reference JDEC J-STD-020 Standard SnPb Solder Lead (Pb) Free SolderProfile Feature Preheat and Soak eT mperature min. (Tsmin) 100°C 150°C  Temperature max. (Tsmax) 150°C 200°C  Time (Tsmin to Tsmax) (ts) 60-120 Seconds 60-120 Seconds 3°C/ Second Max. 3°C/ Second Max. 183°C 217°C 60-150 Seconds 60-150 Seconds Table 1 able 2T

20 Seconds 30 Seconds

6°C/ Second Max. 6°C/ Second Max. Average ramp up rate Tsmax to Tp Liquidous temperature (TL) Time at liquidous (tL) Peak package body temperature (TP)* Time (tp)** within 5 °C of the specified classification temperature (T c) Average ramp-down rate (Tp to Tsmax) Time 25°C to Peak Temperature Minutes Max.6 8 Minutes Max. * Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. Discontinued, Effective July 31, 2016 or until inventory is depleted. Please review SD3114 data sheet (4128)as an alternate replacement.