SDXXC GWSEMI | Alldatasheet

Document overview

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Technical content

Features

 IEC61000-4-2(ESD) ±15kV(air), ±8kV(contact)  IEC61000-4-4(EFT) 40A(5/50 ηs)  350Watts Peak Pulse Power per (tp=8/20us)  Protects one I/O line(unidirectional)  Low clamping voltage  Working voltages: 3V, 5V, 8V, 12V, 15V, 18V, 20V, 24V, 36V  Low leakage current Mechanical Data  SOD-323 Package  Flammability Rating: UL 94V-0  High temperature soldering guaranteed: 260 ℃/10s

Applications

 Cell Phone Handsets and Accessories  Microprocessor based equipment  Personal Digital Assistants(PDA’s)  Notebooks, Desktops, and Servers  Portable Instrumentation  Networking and Telecom  Serial and Parallel Ports  Peripherals ABSOLUTE MACIMUM RATING Parameters Symbol Value Unit ESD per IEC61000-4-2(Air) ESD per IEC61000-4-2(Contact) VESD ±30 kV Peak Pulse Power (8/20us) P PP 350 W Operating temperature T OPT -55-+150 ℃ Storage temperature range T STG -55-+150 ℃ Lead Soldering temperature T L 260(10 sec.) ℃ Electrical Characteristics (Ratings at 25℃ ambient temperature unless otherwise specified). PART NUMBER DEVICE MARKING VRWM (V) (max.) VB (V) (min.) IT (mA) Vc@1A (V) (max.) Vc (V) (max.) (@A) IR (uA) (max.) CT (pF) (max.) SD03C 2A 3.3 4.0 1 7.5 13.0 20 40 450 SD05C AB 5.0 6.0 1 9.8 18.0 17 10 200 SD08C 2C 8.0 8.5 1 13.4 24.0 15 2 120 SD12C 2D 12.0 13.3 1 19.0 32.0 11 1 75 SD15C 2J 15.0 16.7 1 24.0 38.0 10 1 68 SD18C 2K 18.0 20.0 1 29.0 45.0 9 1 57 SD20C 2L 20.0 22.3 1 35.0 50.0 8 1 52 SD24C 2H 24.0 26.7 1 43.0 52.0 7 1 50 SD36C 2N 36.0 40.0 1 60.0 75.0 5 1 35 xxC-SERIES SD Package outline Pin Configuration

Ordering Information

 Device: SDxxC  Package: SOD-323  Material: Halogen free  Packing: Tape & Reel  Quantity per reel: 3,000pcs

ELECTRICAL CHARACTERISTICS CURVE PACKAGE OUTLINE Plastic surface mounted package Symbol Min.(mm) Max.(mm) A 1.000 A1 0.000 0.100 A2 0.800 0.900 b 0.250 0.350 c 0.080 0.150 D 1.200 1.400 E 1.600 1.800 E1 2.500 2.700 L 0.475REF L1 0.250 0.400 θ 0º 8º xxC-SERIES SD