SCWL201610R24MTF SOCAY | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 5

Technical content

Features

Applications

Wire-wound Type Power Inductor Revision February 12, 2014 2 / 5 @ SOCAY Electronics Co., Ltd. 2014 Specifications are subject to change without notice. Please refer to www.socay.com for current information. SCWL201610 Series SOCAY Electronics Co., Ltd. www.socay.com DC Resistance RDC (mΩ) Saturation Current Isat (A) Heat Rating Current Irms (A) Part Number Initial Inductance Li (μH) @1mA Typical Maximum Typical Maximum Typical Maximum Note: 1. All test data is referenced to 25 ºC ambient. 2. Inductance is measured by LCR meter, Test frequency at 1MHz 3. Inductance Tolerance: ±20%. 4. Isat: DC current that will cause L0 to drop approximately 30% at ambient 25 ºC. 5. Idc: DC current that will cause an approximate T or 40 ºC△ . 6. Rating Current: Value as listed is either the saturation current or the heating current, whichever is smaller. 7. The part temperature (Ambient + temp rise) should not exceed 125 ºC under worse case operating condition.

Electrical Characteristics

0.25 0.2 0.15 0.1 0.05 DC Bias (A) SCWL201610R24MTF Inductance (μH) 100 Temp. Rising (ºC) Inductance (μH) Temp. Rising (ºC) 0 1 2 3 4 5 0.5 0.4 0.3 0.2 0.1 DC Bias (A) SCWL201610R47MTF Inductance (μH) 100 Temp. Rising (ºC) Inductance (μH) Temp. Rising (ºC) 0 0.5 1 1.5 2 2.5 3 3.5 4 1.2 0.8 0.4 0.2 DC Bias (A) SCWL2016101R0MTF Inductance (μH) 100 0.6 Temp. Rising (ºC) Inductance (μH) Temp. Rising (ºC) DC Bias (A) SCWL201610R68MTF Inductance (μH) Temp. Rising (ºC) 0 0.5 1 1.5 2 2.5 3 3.5 4 0.7 0.6 0.5 0.4 0.3 100 0.1 0.2 Inductance (μH) Temp. Rising (ºC) 0 0.5 1 1.5 2 2.5 3 2.5 1.5 0.5 DC Bais (A) SCWL2016102R2MTF Inductance (μH) 100 Temp. Rising (ºC) Inductance (μH) Temp. Rising (ºC)

Wire-wound Type Power Inductor Revision February 12, 2014 3 / 5 @ SOCAY Electronics Co., Ltd. 2014 Specifications are subject to change without notice. Please refer to www.socay.com for current information. SCWL201610 Series SOCAY Electronics Co., Ltd. www.socay.com Symbol 252010 W 8.00±0.3 P 4.00±0.10 E 1.75±0.10 F 3.50±0.05 D 1.55±0.05 P 4.00±0.10 P0 4.00±0.10 P2 2.00±0.05 A0 1.80±0.10 B0 2.20±0.10 K0 1.15±0.10 t 0.22±0.05 Part Size (EIA Size) Packaging Option Quantity 2016 7″Reel 3,000 Unit: mm The Contents of a box： 2016: 6 reels / inner box Tape Specifications Reel Specifications & Packaging Direction of Feed

Wire-wound Type Power Inductor Revision February 12, 2014 4 / 5 @ SOCAY Electronics Co., Ltd. 2014 Specifications are subject to change without notice. Please refer to www.socay.com for current information. SCWL201610 Series SOCAY Electronics Co., Ltd. www.socay.com Reflow Condition Pb free assembly -Temperature Min (Ts(min)) +150°C -Temperature Max (Ts(max)) +200°C Pre Heat -Time (min to max) (TS) 60 -180 Seconds Average ramp up rate ( Liquidus Temp TL) to peak 3°C/Second Max TS(max) to TL - Ramp-up Rate 3°C/Second Max - Temperature (TL) (Liquidus) +217°C Reflow - Time (min to max) (TL) 60 -150 Seconds Peak Temperature (TP) 260 +0/-5°C Time within 5°C of actual peak Temperature (TP) 20-40 Seconds Ramp-down Rate 6°C/Second Max Time 25°C to peak Temperature (TP) 8 minutes Max Note that this product will be easily damaged by rapid heating, rapid cooling or local heating. Do not give heat shock over 100°C in the process of soldering. We recommend to take preheating and gradual cooling Soldering gun procedure Note the follows, in case of using solder gun for replacement. 1) The tip temperature must be less than 280 for the period within 3 seconds by using soldering gun under 30W 2) The soldering gun tip shall not touch this product directly. Soldering volume Note that excess of soldering volume will easily get crack the body of this product. Core Material: Iron End termination: Ni / Sn Unit: mm L W T E Do not exceed to bend the board after soldering this product extremely. (reference examples) l Mounting place must be as far as possible from the position, which is close to the break line of board, or on the line of large holes of board. l Do not bend extremely the board, in mounting another component. If necessary, use back-up pin (support pin) to prevent from bending extremely. l Do not break the board by hand. We recommend to use the machine or the jig to break it. A B C 0.9 2.0 1.6 Unit: mm Soldering Parameters Precaution for Soldering Ramp-down Preheat Critical Zone TL to TP Time to peak temperature (t 25℃ to peak) TP TL TS(max) TS(min) Temperature Ramp-up Time Construction & Dimensions Precaution for Handling of Substrate Recommended Pad Layout L T E E W

Wire-wound Type Power Inductor Revision February 12, 2014 5 / 5 @ SOCAY Electronics Co., Ltd. 2014 Specifications are subject to change without notice. Please refer to www.socay.com for current information. SCWL201610 Series SOCAY Electronics Co., Ltd. www.socay.com Test Item Test Condition Criteria Resistance to Solder Heat 1. Solder temperature : 260 ±5℃ 2. Flux : Rosin 3. DIP time : 10 ±1 sec 1. More than 95 % of terminal electrode should be covered with new solder 2. No mechanical damage 3. Induction value should be within ±20 % of the initial value Adhesive Test 1. Reflow temperature : 245 It shall be ℃ Soldered on the substrate applying direction parallel to the substrate 2. Apply force(F) : 5 N 3. Test time : 10 sec 1. No mechanical damage 2. Soldering the products on PCB after the pulling test force > 5 N Temperature Cycle 1. Temperature : -50 ~ +125 for 30 ℃ minutes each 2. Cycle : 500 cycles 3. Measurement : At ambient temperature 24 hours after test completion 1. No mechanical damage 2. Induction value should be within ±20 % of the initial value Dry Heat Test 1. Temperature : 85 ±5℃℃ 2. Test time : 500 hours 3. Apply current : full rated current 4. Measurement : At ambient temperature 24 hours after test completion 1. No mechanical damage 2. Induction value should be within ±20 % of the initial value Humidity Test 1. Temperature : 60 ±2℃℃ 2. Humidity : 90 ~ 95 % RH 3. Apply current : full rated current 4. Test time : 500 hours 5. Measurement : At ambient temperature 24 hours after test completion 1. No mechanical damage 2. Induction value should be within ±20 % of the initial value Reliability and Test Condition