DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 3
Technical content
Features
For mobile phones, personal digital assistants, digital still cameras, compact audio equipment
Applications
Memory Stick Micro™ Standard mount Surface mounting type Push-push type 250V AC 1minute Applicable media Structure Items Specifications Media ejection structure Mounting type Mounting style ʵ25ˆ to ʴ60ˆ 1,000MЊ min. 40mЊ max. 12,000cycles Operating temperature range Performance Contact resistance ʢInitialʣ Insertion and removal cycle Voltage proof Insulation resistance ʢInitialʣ Typical Specifications Standard mount Media ejection structure Push-push type Mounting system Stand-offʢmmʣ Product No. SCNA1A0300 Packing system Taping Product Line Connector for Memory Stick Micro™ SCNA Series
microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick™ For Memory Stick Micro™ Combine Type For Express Card™ For Compact Flash™ For PC cards supporting CardBus For CMOS Camera Module Connector for Memory Stick Micro™ SCNA Series /K4E/K6F /K70/K61/K72/K74/K73 /K61/K72/K65/K61 /K47/K72/K6F/K75/K6E/K64 /K70/K61/K74/K74/K65/K72/K6E /K70/K6F/K73/K73/K69/K62/K6C/K65 /K61/K72/K65/K61 /K4E/K6F /K50/K61/K74/K74/K65/K72/K6E /K61/K72/K65/K61 /K4C/K61/K6E/K64 /K61/K72/K65/K61 /K31/K34/K2E/K37 /K31/K33/K2E/K32 /K39/K2E/K31/K35 /K37/K2E/K38 /K35/K2E/K39/K35 /K33/K2E/K38/K35 /K31/K2E/K34 /K31/K31/K2D/K30/K2E/K36 /K36/K2E/K37/K32 /K30/K2E/K39 G/K31/K30/K3D/K39 /K35/K2E/K39/K32 /K36/K2E/K35/K37 /K37/K2E/K36/K32 /K37/K2E/K37/K37 /K36/K2E/K35/K37 /K34/K2E/K34/K37 /K33/K2E/K30/K37 /K33/K2E/K31/K32 /K50/K30/K2E/K39 /K37/K2E/K37/K37 /K31/K33/K2E/K39 /K31/K32/K2E/K33/K35 /K31/K30/K2E/K37/K35 /K31/K30/K2E/K34/K35 /K37/K2E/K38/K35 /K34/K2E/K37 /K32/K2E/K37 /K31/K35/K2E/K35 /K31/K34/K2E/K39 /K32/K2E/K39 /K30/K2E/K33 /K31/K2E/K33/K34/K2D/K31/K2E/K32 /K37/K2E/K31/K37/K2E/K31 /K37/K2E/K39/K32 /K36/K2E/K35/K37 /K34/K2E/K34 /K32/K2E/K38 /K32/K2E/K30/K31 /K30/K2E/K34/K31 (16.9) 14.9 1.8 13.95 0.75 0.3 0.9G10=9 0.9P 3.12 0.80.9 0.41 2.8 4.4 2.01 1.1 0.7511 0.75 12.05 13.95 0.33 Card eject travel (4) Over travel (1) Card center Connector center Dimensions PC board mounting hole dimensions ʢViewed from the mounting face sideʣ Unit:mm Style
microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ Combine Type For Express Card™ For Compact Flash™ For PC cards supporting CardBus For CMOS Camera Module For Memory Stick™ Soldering Conditions Example of Reflow Soldering ConditionʢReferenceʣ 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2П CAʢKʣor CCʢTʣ. 3. Temperature profileʢSurface of productsʣ 200 100 240ˆ(max.) 230ˆ(min.) 150ˆ 180ˆ Time (s) 10 sec.(max.)90ʶ30 sec. Room temperature Temperature (˚C ) Pre-heating Heating time sec. 1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice. Cautions for using this product Small Memory Card Connectors