SCM2000MKF

SCM2000MKF SANKEN | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 44

Technical content

Datasheet sections

Features

• Bare Lead Frame: Pb-free (RoHS Compliant)
• Isolation Voltage: 2500 V (for 1 min)
• Built-in Thermistor
• Built-in Bootstrap Diodes
• CMOS-compatible Input (3.3 V or 5 V)
• Fault Signal Output at Protection Activation
• Shutdown Signal Input
• Selectable OCP Hold Time (SELECT Pin: 34 µs, 8 ms)
• Protections Include: Undervoltage Lockout for Power Supply VBx Pin (UVLO_VB): Auto-restart VCCx Pin (UVLO_VCCx): Auto-restart Overcurrent Protection (OCP): Auto-restart Overvoltage Protection (OVP): Auto-restart Typical Application VCC1 W U FO COM2 LIN3 LIN2 LIN1 HIN3 HIN2 HIN1 VBB V OCP LS3 LS2 RS Controller M VDC HIN3 HIN2 HIN1 LIN3 LIN2 LIN1 Fault GND LS1 VCC COM1 VCC2 SELECT SD High-side MIC Low-side MIC THM2 THM1 5 V or 3.3 V Tem p. Tem p. HS3 VB3 HS2 VB2 HS1 VB1

23 VCC1

Pin Pitch: 1.27 mm Mold Dimensions: 47 mm × 19 mm × 4.4 mm Not to scale Selection Guide

• Power Device: IGBT + FRD (600 V) Part Number IO SCM2007MKF 20 A SCM2008MKF 30 A

Applications

For motor drives such as:

• Refrigerator Compressor Motor
• Air Conditioner Compressor Motor
• Washing Machine Main Motor
• Fan Motor
• Pump Motor

SCM2000MKF-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 3 Nov. 12, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018

SCM2000MKF-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 4 Nov. 12, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 1. Absolute Maximum Ratings Current polarities are defined as follows: current going into the IC (sinking) is positive current (+); current coming out of the IC (sourcing) is negative current (−). Unless specifically noted, TA = 25 °C, COM1 = COM2 = COM. Parameter Symbol Conditions Rating Unit Remarks Main Supply Voltage (DC) VDC VBB–LSx 450 V Main Supply Voltage (Surge) VDC(SURGE) VBB–LSx 500 V IGBT Breakdown Voltage VCES VCC = 15 Vm, IC = 1 mA, VIN = 0 V 600 V Logic Supply Voltage VCC VCCx–COM 20 V VBS VBx–HSx 20 V Output Current(1) IO TC = 25 °C, Tj < 150 °C 20 A SCM2007MKF

30 SCM2008MKF

Output Current (Pulse) IOP TC = 25 °C, PW ≤ 1 ms, single pulse

40 A SCM2007MKF

60 SCM2008MKF

Input Voltage VIN HINx–COM, LINx–COM −0.5 to 7 V FO Pin Voltage VFO FO–COM −0.5 to 7 V SELECT Pin Voltage VSEL SELECT–COM −0.5 to 7 V SD Pin Voltage VSD SD–COM −0.5 to 7 V OCP Pin Voltage VOCP OCP–COM −10 to 7 V Operating Case Temperature(2) TC(OP) −30 to 100 °C Junction Temperature(3) Tj 150 °C Storage Temperature Tstg −40 to 150 °C Isolation Voltage(4) VISO(RMS) Between surface of heatsink side and each pin; AC, 60 Hz, 1 min 2500 V (1) Should be derated depending on an actual case temperature. See Section 15.4. (2) Refers to a case temperature measured during IC operation. (3) Refers to the junction temperature of each chip built in the IC, including the monolithic ICs (MICs), transistors, and freewheeling diodes. (4) Refers to voltage conditions to be applied between the case and all pins. All pins have to be shorted.

SCM2000MKF-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 5 Nov. 12, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 2. Recommended Operating Conditions Unless specifically noted, COM1 = COM2 = COM. Parameter Symbol Conditions Min. Typ. Max. Unit Remarks Main Supply Voltage VDC VBB–LSx — 300 400 V Logic Supply Voltage VCC VCCx–COM 13.5 — 16.5 V VBS VB1–U, VB2–V, VB3–W 13.5 — 16.5 V Input Voltage (HINx, LINx, FO, SELECT, SD) VIN 0 — 5.5 V Minimum Input Pulse Width tIN(MIN)ON 0.5 — — μs tIN(MIN)OFF 0.5 — — μs Dead Time of Input Signal tDEAD 1.5 — — μs FO Pin Pull-up Resistor RFO 1 — 22 kΩ FO Pin Pull-up Voltage VFO 3.0 — 5.5 V FO Pin Noise Filter Capacitor CFO 0.001 — 0.01 μF SELECT Pin Pull-up Resistor RSEL 1 — 22 kΩ SELECT Pin Pull-up Voltage VSEL 3.0 — 5.5 V SELECT Pin Noise Filter Capacitor CSEL 0.001 — 0.01 μF SD Pin Pull-up Resistor RSD_U VBB = 500 V(1) 465.3 470.0 474.3 kΩ SD Pin Pull-donw Resistor RSD_D 1.782 1.800 1.818 kΩ THM Pin Pull-up Resistor RTHM 4.4 — — kΩ THM Pin Noise Filter Capacitor CTHM 0.1 — — μF Bootstrap Capacitor CBOOT 10 — 220 μF Shunt Resistor RS IP ≤ 40 A 13.5 — — mΩ SCM2007MKF IP ≤ 60 A 9 — — SCM2008MKF RC Filter Resistor(2) RO — 100 — Ω RC Filter Capacitor(2) CO — 0.01 — μF PWM Carrier Frequency fC — — 20 kHz Operating Case Temperature TC(OP) — — 100 °C (1) Refers to the application where overvoltage detection takes place when the VBB pin voltage is 500 V. (2) Requires the time constants that satisfy the following equation (see also Section 12.3.4): RO × CO < 1.0 µs .

SCM2000MKF-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 6 Nov. 12, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 3. Electrical Characteristics Current polarities are defined as follows: current going into the IC (sinking) is positive current (+); current coming out of the IC (sourcing) is negative current (−). Unless specifically noted, TA = 25 °C, VCC = 15 V, COM1 = COM2 = COM. 3.1. Characteristics of Control Parts Parameter Symbol Conditions Min. Typ. Max. Remarks Power Supply Operation Logic Operation Start Voltage VCC(ON) VCCx–COM 9.5 10.5 11.5 V VBS(ON) VBx–HSx 9.5 10.5 11.5 V Logic Operation Stop Voltage VCC(OFF) VCCx–COM 9 10 11 V VBS(OFF) VBx–HSx 9 10 11 V Logic Supply Current ICC VCC1 = VCC2 — 2.85 — mA Total sink current of the VCC1 and VCC2 pins. IBS VBx–HSx = 15 V, HINx = 5 V; VBx pin current in 1-phase operation — 140 — μA Input Signal High Level Input Threshold Voltage (HINx, LINx, FO, SELECT) VIH 1.5 2.0 2.5 V Low Level Input Threshold Voltage (HINx, LINx, FO, SELECT) VIL 1.0 1.5 2.0 V High Level Input Current (HINx, LINx) IIH VIN = 5 V — 230 500 μA Low Level Input Current (HINx, LINx) IIL VIN = 0 V — — 2 μA Fault Signal Output FO Pin Voltage at Fault Signal Output VFOL VFO = 5 V, RFO = 10 kΩ — — 0.5 V FO Pin Voltage in Normal Operation VFOH VFO = 5 V, RFO = 10 kΩ 4.8 — — V Protection OCP Threshold Voltage VTRIP 0.475 0.500 0.525 V OCP Hold Time 1 tP1 VSELECT = 5 V 20 34 — μs OCP Hold Time 2 tP2 VSELECT = 0 V 5 8 — ms OCP Blanking Time tBK VTRIP = 1 V — 0.5 — μs SD Pin OVP Operating Voltage VSDH 1.86 1.90 1.94 V SD Pin OVP Release Voltage VSDL — 1.78 — V SD Pin Input Current ISD VSD = 5 V — 16.6 36.0 μA SD Pin Filtering Time tSD — 2.0 — μs OVP Hold Time tP_SD 20 31 — μs

SCM2000MKF-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 7 Nov. 12, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 3.2. Bootstrap Diode Characteristics Parameter Symbol Conditions Min. Typ. Max. Unit Remarks Bootstrap Diode Leakage Current ILBD VR = 600 V — — 10 μA Bootstrap Diode Forward Voltage VFB IFB = 0.15 A — 3.0 — V 3.3. Thermal Resistance Characteristics Parameter Symbol Conditions Min. Typ. Max. Unit Remarks Junction-to-Case Thermal Resistance(1) R(j-c)Q (2) 1 element operating (IGBT) — — 3 SCM2007MKF SCM2008MKF R(j-c)F (3) 1 element operating (freewheeling diode) — — 4 SCM2007MKF SCM2008MKF (1) Refers to a case temperature at the measurement point described in Figure 3-1, below. (2) Refers to steady-state thermal resistance between the junction of the built-in transistors and the case. For transient thermal characteristics, see Section 15.1. (3) Refers to steady-state thermal resistance between the junction of the built-in freewheeling diodes and the case. Measurement point 124 3325 Figure 3-1. Case Temperature Measurement Point

SCM2000MKF-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 9 Nov. 12, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 3.4.2. SCM2008MKF Parameter Symbol Conditions Min. Typ. Max. Unit Collector-to-Emitter Leakage Current ICES VCE = 600 V, VIN = 0 V — — 1 mA Collector-to-Emitter Saturation Voltage VCE(SAT) IC = 30 A, VIN = 5 V — 1.7 2.2 V Diode Forward Voltage VF IF = 30 A, VIN = 0 V — 1.9 2.4 V High-side Switching Diode Reverse Recovery Time trr VDC = 300 V, IC = 30 A, VIN = 0→5 V or 5→0 V, Tj = 25 °C, inductive load — 65 — ns Turn-on Delay Time td(on) — 960 — ns Rise Time tr — 130 — ns Turn-off Delay Time td(off) — 950 ns Fall Time tf — 90 — ns Low-side Switching Diode Reverse Recovery Time trr VDC = 300 V, IC = 30 A, VIN = 0→5 V or 5→0 V, Tj = 25 °C, inductive load — 75 — ns Turn-on Delay Time td(on) — 960 — ns Rise Time tr — 150 — ns Turn-off Delay Time td(off) — 960 ns Fall Time tf — 90 — ns

SCM2000MKF-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 11 Nov. 12, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 6. Truth Table Table 6-1 is a truth table that provides the logic level definitions of operation modes. In the case where HINx and LINx signals in each phase are high at the same time, both the high - and low -side transistors become on (simultaneous on -state). Therefore, HINx and LINx signals, the input signals for the HINx and LINx pins, require dead time setting so that such a simultaneous on-state events can be avoided. After the IC recovers from a UVLO_VCC x condition, the high- and low-side transistors resume switching, according to the input logic levels of the HINx and LINx signals (level-triggered). After the IC recovers from a UVLO_VB condition, the high-de transistors resume switching at the next rising edge of an HINx signal (edge-triggered). Table 6-1. Truth Table for Operation Modes Mode HINx LINx High-side Transistor Low-side Transistor Normal Operation L L OFF OFF H L ON OFF L H OFF ON H H ON ON External Shutdown Signal Input FO = L L L OFF OFF H L ON OFF L H OFF OFF H H ON OFF VBx Pin Undervoltage Lockout (UVLO_VB) L L OFF OFF H L OFF OFF L H OFF ON H H OFF ON VCC1 Pin Undervoltage Lockout (UVLO_VCC1) L L OFF OFF H L OFF OFF L H OFF ON H H OFF ON VCC2 Pin Undervoltage Lockout (UVLO_VCC2) L L OFF OFF H L ON OFF L H OFF OFF H H ON OFF Overcurrent Protection (OCP) L L OFF OFF H L ON OFF L H OFF OFF H H ON OFF Overvoltage Protection (OVP) L L OFF OFF H L ON OFF L H OFF OFF H H ON OFF

SCM2000MKF-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 12 Nov. 12, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 7. Block Diagram UVLOUVLOUVLOUVLO Low-side Input Logic UVLO VCC1 VB1 VB2 VB3 VBB V U LS1 FO COM2 LIN3 LIN2 LIN1 VCC2 COM1 HIN3 HIN2 HIN1 High-side Level Shift Driver OCP OCP LS2 W Shutdown LS3 SELECT SDSD Thermistor THM1 THM2 Low-side Driver HS1 HS2 HS3 High-side MIC Low-side MIC 23 21 17 24 22 18 25 26 High-side Input Logic HO3 HO2 HO1 LO3 LO2 LO1

SCM2000MKF-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 13 Nov. 12, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 8. Pin Configuration Definitions Top view Pin Number Pin Name Description

1 OCP Overcurrent protection signal input

2 COM2 Logic ground 2

3 SELECT OCP hold time setting

4 — (Pin removed)

5 FO Fault signal output and shutdown signal input

6 LIN1 Logic input for U-phase low-side gate driver

7 LIN2 Logic input for V-phase low-side gate driver

8 LIN3 Logic input for W-phase low-side gate driver

9 SD Overvoltage protection signal input

10 VCC2 Low-side logic supply voltage input

11 COM1 Logic ground 1

12 VCC1 High-side logic supply voltage input

13 HIN1 Logic input for U-phase high-side gate driver

14 HIN2 Logic input for V-phase high-side gate driver

15 HIN3 Logic input for W-phase high-side gate driver

16 COM1 (Pin trimmed) logic ground 1

17 VB3 W-phase high-side floating supply voltage input

18 HS3 W-phase high-side floating supply ground

19 — (Pin removed) 20 — (Pin removed)

21 VB2 V-phase high-side floating supply voltage input

22 HS2 V-phase high-side floating supply ground

23 VB1 U-phase high-side floating supply voltage input

24 HS1 U-phase high-side floating supply ground

25 THM1 Thermistor output 1

26 THM2 Thermistor output 2

27 VBB Positive DC bus supply voltage

28 U U-phase output

29 V V-phase output

30 W W-phase output

31 LS1 U-phase IGBT emitter

32 LS2 V-phase IGBT emitter

33 LS3 W-phase IGBT emitter

SCM2000MKF-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 14 Nov. 12, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 9. Typical Applications CR filters and Zener diodes should be added to your application as needed. This is to protect each pin against surge voltages causing malfunctions, and to avoid the IC being used under the conditions exceeding the absolute maximum ratings where critical damage is inevita ble. Then, check all the pins thoroughly under actual operating conditions to ensure that your application works flawlessly. VCC1 W U FO COM2 LIN3 LIN2 LIN1 HIN3 HIN2 HIN1 VBB V OCP LS3 LS2 5 V RS Controller M VDC HIN3 HIN2 HIN1 LIN3 LIN2 LIN1 Fault GND LS1 VCC COM1 VCC2 SELECT SD High-side MIC Low-side MIC THM2 THM1 5 V or 3.3 V Thermistor signal THM HS3 VB3 HS2 VB2 HS1 VB1 RSD_L RSD_U RTHM CTHM CS CDC OVP detection signal Thermistor signal Figure 9-1. Typical Application (OCP Hold Time: 8 ms)

SCM2000MKF-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 15 Nov. 12, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 VCC1 W U FO COM2 LIN3 LIN2 LIN1 HIN3 HIN2 HIN1 VBB V OCP LS3 LS2 5 V RS Controller M VDC HIN3 HIN2 HIN1 LIN3 LIN2 LIN1 Fault GND LS1 VCC COM1 VCC2 SELECT SD High-side MIC Low-side MIC THM2 THM1 5 V or 3.3 V Thermistor signal THM HS3 VB3 HS2 VB2 HS1 VB1 RSD_L RSD_U RTHM CTHM CS CDC OVP detection signal Thermistor signal RFO CFO Figure 9-2. Typical Application (OCP Hold Time: 34 µs)

SCM2000MKF-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 16 Nov. 12, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 10. Physical Dimensions 10.1. DIP33

• Leadform 2563 3.7 1.273.24 3.7 1.272.57 4.4 2 +0.5 A A B B 0.5 +0.2 -0.1 0.6 +0.2 -0.1 C C 0.5 +0.2 -0.1 2 +0.2 -0.1 3.71.27 43.3 1.2 2.08 17.25 0.5 0.5 (5ﾟ) (1.7) (1.54) (38.6) (11.6) φ3.2 (5ﾟ) 11.2 ±0.3 ±0.2 ±0.5 ±0.15 0.7 +0.2 -0.1 0.5 +0.2 -0.1 0.5 +0.2 -0.1 1.2 +0.2 -0.1 ±0.2 ±0.5 ±0.3 ±0.3 8×p5.1=40.8 (Lead frame center) Plan view (Root of pins) (End of pins) (End of pins) Section view of C（S=9） Pin pitch measured at root: ±0.1 Section view of B (S=9) Section view of A (S=9) Section view of D (S=9) (End of pins) 12.25±0.511.45±0.5 (End of pins) 15.95±0.5 19±0.3 NOTES:
• Dimensions in millimeters
• Bare lead frame: Pb-free (RoHS compliant)

SCM2000MKF-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 17 Nov. 12, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 10.2. Reference PCB Hole Sizes Pins 1 to 24 Pins 25 to 33 φ1.1 φ1.4 11. Marking Diagram 24 1 Part Number Lot Number : Y is the last digit of the year of manufacture (0 to 9) M is the month of the year (1 to 9, O, N, or D) DD is the day of the month (01 to 31) X is the control number 3325 J APAN YMDDX SCM200xMKF Branding Area 33 25

SCM2000MKF-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 18 Nov. 12, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 12. Functional Descriptions All the characteristic values given in this section are typical values, unless they are specified as minimum or maximum. The COM1 and COM2 pins must be externally connected on a PCB ; an electric potential across the two pins that are shorted is represented as “COM”. For pin descriptions, this section employs a notation system that denotes a pin name with the arbitrary letter “x”, depending on context. The U -, V -, and W -phases are represented as the pin numbers 1, 2, and 3, respectively. Thus, “the VBx pin” is used when referring to either of the VB1, VB2, or VB3 pin. Also, when different pin names are ment ioned as a pair (e.g., “the VBx and HSx pins”), they are meant to be the pins in the same phase. 12.1. Turning On and Off the IC The procedures listed below provide recommended startup and shutdown sequences. To turn on the IC properly, do not apply any voltage on the VBB, HINx, and LINx pins until the logic power supply, VCC, has reached a stable state (VCC(ON) ≥ 11.5 V). It is required to fully charge bootstrap c apacitors, CBOOTx, at startup (see Section 12.2.3). To turn off the IC, set the HINx and LINx pins to logic low (or “L”), and then decrease the VCC x pin voltage. 12.2. Pin Descriptions 12.2.1. VBB This is the input pin for the main supply voltage, i.e., the positive DC bus. All of the IGBT collectors of the high-side are connected to this pin. Voltages between the VBB pin and the ground (COM) should be set within the recommended range of the main supply voltage, V DC, given in Section 2. To suppress surge voltages, put a 0.01 μF to 0.1 μF bypass capacitor, C S, near the VBB pin and an electrolytic capacitor, C DC, with a minimal length of PCB traces to the VBB pin. 12.2.2. U, V, and W These pins are the outputs of the three phases, and serve as the connection terminals to the 3 -phase motor. The U, V, and W pins are internally connected to the HS1, HS2, and HS3 pins, respectively. 12.2.3. VB1, VB2, and VB3 These are the inputs of the high -side floating power supplies for the individual phases. Voltages across the VBx and HSx pins should be maintained within the recommended range (i.e., the Logic Supply Voltage, VBS) given in Section 2. In each phase, a bootstrap capacit or, C BOOTx, should be connected between the VBx and HSx pins. For proper startup, turn on the low -side transistor first, then fully charge the bootstrap capacitor, C BOOTx. For the capacitance of the bootstrap capacitors, C BOOTx, choose the values that sati sfy Equations (1) and (2). Note that capacitance tolerance and DC bias characteristics must be taken in to account when you choose appropriate values for CBOOTx. CBOOT (µF) > 800 × tL(OFF) (s) (1) 10 µF ≤ CBOOT ≤ 220 µF (2) In Equation (1), let tL(OFF) be the maximum off-time of the low -side transistor (i.e., the non -charging time of CBOOTx), measured in seconds. Even while the high- side transistor is off, voltage across the bootstrap capacitor keeps decreasing due to power dissipation in the IC. When the VBx pin voltage decreases to V BS(OFF) or less, the VBx pin undervoltage lockout (UVLO_VB) starts operating (see Section 12.3.3.1). Therefore, actual board checking should be done thoroughly to validate that voltage across the VBx pin maintains over 1 1 V (VBS > VBS(OFF)) during a low - frequency operation such as a startup period. As Figure 12-1 shows, a bootstrap diode, D BOOTx, and a current -limiting resistor, R BOOTx, are internally placed in series between the VCCx and VBx pins. When turning on the IC, be sure to turn on the low - side transistor first, then fully charge the bootstrap capacitor, C BOOTx. Table 12-1 provides reference charging times according to CBOOTx capacities. Table 12-1. CBOOTx Charging Time (Reference) CBOOTx Capacitance (µF) Charging Time, Duty = 100% (s) 10 0.5 22 0.5 47 0.5 100 1.0 220 1.0

SCM2000MKF-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 24 Nov. 12, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 12.3.3.2. VCC1 Pin Undervoltage Lockout (UVLO_VCC1) As Figure 12-17 depicts, when the VCC1 pin voltage decreases to the Logic Operation Stop Vo ltage (VCC(OFF), 10 V) or less, the VCC1 pin undervoltage lockout ( i.e., UVLO_VCC1) circuit gets activated and sets an HOx signal to logic low. When the VCC1 pin voltage increases to the Logic Operation Start Voltage (V CC(ON),

10.5 V) or more, the IC releases the UVLO_VCC1

operation. Then it resumes transmitting the HOx signal according to an input command on the HINx pin. Any fault signals are not output from the FO pin during the UVLO_VCC1 operation. In addition, the V CC1 pin has an internal UVLO_VCC1 filter of about 3 μs, in order to prevent noise-induced malfunctions. LINx HINx VCC1 HOx LOx FO VCC(OFF) VCC(ON) HOx responds to input signal. No FO output at UVLO_VCC1. UVLO release UVLO_VCC1 operation About 3 µs Figure 12-17. UVLO_VCC1 Operational Waveforms 12.3.3.3. VCC2 Pin Undervoltage Lockout (UVLO_VCC2) Figure 12-18 shows operational waveforms of the VCC1 pin undervoltage lockout operation (i .e., UVLO_VCC2). When the VCC 2 pin voltage decreases to the Logic Operation Stop Voltage (V CC(OFF), 10 V) or less, the UVLO_VCC2 circuit gets activated and sets a n LOx signal to logic low. When the VCC2 pin voltage increases to the Logic Operation Start Voltage (V CC(ON),

10.5 V) or more, the IC releases the UVLO_VCC2

condition. Then it resumes transmitting the LOx signal according to an input command on the LINx pin. During the UVLO_VCC2 operation, the FO pin becomes log ic low and sends fault signals. In addition, the VCC2 pin has an internal UVLO_VCC filter of about 3 μs, in order to prevent noise-induced malfunctions. About 3 µs LINx HINx VCC2 HOx LOx FO VCC(OFF) VCC(ON) LOx responds to input signal. UVLO_VCC2 operation Figure 12-18. UVLO_VCC2 Operational Waveforms 12.3.4. Overcurrent Protection (OCP) Figure 12-19 is an internal circuit diagram describing the OCP pin and its peripheral circuit. The OCP pin detects overcurrents with voltage across an external shunt resistor, R S. Because the OCP pin is i nternally pulled down, the OCP pin voltage increases proportionally to a rise in the current running through the shunt resistor, RS. VBB LSx COM OCP COM2 A/D RS RO CO DRS VTRIP 100 kΩ Blanking filter Output SW turn-off and QFO turn-on 0.50 µs (typ.) 2 kΩ 2 kΩ Figure 12-19. Internal Circuit Diagram of OCP Pin and Its Peripheral Circuit

SCM2000MKF-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 25 Nov. 12, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 Figure 12-20 is a timing chart that represents operation waveforms during OCP operation. When the OCP pin voltage increases to the O CP Threshold Voltage (V TRIP, 0.500 V) or more, and remains in this condition for a period of the OCP Blanking Time (t BK, 0.5 μs) or longer, the OCP circ uit is activated. When the OCP is activated, the IC puts both an LOx signal and the FO pin to logic low. The output transistors turn off as the LOx signal becomes logic low; as a result, output current decreases. Even if the OCP pin voltage falls below V TRIP, the IC holds the FO pin in the low state for a fixed OCP hold time (tP). Then, the output transistors operate according to input signals. You can select a suitable OCP hold time (t P), 34 µs or 8 ms, based on the SELECT pin connection (see Section 12.2.9). The OCP is used for detecting abnormal conditions, such as an output transistor shorted. In case short-circuit conditions occur repeatedly, the output transistors can be destroyed. To prevent such event, motor operation must be controlled by the external microcontroller so that it can immediately stop the motor when fault signals are detected. If you need to resume the motor operation thereafter, set the motor to be resumed after a lapse of ≥2 seconds. LINx HINx HOx LOx FO OCP VTRIP tBK tBK tDELAY 0.3 µs (typ.) tP tBK HOx responds to input signal. FO restarts automatically after tP. Figure 12-20. OCP Operational Waveforms For proper shunt resistor setting, your application must meet the following:

• Use the shunt resistor that has a recommended resistance, RS (see Section 2).
• Set the OCP pin input voltage to vary within the rated OCP pin voltages, VOCP (see Section 1).
• Keep the current through the output transistors below the rated output current (pulse), IOP (see Section 1). It is required to use a resistor with low internal inductance because high -frequency switching current will flow through the shunt resistor, R S. In addition, choose a resistor with allowable power dissipation according to your application. When you connect a CR filter (i.e., a pair of a filter resistor, RO, and a filter capacitor, C O) to the OCP pin, care should be taken in setting the time constan ts of R O and CO. The larger the time constant, the longer the time that the OCP pin voltage rises to V TRIP. And this may cause permanent damage to the transistors. Consequently, a propagation delay of the IC must be taken into account when you determine the time constants. For R O and CO, their time constants must be set to ≤1 µs. And place CO as close as possible to the IC with minimizing a trace length between the OCP and COMx pins. Note that overcurrents are undetectable when one or more of the U, V, and W pins or the ir traces are shorted to ground (ground fault). In case any of these pins falls into a state of ground fault, the output transistors may be destroyed. 12.3.5. Overvoltage Protection (OVP) Figure 12-21 is a circuit diagram of the SD pin and its peripheral circuit; Figure 12-22 is a timing chart representing OVP operational waveforms. The VBB pin voltage split by a resistive voltage divider, RSD_U and R SD_D, is applied to t he SD pin. The SD pin is designed with an error tolerance of ±2%, allowing a high degree of voltage detection accuracy. The higher the VBB pin voltage, the higher the SD pin voltage. When the SD pin voltage increases to the OVP Operating Voltage (V SDH, 1.90 V) or more, then remains in this condition for a period of the SD Pin Filtering Time (tSD, 2.0 μs), the OVP operation starts. When the OVP is activated, the IC puts both an LOx signal and the FO pin to logic low. Even if the SD pin voltage decreases to the OVP Release Voltage (V DSL,

1.78 V) or less, the IC keeps the FO pin to logic low for

a certain period, i.e., the OVP Hold Time (t P_SD, 31 μs). Then, the IC operates according to input signals after a lapse of tP_SD. 300 kΩ 2 kΩ VDC RSD_U SD COM2 27VBB RSD_D VSD_H/ VSD_L Blanking filter Output SW turn-off and QFO turn-on 2.0 µs (typ.)2 kΩ CDC Figure 12-21. Internal Circuit Diagram of SD Pin and Its Peripheral Circuit

SCM2000MKF-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 26 Nov. 12, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 LINx HINx SD HOx LOx FOx HOx responds to input signal. VSDH VSDL OVP operation tP_SD Figure 12-22. OVP Operational Waveforms 13. Design Notes This section also employs the notation system described in the beginning of the previous section. 13.1. PCB Pattern Layout Figure 13-1 shows a schematic diagram of a motor driver circuit. M VDC High-frequency, high-voltage current loops should be as small and wide as possible. Ground traces should be wide and short. W U VBB V LS3 LS2 LS1 High-side MIC Low-side MIC Figure 13-1. High -frequency, High-voltage Current Paths The motor driver circuit consists of current paths having high frequencies and high voltages, which also bring about negative influences on IC operation, noise interference, and power dissipation. Therefore, PCB trace layouts and component pl acements play an important role in circuit designing. Current loops, which have high frequencies and high voltages, should be as small and wide as possible, in order to maintain a low - impedance state. In addition, ground traces should be as wide and short as possible so that radiated EMI levels can be reduced. 13.2. Considerations in Heatsink Mounting The following are the key considerations and the guidelines for mounting a heatsink:

• It is recommended to use a pair of a metric screw of M3 and a plain washer of 7 mm (φ). To tighten the screws, use a torque screwdriver. Tighten the two screws firstly up to about 30% of the maximum screw torque, then finally up to 100% of the prescribed maximum screw torque. Perform appropriate tightening within the range of screw torque def ined in Section 4.
• When mounting a heatsink, it is recommended to use silicone greases. If a thermally conductive sheet or an electrically insulating sheet is used, package cracks may be occur red due to creases at screw tightening. Therefore, you should conduct thorough evaluations before using these materials.
• When applying a silicone grease, make sure that there must be no foreign substances betwee n the IC and a heatsink. Extreme care should be taken not to apply a silicone grease onto any device pins as much as possible. The following requirements must be met for proper grease application: − Grease thickness: 100 μm − Heatsink flatness: ±100 μm − Apply a silicone grease within the area indicated in Figure 13-2, below. Heatsink Thermal silicone grease application area 3.13.1 37.6 Unit: mm 5.8

5.8 M3 M3

Figure 13-2. Reference Application Area for Thermal Silicone Grease

SCM2000MKF-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 28 Nov. 12, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 Figure 14-1. Linear Approximate Equation of V CE(SAT) vs. IC Curve 14.2. IGBT Switching Loss, PSW Switching loss in an IGBT, P SW, can be calculated by Equation (4), letting I M be the effective current value of the motor: PSW = √2 π × fC × αE × IM × VDC 300 . (4) Where: fC is the PWM carrier frequency (Hz), VDC is t he main power supply voltage ( V), i.e., the VBB pin input voltage, and αE is the slope of the switching loss curve (see Section 15.3.2). 14.3. Estimating Junction Temperature of IGBT The junction temperature of an IGBT, T j, can be estimated with Equation (5): Tj = R(j−C)Q × (PON + PSW) + TC . (5) Where: R(j-c)Q is the junction -to-case thermal resistance per IGBT (°C/W), and TC is the case temperature ( °C), measured at the point defined in Figure 3-1. y = 0.108x + 0.831 y = 0.036x + 1.359 0.0 0.5 1.0 1.5 2.0 2.5 0 1 2 3 4 5 6 7 8 9 10 VCE(SAT) (V) IC (A) VCC = 15 V 75 °C 125 °C 25 °C

SCM2000MKF-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 29 Nov. 12, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 15. Performance Curves 15.1. Transient Thermal Resistance Curves Figure 15-1. Transient Thermal Resistance Curve: SCM2007MKF, SCM2008MKF 0.01 0.10 1.00 1 10 100 1000 10000 Ratio of Transient Thermal Resistance Time (ms)

SCM2000MKF-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 40 Nov. 12, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 15.5. Short Circuit SOAs (Safe Operating Areas) Conditions: VDC ≤ 400 V, 13.5 V ≤ VCC ≤ 16.5 V, Tj = 125 °C, 1 pulse. 15.5.1. SCM2007MKF 15.5.2. SCM2008MKF 100 150 200 250 300 0 1 2 3 4 5 Collector Current, IC(PEAK) (A) Pulse With (µs) Short Circuit SOA 100 150 200 250 300 350 400 0 1 2 3 4 5 Collector Current, IC(PEAK) (A) Pulse With (µs) Short Circuit SOA

SCM2000MKF-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 42 Nov. 12, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 W U VBB V LS3 LS2 C12 LS1 R15D1 R14 CN1 JP2 CN2 CN3 C16 R16 C11 C1C2C3 C10 C4C5C6 IC101 VCC1 FO COM2 LIN3 LIN2 LIN1 HIN3 HIN2 HIN1 OCP COM1 VCC2 SELECT SD HS3 VB3 HS2 VB2 HS1 VB1 24 THM2 THM1 C13 ZD2 R17 JP1 C19 C17 C20 C18 C21 R13 R12 R10R11 C22 VCC HIN3 HIN2 HIN1 LIN3 LIN2 LIN1 FO COM 5 V THM OCP U V W VBB P_GND Figure16-3. Circuit Diagram of PCB Pattern Layout Example

SCM2000MKF-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 43 Nov. 12, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 17. Typical Motor Driver Application This section contains the information on the typical motor driver application listed in the previous section, including a circuit diagram, specifications, and the bill of the materials used.

• Motor Driver Specifications IC SCM2007MKF Main Supply Voltage, VDC 300 VDC (typ.) Rated Output Power 1.5 kW
• Circuit Diagram See Figure16-3.
• Bill of Materials Symbol Part Type Ratings Symbol Part Type Ratings C1 Ceramic 1000 pF, 50 V R1 General 100 Ω, 1/8 W C2 Ceramic 1000 pF, 50 V R2 General 100 Ω, 1/8 W C3 Ceramic 1000 pF, 50 V R3 General 100 Ω, 1/8 W C4 Ceramic 1000 pF, 50 V R4 General 100 Ω, 1/8 W C5 Ceramic 1000 pF, 50 V R5 General 100 Ω, 1/8 W C6 Ceramic 1000 pF, 50 V R6 General 100 Ω, 1/8 W C7(1) Ceramic C7: 0.01 μF, 50 V R7(1) General 8.2 kΩ, 1/8 W C8 Ceramic 0.01 μF, 50 V R8 General 3.3 kΩ, 1/8 W C9 Ceramic 0.01 μF, 50 V R9 General 6.8 kΩ, 1/8 W C10 Ceramic 0.1 μF, 50 V R10 General 150 Ω, 1/2 W C11 Ceramic 1000 pF, 50 V R11 General 150 Ω, 1/2 W C12 Film 0.1 μF, 630 V R12 General 150 Ω, 1/2 W C13 Electrolytic 47 μF, 50 V R13 General 1.8 kΩ, 1/8 W C16 Ceramic 0.1 μF, 50 V R14(2) General Open C17 Ceramic 0.1 μF, 50 V R15(2) Metal plate 18 mΩ, 2 W C18 Ceramic 0.1 μF, 50 V R16 General 100 Ω, 1/8 W C19 Electrolytic 47 μF, 50 V R17(3) General Open C20 Electrolytic 47 μF, 50 V JP1(3) Jumper Open C21 Electrolytic 47 μF, 50 V JP2(1) Jumper Open C22 Ceramic 0.01 μF, 50 V CN1 Connector Equiv. to B3P5-VH-LF D1 General 1 A, 50 V CN2 Connector Equiv. to B2P3-VH(LF)(SN) DZ2 Zener VZ = 20 V, 0.5 W CN3 Connector Equiv. to B14B-XH- A(LF)(SN) IC101 IC SCM2007MKF (1) Refers to when the OCP hold time, tP = 8 ms. tP depends on the SELECT pin connection (see Section 12.2.9). When tP = 34 µs, leave C7 and R7 open and JP2 shorted. (2) Refers to a part that requires adjustment based on operation performance in an actual application. (3) Represents the pin unused despite the layout examples illustrating its installation.

SCM2000MKF-DSE Rev.1.0 SANKEN ELECTRIC CO., LTD 44 Nov. 12, 2018 https://www.sanken-ele.co.jp/en © SANKEN ELECTRIC CO., LTD. 2018 Important Notes

• All data, illustrations, graphs , tables and any other information included in this document (the “Information”) as to Sanken’s products listed herein (the “Sanken Products”) are current as of the date this document is issued . The Information is subject to any change without notice due to improvement of the Sanken Products , etc. Please make sure to confirm with a Sanken sales representative that the contents set forth in this document reflect the latest revisions before use.
• The Sanken Products are intended for use as components of general purpose electronic equipment or apparatus (such as home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). Prior to use of the Sanken Products, please put your signature, or affix your name and seal, on the specification documents of the Sanken Products and return them to Sanken. When considering use of the Sanken Products for any applications that require higher reliability (such as transportation equipment and its control systems, traffic signal control systems or equipment , disaster/crime alarm systems, various safety devices, etc.), you must contact a Sanken sales representative to discuss the suitability of such use and put your signature, or affix your name and seal, on the specification documents of the Sanken Products and return them to Sanken, prior to the use of the Sanken Products. The Sanken Products are not intended for use in any applications that require extremely high reliability such as: aerospace equipment; nuclear power control systems; and medical equipment or systems, whose failure or malfunction may result in death or serious injury to people, i.e., medical devices in Class III or a higher class as defined by relevant laws of Japan (collectively, the “Specific Applications”). Sanken assumes no liability or responsibility whatsoever for any and all damages and losses that may be suffered by you, users or any third party, resulting from the use of the Sanken Products in the Specific Applications or in manner not in compliance with the instructions set forth herein.
• In the event of using the Sanken Products by either (i) combining other products or materials or both therewith or (ii) physically, chemically or otherwise processing or treating or both the same, you must duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility.
• Although Sanken is making efforts to enhance the quality and reliability of its products, it is impos sible to completely avoid the occurrence of any failure or defect or both in semiconductor products at a certain rate. You must take, at your own responsibility, preventative measures including using a sufficient safety design and confirming safety of any equipment or systems in/for which the Sanken Products are used, upon due consideration of a failure occurrence rate and derating, etc., in order not to cause any human injury or death, fire accident or social harm which may result from any failure or malfu nction of the Sanken Products. Please refer to the relevant specification documents and Sanken’s official website in relation to derating.
• No anti-radioactive ray design has been adopted for the Sanken Products.
• The circuit constant, operation examples, circuit examples, pattern layout examples, design examples , recommended examples, all information and evaluation results based thereon, etc., described in this document are presented for the sole purpose of reference of use of the Sanken Products.
• Sanken assumes no responsibility whatsoever for any and all damages and losses that may be suffered by you, users or any third party, or any possible infringement of any and all property rights including intellectual property rights and any other rights of you, users or any third party, resulting from the Information.
• No information in this document can be transcribed or copied or both without Sanken’s prior written consent.
• Regarding the Information, no license, express, implied or otherwise, is granted hereby under any intellectual property rights and any other rights of Sanken.
• Unless otherwise agreed in writing between Sanken and you, Sanken makes no warranty of any kind, whether express or implied, including, without limitation, any warranty (i) as to the quality or performance of the Sanken Products (such as implied warranty of merchantability, or implied warranty of fitness for a particular purpose or special environment), (ii) that any Sanken Product is delivered free of claims of third parties by w ay of infringement or the like, (iii) that may arise from course of performance, course of dealing or usage of trade, and (iv) as to the Information (including its accuracy, usefulness, or reliability).
• In the event of using the Sanken Products, you must use the same after carefully examining all applicable environmental laws and regulations that regulate the inclusion or use or both of any particular controlled substances, including , but not limited to, the EU RoHS Directive, so as to be in strict compliance with such applicable laws and regulations.
• You must not use the Sanken Products or the Information for the purpose of any military applications or use, including but not limited to the development of weapons of mass destruction. In the event of exporting the Sanken Products or the Information, or providing them for non-residents, you must comply with all applicable export control laws and regulations in each country including the U.S. Export Administration Regulations (EAR) and the Foreign Excha nge and Foreign Trade Act of Japan , and follow the procedures required by such applicable laws and regulations.
• Sanken assumes no responsibility for any troubles, which may occur during the transportation of the Sanken Products including the falling thereof, out of Sanken’s distribution network.
• Although Sanken has prepared this document with its due care to pursue the accuracy thereof, Sanken does not warrant that it is error free and Sanken assumes no liability whatsoever for any and all damages and losses which may be suffered by you resulting from any possible errors or omissions in connection with the Information.
• Please refer to our official website in relation to general instructions and directions for us ing the Sanken Products, and refer to the relevant specification documents in relation to particular precautions when using the Sanken Products.
• All rights and title in and to any specific trademark or tradename belong to Sanken and such original right holder(s). DSGN-CEZ-16003