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Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
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Technical content

Features

For mobile phones, various personal digital assistants, notebook PCs.

Applications

Manual insertion/removal/Push-push type 500V AC 1minute Applicable media Structure Items Specifications Media ejection structure Mounting type Mounting style ʵ25ˆ to ʴ70ˆ 1,000MЊ min. 100mЊ max. 500mЊ max. 5,000cyclesʢSIM Card 8pinsʣ 10,000cyclesʢmicroSDTM Cardʣ SIM Card 8pins microSDTM Card Operating temperature range Performance Contact resistance ʢInitialʣ Connector contacts Detection switch Insertion and removal cycle Voltage proof Insulation resistanceʢInitialʣ Standard mount Media ejection structure Push-push type Mounting system Stand-offʢmmʣ Product No. SCHG1B0100 Packing system Taping NEW

microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick™ For Memory Stick Micro™ Combine Type For Express Card™ For Compact Flash™ For PC cards supporting CardBus For CMOS Camera Module Combine Type Connector (for SIM Card 8pins, microSD™ Card) SCHG Series Dimensions Unit:mm Style /K4E/K6F /K70/K61/K74/K74/K65/K72/K6E /K61/K72/K65/K61 /K4C/K61/K6E/K64 /K61/K72/K65/K61 /K39/K2D /K30/K2E/K38 /K31/K2E/K38 /K31/K38/K2E/K30/K34/K35 /K30/K2E/K38 /K31/K2E/K35 /K30/K2E/K38 /K32/K2D /K30/K2E/K34 /K32/K2D /K31/K2E/K31 /K38/K2E/K38 /K50/K3D /K31/K2E/K31 /K31/K36/K2E/K39 /K37 /K30/K2E/K35/K32 /K31/K2E/K38 /K32/K2D/K52 /K30/K2E/K35/K35 /K32/K2D/K52 /K30/K2E/K32 /K31/K2E/K30/K35 /K30/K2E/K33/K35/K31/K37/K2E/K33/K34/K35/K48/K6F/K6C/K65 /K4C/K61/K6E/K64 /K39/K2D /K30/K2E/K38 /K30/K2E/K35/K35/K35 /K33/K2E/K30/K39/K35 /K35/K2E/K30/K38/K35 /K36/K2E/K30/K38/K35 /K38 /K39/K2E/K32/K39/K35 /K38/K2E/K31/K37/K35 /K31/K2E/K31 /K31/K2E/K38 /K30/K2E/K35/K39/K35 /K31/K2E/K37/K34/K35 /K32/K2E/K38/K39/K35 /K34/K2E/K30/K34/K35 /K35/K2E/K31/K39/K35 /K36/K2E/K38/K35 /K37/K2E/K37/K35 /K34/K2E/K35/K34/K35 PC board mounting hole dimensions ʢViewed from the mounting face sideʣ PIN ASSIGMENTS CONNECTOR PIN No. PIN CONNECTOR PIN No. PIN TERMINAL No. LAYOUT TERMINAL No. LAYOUT No.1 microSD No.1 DAT 2 No.9 SIM No.C1 VCC No.2 microSD No.2 CD/DAT3 No.10 SIM No.C2 RST No.3 microSD No.3 CMD No.11 SIM No.C3 CLK No.4 microSD No.4 VDD No.12 SIM No.C4 RESERVED No.5 microSD No.5 CLK No.13 SIM No.C5 GND No.6 microSD No.6 VSS No.14 SIM No.C6 VPP No.7 microSD No.7 DAT0 No.15 SIM No.C7 I/O No.8 microSD No.8 DAT1 No.16 SIM No.C8 RESERVED /K53/K49/K4D /K43/K41/K52/K44/K43/K4F/K4E/K4E/K45/K43/K54/K4F/K52 /K43/K45/K4E/K54/K45/K52 /K53/K49/K4D /K43/K41/K52/K44 /K43/K45/K4E/K54/K45/K52 /K43/K4F/K4E/K4E/K45/K43/K54/K4F/K52 /K43/K45/K4E/K54/K45/K52 /K6D/K69/K63/K72/K6F/K53/K44/KAA /K43/K41/K52/K44 /K43/K45/K4E/K54/K45/K52 /K6D/K69/K63/K72/K6F/K53/K44/KAA /K43/K41/K52/K44 /K28/K30/K2E/K31/K29 /K30/K2E/K35/K39/K35 /K31/K2E/K37/K34/K35 /K31/K36/K2E/K32 /K32/K2E/K38/K39/K35 /K34/K2E/K30/K34/K35 /K35/K2E/K31/K39/K35 /K39/K2D/K30/K2E/K34 /K30/K2E/K35/K35/K35 /K33/K2E/K30/K39/K35 /K35/K2E/K30/K38/K35 /K36/K2E/K30/K38/K35 /K39/K2E/K30/K39/K35 /K38/K2E/K39/K39/K35 /K30/K2E/K38 /K31/K2E /K34 /K34/K2E/K32/K34/K35 /K30/K2E/K37/K37/K50/K3D/K31/K2E/K31 /K31/K37/K2E/K34/K35 /K38/K2E/K38 /K31/K36/K2E/K36/K32 /K31/K2E/K34 /K28/K37/K2E/K39/K29 /K39/K2D/K30/K2E/K34 /K28/K33/K2E/K35/K29/K45/K4A/K45/K43/K54 /K54/K52/K41/K56/K45/K4C /K28/K31/K29/K4F/K56/K45/K52 /K54/K52/K41/K56/K45/K4C /K28/K31/K2E/K34/K29 /K30/K2E/K35 /K37 /K31/K33 /K43/K38/K43/K37/K43/K36/K43/K35 /K43/K34/K43/K33/K43/K32/K43/K31 /K30/K2E/K38 /K36/K2E/K38/K35 /K4E/K6F/K2E 1 /K4E/K6F/K2E 2 /K4E/K6F/K2E 3 /K4E/K6F/K2E 4 /K4E/K6F/K2E 5 /K4E/K6F/K2E 6 /K4E/K6F/K2E 7 /K4E/K6F/K2E 8 /K4E/K6F/K2E !3 /K4E/K6F/K2E 9 /K4E/K6F/K2E !0/K4E/K6F/K2E !1 /K4E/K6F/K2E !4 /K4E/K6F/K2E !6 /K4E/K6F/K2E !2 /K4E/K6F/K2E !5 /K4E/K6F/K2E !7 /K4E/K6F/K2E !8 /K43/K38/K43/K37/K43/K36/K43/K35 /K43/K34/K43/K33/K43/K32/K43/K31

microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ Combine Type For Express Card™ For Compact Flash™ For PC cards supporting CardBus For CMOS Camera Module For Memory Stick™ Soldering Conditions Example of Reflow Soldering ConditionʢReferenceʣ 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2П CAʢKʣor CCʢTʣ. 3. Temperature profileʢSurface of productsʣ 200 100 240ˆ(max.) 230ˆ(min.) 150ˆ 180ˆ Time (s) 10 sec.(max.)90ʶ30 sec. Room temperature Temperature (˚C ) Pre-heating Heating time sec. 1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice. Cautions for using this product Small Memory Card Connectors