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Technical content
Features
For mobile phones and personal digital assistants ˔
Applications
microSD™ Card Standard mount Surface mounting type Manual insertion/removal 500V AC 1minute Applicable media Structure Items Specifications Media ejection structure Mounting type Mounting style ʵ20ˆ to ʴ70ˆ 1,000MЊ min. 100mЊ max. 10,000cycles Operating temperature range Performance Contact resistance ʢInitialʣ Insertion and removal cycle Voltage proof Insulation resistance ʢInitialʣ Typical Specifications Standard mount Media ejection structure Manual insertion/removal Mounting system Stand-off ʢmmʣ Packing system Taping Product No. SCHD1A0101 Product Line
microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ Combine Type For Express Card™ For Compact Flash™ For PC cards supporting CardBus For CMOS Camera Module For Memory Stick™ Pitch 7-1.1 10.95 6.55 10.1 1.9 8.6 2.652 7.6 7.6 6.156.15 13.1 3.2 8-0.8 No pattern area Land area No parts area 8-0.3 12.5 Pitch 7-1.1 11.1 3.2 14.6 9.80 3.65 13.20 ʢ15ʣ 4-1.4 11.95 1.6 0.1 Dimensions PC board mounting hole dimensions ʢViewed from the mounting face sideʣ Unit:mm Style Connector for microSD™ Card (Header Type) SCHD Series
microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ Combine Type For Express Card™ For Compact Flash™ For PC cards supporting CardBus For CMOS Camera Module For Memory Stick™ Soldering Conditions Example of Reflow Soldering ConditionʢReferenceʣ 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2П CAʢKʣor CCʢTʣ. 3. Temperature profileʢSurface of productsʣ 200 100 240ˆ(max.) 230ˆ(min.) 150ˆ 180ˆ Time (s) 10 sec.(max.)90ʶ30 sec. Room temperature Temperature (˚C ) Pre-heating Heating time sec. 1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice. Cautions for using this product Small Memory Card Connectors