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Technical content
Features
PCs and personal digital assistants ˔
Applications
ʵ25ˆU Pʴ70ˆ 1,000MЊ min. 100mЊ max. 500mЊ max. 5,000cycles Operating temperature range Performance Contact resistance ʢInitialʣ Connector contacts Detection switch Insertion and removal cycle Voltage proof Insulation resistanceʢInitialʣ Typical Specifications Product Line Standard mount Media ejection structure Mounting style Stand-off ʢmmʣ Product No. SCGC1B0101 Packing system Taping NEW
microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ Combine Type For Express Card™ For Compact Flash™ For PC cards supporting CardBus For CMOS Camera Module For Memory Stick™ 21.222.4 0.8P= 3.65 8.5 9.045 10.35 9.2 9.045 10.35 3.455 6.045 9.2 3.59 11.47 25.77 4.6 4.60.6 13.77 26.77 1.3 1.3 2.6 0.180.86 :Land area :No parts area :No pattern area Eject stroke(3.5) Over travel(0.3) Card lock(1.3) 3.59 25.77 (1.23) 3-0.8 Pitch 11.47 21.22 3.65 8.5 2.4 26.77 4-4 2-2 19.94 8-0.3 0.17 18.44 2-0.7 Card center Connector center C3 C2 C7 C6 Common Card detect switch1.55 Dimensions PC board mounting hole dimensions ʢViewed from the mounting face sideʣStyle Connector for SIM Card 8pins SCGC Series Unit:mm
microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ Combine Type For Express Card™ For Compact Flash™ For PC cards supporting CardBus For CMOS Camera Module For Memory Stick™ Soldering Conditions Example of Reflow Soldering ConditionʢReferenceʣ 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2П CAʢKʣor CCʢTʣ. 3. Temperature profileʢSurface of productsʣ 200 100 240ˆ(max.) 230ˆ(min.) 150ˆ 180ˆ Time (s) 10 sec.(max.)90ʶ30 sec. Room temperature Temperature (˚C ) Pre-heating Heating time sec. 1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice. Cautions for using this product Small Memory Card Connectors