SCGB1005B102EPF SOCAY | Alldatasheet
Document overview
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Technical content
Features
Applications
e.g.: 600=60 Ω, 121=120Ω
Revision February 13, 2014 2 / 4 @ SOCAY Electronics Co., Ltd. 2014 Specifications are subject to change without notice. Please refer to www.socay.com for current information. SCGB1005-B Series SOCAY Electronics Co., Ltd. www.socay.com Part Number Impedance (Ω) ±25% Test Freq. (MHz) DCR (Ω) (Max.) Rated Current (mA) SCGB1005B601FPF 600 100 0.60 300 SCGB1005B102EPF 1000 100 1.00 200 SCGB1005B152DPF 1500 100 1.50 150 Test Level：250 mV Test Instruments： l HP4291B RF IMPEDANCE / MATERIAL ANALYZER l HP4338A/B MILLIOHM METER l Agilent 8720ES S-PARAMETER NETWORK ANALYZER l HP6632B SYSTEM DC POWER SUPPLY ** For special part number which is not shown in the above table, please refer to appendix. For lead free solder Unit: mm Symbol 1005 (EIA 0402) L 1.00±0.10 W 0.50±0.10 T 0.50±0.10 E 0.25±0.10 Construction & Dimensions Recommended Soldering Conditions
Electrical Characteristics
60~120 Second ≥30 Second 60~150 Second Time (sec.) Temperature ()℃ L T E E W
Revision February 13, 2014 3 / 4 @ SOCAY Electronics Co., Ltd. 2014 Specifications are subject to change without notice. Please refer to www.socay.com for current information. SCGB1005-B Series SOCAY Electronics Co., Ltd. www.socay.com Unit: mm Size A B C Symbol 1005 Paper W 8.00±0.10 P 2.00±0.05 E 1.75±0.05 F 3.50±0.05 D 1.55±0.05 D1 NA P 4.00±0.10 P010 NA P2 2.00±0.05 A0 0.62±0.03 B0 1.12±0.03 K0(T) 0.60±0.03 t NA Part Size(EIA Size) Packaging Option Quantity 1005 (0402) 7″Reel 10,000 The Contents of a box： 1005 (0402): 6 reels / inner box Tape Specifications Recommended Pad Layout Reel Specifications & Packaging Direction of Feed PLASTIC CARRIER PAPER CARRIER
Revision February 13, 2014 4 / 4 @ SOCAY Electronics Co., Ltd. 2014 Specifications are subject to change without notice. Please refer to www.socay.com for current information. SCGB1005-B Series SOCAY Electronics Co., Ltd. www.socay.com Test item Test condition Criteria Temperature Cycle a. Temperature : -40 ~ +85℃ b. Cycle : 100 cycles c. Dwell time : 30minutes Measurement : at ambient temperature 24 hrs after test completion a. No mechanical damage b. Induction value should be within ±20 % of the initial value Operational Life a. Temperature : 125 ±5℃℃ b. Test time : 1000 hrs c. Apply current : full rated current Measurement : at ambient temperature 24 hrs after test completion a. No mechanical damage b. Induction value should be within ±20 % of the initial value Biased Humidity a. Temperature : 40 ±2℃℃ b. Humidity : 90 ~ 95 % RH c. Test time : 1000 hrs d. Apply current : full rated current Measurement : at ambient temperature 24 hrs after test completion a. No mechanical damage b. Induction value should be within ±20 % of the initial value Resistance to Solder Heat a. Solder temperature : 260±5℃ b. Flux : Rosin c. DIP time : 10±1 sec a. More than 95 % of terminal electrode should be covered with new solder b. No mechanical damage c. Induction value should be within ±20 % of the initial value Adhesive Test a. Reflow temperature : 245 It shall be Soldered on ℃ the substrate applying direction parallel to the substrate b. Apply force(F) : 5 N Test time : 10 sec a. No mechanical damage b. Soldering the products on PCB after the pulling test force > 5 N Rated Current Test a. Apply current : full rated current / 5min Temperature rise should be less than 25℃ Steam Aging Test a. Temperature : 93℃ b. Test time : 4hrs Others: 8hrs c. Solder temperature : 235±5 ℃ d. Flux : Rosin e. DIP time : 5±1 sec More than 95 % of terminal electrode should be covered with new solder Reliability and Test Condition