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Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
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Technical content
Features
For compact audio equipment, personal digital assistants, desktop PCs and notebook PCs For home audio equipment (TVs, set top boxes and recorders) For digital camcorders, digital still cameras, and headphone players
Applications
ʵ20ˆU Pʴ60ˆ 1,000MЊ min. 40mЊ max. 12,000cycles Operating temperature range Performance Contact resistance ʢInitialʣ Insertion and removal cycle Voltage proof Insulation resistance ʢInitialʣ Typical Specifications Media ejection structure Push-push type Mounting system Standard mount Stand-off ʢmmʣ Product No.Packing system Tray SCEC1B0100 Product Line ESD (electro-static discharge) protection model whose robust structure achieves high reliability.
Opening groove taper Opening groove taper Mounting datum plane (10) (1.2) Locked position Media full length(50) (53.85) (12.95) 246.6 2-3.2 2-3.2 6.6 27.4 (11.675) 3.72-0.9 Media width for media insertion 21.65 0.8 1.95 1 40.9 2-2.1Over stroke Media outline Card center Media eject stroke
4 Frame
Full height 4.1 10-0.5 9-1.5 (5.525) 10.2 0.45 Guide bosses 2-0.9 C0.3 (11.975) 1.5 For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick™ For Memory Stick Micro™ Combine Type For Express Card™ For Compact Flash™ For PC cards supporting CardBus For CMOS Camera Module PC board mounting hole dimensions ʢViewed from the mounting face sideʣ (˞)2.5 min. NJO ˞ NJO NJO NJO ˞ NJO (˞)39.7 min. (˞)37.2 max. Pad 4 Pad 4 2.4 32.6 Pad 8.6 17.5 Pad 2.4 Pad 10-0.9 Pad 2.4 Pitch 9-1.5 Center of #1-Pad #10#1 9.3 (˞Dimensions) no parts Media outline mounting area Card center 22.5 17.5 29.85 2-ø1.6 holes Unit:mm Style Dimensions With boss standard mouth Connector for Memory Stick™ SCEC Series
microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ Combine Type For Express Card™ For Compact Flash™ For PC cards supporting CardBus For CMOS Camera Module For Memory Stick™ Soldering Conditions Example of Reflow Soldering ConditionʢReferenceʣ 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2П CAʢKʣor CCʢTʣ. 3. Temperature profileʢSurface of productsʣ 200 100 240ˆ(max.) 230ˆ(min.) 150ˆ 180ˆ Time (s) 10 sec.(max.)90ʶ30 sec. Room temperature Temperature (˚C ) Pre-heating Heating time sec. 1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice. Cautions for using this product Small Memory Card Connectors