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Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
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Technical content

Features

For desktop PCs, notebook PCs, various personal digital assistants, digital still cameras, digital camcorders, facsimile machines and printers. For home audio equipment (TVs and set top boxes) For audio systems For headphone players

Applications

Standard mount / Reverse mount Surface mounting type Push-push type 500V AC 1minuteʢSCDE1ʣ, 250V AC 1minuteʢSCDE2ʣ Applicable media Structure Items Specifications Media ejection structure Mounting type Mounting style ʵ10ˆ to ʴ60ˆ 1,000MЊ min. 100mЊ max.ʢSCDE1ʣ, 150mЊ max.ʢSCDE2ʣ 500mЊ max.ʢSCDE1ʣ, 600mЊ max.ʢSCDE2ʣ 10,000cyclesʢSD Memory Card, xD-Picture CardTMʣ 12,000cyclesʢMemory StickTMʣ SD Memory Card MultiMediaCard™ xD-Picture CardTM Operating temperature range Performance Contact resistance ʢInitialʣ Connector contacts Detection switch Insertion and removal cycle Voltage proof Insulation resistanceʢInitialʣ Standard mount Reverse mount Media ejection structure Push-push type Mounting system Stand-offʢmmʣ Product No. SCDE1C0200 SCDE2B0100 Drawing No. Packing system Tray Combine Type Connector (for SD Memory Card, MultiMediaCard™, Memory Stick™, xD-Picture Card™) SCDE Series

microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick™ For Memory Stick Micro™ Combine Type For Express Card™ For Compact Flash™ For PC cards supporting CardBus For CMOS Camera Module Combine Type Connector(for SD Memory Card, MultiMediaCard™, Memory Stick™, xD-Picure Card™) SCDE Series PC board mounting hole dimensions ʢViewed from the mounting face sideʣ 15.5 6.25 10.475 13.7 33.25 1.4 9.3 14.55 3.15 26.6 1.55 9.2 13.95 25.5 0.9 19.375 8.65 27(P1.5ʷ18) 15(P1ʷ15) 28.75 19-0.6 17.175 7.5 4.95 13.025 14.9 ø2 6.65 29.7 8.35 16.7 16.05 19-1.1 10.475 (hole) (hole) Land No pattern area ø1.55 0.95 2.2 5.3 2.8 1.5 0.65 0.75 5.7 7.255 6.275 7.5258.475 6.65 1.1 1414 1.5 30.175 36.25 39.25 0.65 0.65 0.95 2.25 No pattern area No pattern exposure area 2.25 0.95 14.1 14.1 4.5 6 ø 1.7 hole ø 1.5hole ø 3.5 Unit:mm No. Style Dimensions Card center Connector center (5.5) 48.1 (5) 4.5 ø1.5 SD No.6 MS No.3 MS No.4 SD No.5 MS No.2 Ground SD No.4 MS No.5 SD No.8 MS No.!0 SD No.7 MS No.8 (for SD) WP switch xD No.!7 MS No.7 xD No.!5 xD No.!6 xD No.7 SD No.9 xD No.8 xD No.5 xD No.0 (CD for xD) xD No.6 xD No.2 xD No.3 SD No.3 xD No.4 xD No.9 xD No.!3 xD No.!4 SD No.2 SD No.1 MS No.9 xD No.!2 xD No.!1 MS No.6 xD No.!0 xD No.1 MS No.1 xD No.!8 (1.2)Over travel Locked position Eject position Common (for SD) CD switch (for SD) 0.9750.2 4.9 5.1 4.6 15.85 15.85 23.6 4.75 47.7 21.29.7 (5.5) Lock Position (5) Eject Position (1.2) Over travel 30.5 MS, SD card center 2-П1.3 1.775 43.95 Connector center On the card entry side, the metal exposed part is connected to terminal No.9 of the xD card. SD No.2 SD No.9 SD No.1 SD No.3 SD No.4 MS No.8 MS No.9 MS No.7 MS No.!0 MS No.6 MS No.3 MS No.2 MS No.4 MS No.1 MS No.5 SD No.8 SD No.7 Dummy SD No.6 Dummy SD No.5 CD Switch for SD Common for SD WP Switch for SD GND xD No.1 xD No.0 xD No.2 xD No.3 xD No.6 xD No.7 xD No.8 xD No.9 GND for xD xD No.4 xD No.5 xD No.!8 xD No.!7 xD No.!6 xD No.!5 xD No.!3 xD No.!2 xD No.!1 xD No.!0 xD No.!4 Y%DBSEDFOUFS %VNNZ %VNNZ

microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ Combine Type For Express Card™ For Compact Flash™ For PC cards supporting CardBus For CMOS Camera Module For Memory Stick™ Soldering Conditions Example of Reflow Soldering ConditionʢReferenceʣ 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2П CAʢKʣor CCʢTʣ. 3. Temperature profileʢSurface of productsʣ 200 100 240ˆ(max.) 230ˆ(min.) 150ˆ 180ˆ Time (s) 10 sec.(max.)90ʶ30 sec. Room temperature Temperature (˚C ) Pre-heating Heating time sec. 1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice. Cautions for using this product Small Memory Card Connectors