SC70-5 ZETEX | Alldatasheet
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www.zetex.com © Zetex Semiconductors plc 2005 Surface mounted, 5 pin package Package outline Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches Nominal weight Nominal weight per device 14mg. Tape and reel information Dim. Millimeters Inches Dim. Millimeters Inches Min. Max. Min. Max. Min. Max. Max. Max. A 0.80 1.10 0.0315 0.0433 E
2.10 BSC
0.0826 BSC
0.10 0.0039
1.25 BSC
0.0492 BSC
0.80 1.00 0.0315 0.0039 e
0.65 BSC
0.0255 BSC
b 0.15 0.30 0.006 0.0118
1.30 BSC
0.0511 BSC
C 0.08 0.25 0.0031 0.0098 L 0.26 0.46 0.010 0.018 D
2.00 BSC
0.0787 BSC
(mm) Reel size (inches) No. of components Tape option indicator 3,000 TA 10,000 TC
www.zetex.com © Zetex Semiconductors plc 2005 Embossed carrier tape configuration Dimensions mm (inches) Tape size (mm) A0, B0, K0 See note* NOTES: A0, B0 and K0 dimensions are determined with respect to EIA/JEDEC rotational and lateral movement requirements (see fig. 1). See note* See note* See note* B1 (max.) 4.55 (0.179) 8.20 (0.323) 12.10 (0.476) 20.10 (0.791) D 1.50 + 0.10 - 0.00 1.50 + 0.10 - 0.00 1.50 + 0.10 - 0.00 1.50 + 0.10 - 0.00 D1 (max.) 1.00 (0.039) 1.50 (0.059) 1.50 (0.059) 1.50 (0.059) E 1.75 ± 0.10 1.75 ± 0.10 1.75 ± 0.10 1.75 ± 0.10 F 3.50 ± 0.10 (0.138 ± 0.004) 5.50 ± 0.05 (0.217 ± 0.002) 7.50 ± 0.10 (0.295 ± 0.004) 11.50 ± 0.10 (0.453 ± 0.004) P 4.00 ±0.10 (0.157 ± 0.004) 4.00 ±0.10 (0.157 ± 0.004) 8.00 ±0.10 (0.315 ± 0.004) 4.00 ± 0.10 (0.157 ± 0.004) 8.00 ±0.10 (0.315 ± 0.004) 12.00 ± 0.10 (0.472 ± 0.004) 4.00 ± 0.10 (0.157 ± 0.004) to 20.00 ± 0.10 (0.787 ± 0.004) in 4.00 (0.157) increments 4.00 ± 0.10 4.00 ± 0.10 4.00 ± 0.10 4.00 ± 0.10 2.00 ± 0.05 2.00 ± 0.05 2.00 ± 0.05 2.00 ± 0.05 t (max.) 0.40 0.40 0.40 0.40 W 8.00 (0.315) 12.00 ± 0.30 (0.472 ± 0.012) 16.30 (0.642) 24.30 (0.957) D K t P Center lines of cavity 10 pitches culmulative tolerance on tape ±0.2mm (±0.008”) User direction of feed Embossment Top cover tape See Note 1 See Note 1 See Note 1 W F E 20° maximum 0.5mm maximum 0.5mm maximum Component lateral movement Component cavity center line 20° maximum Component center line Component rotation - top view Component rotation - side view
www.zetex.com © Zetex Semiconductors plc 2005 This publication is issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contact or be regarded as a representation relating to the products or services concerned. The company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service. Reel configuration Tape size A (max.) B (min.) C D (min.) N (min.) G T (max.) 8mm 179 (7.047) 1.5 (0.06) 13.00 ±0.02 (0.512 ±0.008) 25.0 (0.984) (1.969) 8.4 +1.5 –0.0 14.4 (0.567) 12mm 330 (12.992) 1.5 (0.06) 13.00 ±0.02 (0.512 ±0.008) 20.2 (0.795) (1.969) 12.4 +2.0 –0.0 18.4 (0.724) 16mm 330 (12.992) 1.5 (0.06) 13.00 ±0.02 (0.512 ±0.008) 20.2 (0.795) (1.969) 16.4 +2.0 –0.0 22.4 (0.882) 24mm 330 (12.992) 1.5 (0.06) 13.00 ±0.02 (0.512 ±0.008) 20.2 (0.795) (2.362) 24.4 +2.0 –0.0 30.4 (1.197) Full radius Tape slot in core for tape start. 2.5mm min. width, 10mm min. depth G T N C D A B