SC630ULTRT

SC630 SEMTECH | Alldatasheet

Document overview

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• PDF pages: 14

Technical content

Features

Input voltage range — 2.9V to 5.5V VOUT tolerance 3.3V ±3% VOUT regulation (line + load) ±2% Continuous output current — 400mA Peak output current — 500mA Three charge pump modes — 1x, 1.5x and 2x Output ripple ≤ 20mVpp for IOUT ≤ 400mA Short circuit, over-voltage, and over-temperature protection Soft-start functionality Shutdown current — 0.1μA, typical Ultra thin package — 2 x 2 x 0.6 (mm) Fully WEEE and RoHS compliant

Applications

Compact fl ash/CF+ products PMPs Digital video cameras Digital still cameras PDAs

Description

The SC630 is a high-current voltage regulator using Semtech’s proprietary low-noise charge pump technol- ogy. Performance is optimized for use in single Li-Ion battery cell applications. The regulator provides the per- formance of a linear, low drop-out (LDO) voltage regulator when the battery is greater than 3.3V. Unlike an LDO, drop-out is avoided when the battery is less than 3.3V. Instead, a charge pump is activated to provide voltage boost — the head-room needed for voltage regulation. Only two 2.2 μF bucket capacitors are required to deliver the full output current. The charge pump provides a low EMI solution compared to inductive buck/boost regulators. The SC630’s charge pump has three modes of operation: 2x, 1.5x, and 1x modes. The 2x and 1.5x modes deliver current to the load in each of two phases. The 1x mode turns off the charge pump, delivering current through an LDO. When active, the charge pump provides low-ripple operation at 200kHz, which is typically less than 20mVpp at the output. The SC630 is capable of delivering 400mA continuous current, with peak current to 500mA. A 22 μF output capacitor of is used for decoupling the load and for smoothing mode transitions. Hysteresis is provided to prevent chatter between charge pump modes. The micro lead-frame package is both small and thermally effi cient, measuring 2 x 2 x 0.6 (mm). SC630 VBAT VOUT = 3.3V @ 400mA OUT C1+ IN GND EN C1- C2+ C2- CIN 22μF COUT 22μF 2.2μF 2.2μF Chip enable Typical Application Circuit May 28, 2008 Patents Pending

Ordering Information

SC630ULTRT(1)(2) MLPD-UT-8 2x2 SC630EVB Evaluation Board Notes: (1) Available in tape and reel only. A reel contains 3,000 devices. (2) Lead-free package only. Device is WEEE and RoHS compliant. TOP VIEW T 4 5 C2+ C2- OUT EN GND C1+ C1- IN 630 yw MLPD-UT-8; 2x2, 8 LEAD θJA = 68°C/W yw = Datecode

Exceeding the above specifi cations may result in permanent damage to the device or device malfunction. Operation outside of the parameters specifi ed in the Electrical Characteristics section is not recommended. NOTES (1) Tested according to JEDEC standard JESD22-A114-B. (2) Calculated from package in still air, mounted to 3 x 4.5 (in), 4 layer FR4 PCB with thermal vias under the exposed pad per JESD51 standards. Absolute Maximum Ratings Recommended Operating Conditions Thermal Information Parameter Symbol Condition Min Typ Max Units Input Supply Voltage V IN 2.9 5.5 V Output Voltage V OUT VIN = 4.2V, IOUT = 1mA 3.2 3.3 3.4 V Output Voltage Ripple V PP IOUT ≤ 400mA 20 mV Maximum Output Current I OUT Peak Load - thermally limited(1), TJ <150°C, 2.85V ≤ VIN ≤ 5.5V 500 mA Continuous Load, 3.1V ≤ VIN ≤ 5.5V, 1x or 1.5x mode 400 mA Shutdown Current I SD Shutdown (EN = GND), VIN = 3.6V 0.1 2 μA Total Quiescent Current I Q EN high, 1x mode, IOUT = 1mA, VIN = 4.2V 1.5 2.0 mA EN high, 1.5x or 2x mode, IOUT = 1mA, VIN = 3.3V 1.5 2.5 mA Charge Pump Frequency f PUMP VIN = 3.2V 140 200 260 kHz Start-Up Time t SU (EN transitions from low to high), 3.2V ≤ VOUT ≤ 3.4V, No load 400 μs Line Regulation ΔV LINE IOUT = 1mA, 2.85V ≤ VIN ≤ 4.2V 21 mV Load Regulation ΔV LOAD VIN Fixed, 1mA ≤ IOUT ≤ 500mA 25 mV

Electrical Characteristics

Parameter Symbol Condition Min Typ Max Units EN Input High Threshold V IH VIN = 5.5V 1.6 V EN Input Low Threshold V IL VIN = 2.7V 0.4 V EN Input High Current I IH VIN = 5.5V 2 μA EN Input Low Current I IL VIN = 5.5V 2 μA Open-Loop Output Resistance R OUT 1x mode 0.3 Ω 1.5x mode, VIN = 3.15V 3 Ω 2x mode, VIN = 2.93V 2.4 Ω Mode Transition Voltage (2) VTRANS 1X IOUT = 300mA 3.3 V VTRANS 1.5X IOUT = 300mA 2.93 V Fault Protection Short-Circuit Current I SC VOUT = 0V, IOUT = IIN 300 600 980 mA Input Current Limit I LIMIT 1x mode 0.6 1.2 2.0 A 1.5x and 2x modes 1.2 2.0 2.8 A VOUT ≤ 2V, IOUT = IIN 700 mA Over Temperature (3) TOTP Rising Threshold 165 °C THYS Hysteresis 20 °C Electrical Characteristics (continued) Notes: (1) Thermal limitation is dependent upon the thermal performance of the printed circuit board in support of the package standar d of 68° C/W. (2) Voltage at the IN pin where a mode transition takes place in the charge pump with V IN falling. (3) Guaranteed by design - not tested in production.

Output Current (mA) Output Voltage Variation — ΔVLOAD (mV) TA=85°C TA=25°C TA=-40°C VOUT = 3.3V, VIN = 3.6V -20 -15 -10 Input Voltage (V) VOUT = 3.3V, IOUT = 1mA 85°C 3.6V, 0mV 25°C -40°C Output Voltage Variation — ΔVLINE (mV) 100 0 90 180 270 360 450 Load Current (mA) Efficiency (%) VOUT = 3.3V VIN = 3.4V VIN = 3.6V VIN = 3.8V VIN = 4.0V Effi ciency versus Load Current Line Regulation PSRR — 1x Mode PSRR — 1.5x Mode -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 10 100 1000 10000 Frequency (Hz) Gain (dB) VIN = 3.2V, VOUT = 3.3V, IOUT = 50mA -100 -90 -80 -70 -60 -50 -40 -30 -20 -10 10 100 1000 10000 Frequency (Hz) Gain (dB) VIN = 4.2V, VOUT = 3.3V, IOUT = 50mA CIN=COUT=22μF (0805) C1=C2=2.2μF (0603) CIN=COUT=22μF (0805) C1=C2=2.2μF (0603)

Typical Characteristics (continued) Effi ciency — 10mA Effi ciency — 50mA Effi ciency — 200mA Effi ciency — 100mA Effi ciency — 400mA Effi ciency — 300mA 100Efficiency(%) VOUT = 3.3V, IOUT = 10mA Input Voltage (V) 1x Mode 1.5x Mode Mode Transition Hysteresis 100Efficiency(%) Input Voltage (V) VOUT = 3.3V, IOUT = 50mA 1x Mode 1.5x Mode Mode Transition Hysteresis 100Efficiency(%) VOUT = 3.3V, IOUT = 100mA Input Voltage (V) 1x Mode 1.5x Mode Mode Transition Hysteresis 100Efficiency(%) Input Voltage (V) VOUT = 3.3V, IOUT = 200mA 1x Mode 1.5x Mode 2x Mode Mode Transition Hysteresis Input Voltage (V) VOUT = 3.3V, IOUT = 400mA 1x Mode 1.5x Mode 2x Mode 100Efficiency(%) Mode Transition Hysteresis 100Efficiency(%) Input Voltage (V) VOUT = 3.3V, IOUT = 300mA 1x Mode 1.5x Mode 2x Mode Mode Transition Hysteresis

Ripple — 1x Mode Time (10μs/div) VIN -PP (20mV/div) VOUT -PP (20mV/div) IOUT (200mA/div) VIN=3.6V, VOUT=3.3V, IOUT=400mA CIN=COUT=22μF (0805) C1=C2=2.2μF (0603) Ripple — 1.5x Mode Ripple — 2x Mode VIN -PP (100mV/div) VOUT -PP (50mV/div) IOUT (200mA/div) VIN -PP (50mV/div) VOUT -PP (50mV/div) IOUT (200mA/div) Time (10μs/div) Time (10μs/div) CIN=COUT=22μF (0805) C1=C2=2.2μF (0603) CIN=COUT=22μF (0805) C1=C2=2.2μF (0603) 0mA 400mA VIN=3.2V, VOUT=3.3V, IOUT=400mA VIN=2.85V, VOUT=3.3V, IOUT=400mA 0mA 400mA 0mA 400mA Startup (No Load) VIN=3.6V, IOUT=0mA VEN (2V/div)– 0V— VOUT (2V/div)– 0V— IOUT (200mA/div)– 0V— Startup (400mA) VIN=3.6V, IOUT=400mA VEN (2V/div)– 0V — VOUT (2V/div)– 0V— IOUT (200mA/div)– 0V— Typical Characteristics (continued) CIN=COUT=22μF (0805) C1=C2=2.2μF (0603) CIN=COUT=22μF (0805) C1=C2=2.2μF (0603) Time (200μs/div) Time (200μs/div) Quiescent Current 0.75 1.00 1.25 1.50 1.75 2.00 2.25 VOUT = 3.3V, IOUT = 1mA 25°C 85°C -45°C VIN (V) IQ(mA)

1 GND Ground — connect to ground plane with multiple vias

2 C1+ Positive terminal of bucket capacitor 1

3 C1- Negative terminal of bucket capacitor 1

4 IN Input supply voltage

— active-high

6 OUT Output

7 C2+ Positive terminal of bucket capacitor 2

8 C2- Negative terminal of bucket capacitor 2

T Thermal Pad This pad is for heat sinking and is not connected internally. It must be connected to a ground plane using multiple vias.

The SC630 is a 3.3V output charge pump regulator designed to support up to 400mA (TA ≤ 85°C, 3.15V ≤ VIN ≤ 5.5V) of continuous current. It is used for powering Micro HDDs (Hard Disk Drives) and other 3.3V devices in porta- ble handheld equipment including Compact Flash and CF+ products. The SC630 has three operating modes — 1x, 1.5x, and 2x. The 1x mode is a linear series regulation mode with a low output resistance of only 300m Ω. The 1x mode functions as a low noise series linear regulator. The 1.5x and 2x modes are a low noise constant frequency, constant duty cycle switch mode, using two bucket capacitors. One bucket supports the full output current while the other bucket charges from the input. The two buckets exchange roles in the next phase, supplying continuous output current in both phases and reducing the need for a large output decoupling capacitor. The constant frequency, constant duty cycle operation also produces predictable constant frequency harmonics. Mode Transition Hysteresis Hysteresis is provided to prevent chatter between charge pump modes for input steps of up to 120mV. Decouple the input to prevent steps greater than 120mV, for optimum transient performance, when the input voltage reaches the mode transition thresholds. Thermal Resistance The SC630 package is thermally effi cient when the circuit board layout connects the thermal pad through multiple vias to the ground plane. The thermal resistance is depen- dent upon the connection between the thermal pad and the ground plane. A layout that is done correctly should keep the junction temperature below the over-tempera- ture limit while operating the SC630 within the specifi ed electrical conditions. A poor layout may allow the junc- tion temperature to reach the ov er temperature limit, so it is important to maintain adequate ground plane around the device to maximize heat transfer to the PCB. Temperature Derating The load current and battery voltage range of the applica- tion should be compared with the efficiency plots on page 6 to determine if 2x mode is required by the appli- cation. The data provided in the following derating curve for 2x mode is based on the peak power dissipation that could occur while in 2x mode. 1x and 1.5x modes do not require derating. 100 150 200 250 300 350 400 450 35 45 55 65 75 85 95 105 Ambient Temperature (°C) IOUT (mA) Derating for applications requiring only 1x and 1.5x modesDerating for applications requiring 2x mode Maximum Continuous Output Protection Circuitry The SC630 also provides protection circuitry that pre- vents the device from operating in an unspecifi ed state. These functions include: Over-Current Protection (OCP) Short-Circuit Current Protection (SCCP) Over-Temperature Protection (OTP) Over-Current Protection Over-current protection is provided to limit the output current. When V OUT is greater than 2V, OCP limits the output to 1A typical. The threshold at 2V allows the device to recover from excessive voltage droop during an over current. Short-Circuit Current Protection Short-circuit current protection is provided to limit the current that can be sourced when the output is shorted to ground. When a short circuit forces V OUT to drop below 2V, the SCCP detects the condition and limits the output current to 250mA (typical). Applications Information

Over-Temperature Protection The over-temperature circuit helps prevent the device from overheating and experiencing a catastrophic failure. When the junction temperature exceeds 165°C the device is disabled. It remains disabled until the junction tempera- ture drops below this threshold. Hysteresis is included that prevents the device from re-enabling until the junc- tion temperature is reduced by 20°C. Capacitor Selection The SC630 is designed to use low-ESR ceramic capacitors for the input and output bypass capacitors as well as the charge pump bucket capacitors. Ideal performance is achieved when the bucket capacitors are exactly equal. The value of input and output decoupling capacitors will vary with system requirements. C IN and COUT are normally 22μF and the bucket capacitors C 1 and C 2 are 2.2μF. For low profi le designs, two parallel 10μF capacitors may be used in place of each 22μF. For applications with load currents below 100 mA, the bucket capacitors may be reduced to 1μF and the input and output capacitors may be reduced to 10μF. The fol- lowing table lists recommended capacitor values. Note that the smallest available capacitor packages have very poor DC voltage characteristics. 0402 and 0603 size capacitors may be as low as 50% of rated value at 3.3V. Applications Information (continued) The following capacitors are recommended for best per- formance. Use only X5R ceramic with a voltage rating of 6.3V or higher. Table 1 — Recommended Capacitors Capacitor Value μF Case Size Notes CIN , COUT 22 0805 Typical output VPP ≤ 20mV in all charge pump modes Typical input ripple ≤ 100mV in all charge pump modes CIN , COUT 10 0805 Typical performance is similar to the 22uF if 0805 capacitor size is used, due to the weaker DC volt- age coeffi cient of the 22uF 0805. C IN , COUT 10 0603 Typical output VPP as high as 75mV in boosting charge pump modes Typical input ripple as high as 175mV in boosting charge pump modes For a lower profi le design, two 10uF 0603’s may be substituted in place of one 10uF or 22uF 0805. Two are needed, due to the weaker DC voltage coeffi cient of the 0603 package size. C BUCKET 2.2 0603 Required for the full rated output current CBUCKET 2.2 0402 Useful for load current up to 300mA CBUCKET 1.0 0402 Useful for load current up to 100mA NOTE: Use only X5R type capacitors, with a 6.3V rating or higher The highest capacitance values in the smallest package sizes tend to have poor DC voltage characteristics. The highest value 0402 size capacitor retains as little as 35% of its rated value at 5VDC. The same value chosen in the next larger package size (0603) retains about 60% of its rated value at 5VDC.

Applications Information (continued) PCB Layout Considerations Poor layout can degrade the performance of the regula- tor and can be a contributory factor in EMI problems, ground bounce, thermal issues, and resistive voltage losses. Poor regulation and instability can result. The following design rules are recommended: Place the bucket capacitors as close to the device as possible and on the same side of the board. Use short wide copper areas between the capacitor pins and the device pins. Place the input and output decoupling capacitors as close as possible to the device and connect these capacitors’ ground pads together to the ground plane using multiple vias through a short wide copper area. Connect pin 1 directly to the copper area under the thermal pad. The thermal pad at the center of the device is not electrically connected. Connect this pad to the ground plane using multiple vias. Use a ground plane to further reduce noise interference on sensitive circuit nodes. COUT EN IN CIN SC630 OUT C2+ C2- C1+ C1- GND C2GND EN

2.00.079 PIN 1 INDICATOR (LASER MARK) SEATING PLANE C B A aaa C N E 2.10 2.10 1.90 1.90 .083 .083 .075 .075 D e/2 e bxN bbb C A B COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.2. D/2 E/2 E LxN INCHES .020 BSC b .007 bbb aaa N L e D .012 DIM A MIN .000 .020 0.400.30 .004 .003 .014 .079 .016 0.08 0.10 0.35 2.00

0.50 BSC

0.05 0.60 DIMENSIONS MIN 0.00 NOM (.006) MAX .002 .024 NOM 0.50 (0.1524) CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). NOTES: A Outline Drawing — MLPD-UT-8 2x2

Power Management Products Division

200 Flynn Road, Camarillo, CA 93012

Phone: (805) 498-2111 Fax: (805) 498-3804 www.semtech.com Contact Information SC630 Land Pattern — MLPD-UT-8 2x2 INCHES DIMENSIONS P Z X Y C G DIM MILLIMETERS FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR FUNCTIONAL PERFORMANCE OF THE DEVICE. SHALL BE CONNECTED TO A SYSTEM GROUND PLANE. THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD3. H .067 1.70 K .031 0.80 R .006 0.15 Y R G Z P X (C) 1. CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES). H K .030 .106 (.077) .047 0.75 2.70 (1.95) 1.20 0.30 0.50.020 .012 THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY. CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR COMPANY'S MANUFACTURING GUIDELINES ARE MET. NOTES: