SC1105-01UTG LITTELFUSE | Alldatasheet

Document overview

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Technical content

Features

  • ESD, IEC 61000-4-2, ±30kV contact, ±30kV air
  • EFT , IEC 61000-4-4, 40A (5/50ns)
  • Lightning, IEC 61000- 4-5 2nd edition, 80A (tP=8/20μs, SC1105)
  • Low clamping voltage
  • Low leakage current
  • Moisture Sensitivity Level(MSL -1)
  • Lead free and RoHS compliant
  • Switches / Buttons
  • Test Equipment / Instrumentation
  • Point-of-Sale Terminals
  • Medical Equipment
  • Notebooks / Desktops / Servers
  • Computer Peripherals Pinout and Functional Block Diagram Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. RoHS Pb GREENSC11xx Series Discrete Unidirectional TVS Diode PIN1 PIN2 SC11xx Series

©2020 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 10/16/20 TVS Diode Arrays (SPA® Diodes) General Purpose Surge Protection - SP11xx Series Notes: CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Absolute Maximum Ratings Symbol Parameter Value Units TOP Operating Temperature -40 to 125 °C TSTOR Storage Temperature -55 to 150 °C Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage VRWM IR=1μA 5.0 V Breakdown Voltage VBR IR=1mA 6.0 7. 5 V Reverse Leakage Current ILEAK VR=5V 1. 0 μA Clamp Voltage1 VC IPP=40A, tp=8/20µs, Fwd 9.3 V IPP=80A, tP=8/20μs, Fwd 11. 8 V Dynamic Resistance2 RDYN TLP , tP=100ns, I/O to GND 0.04 Ω Peak Pulse Current Ipp tp=8/20µs 80 A ESD Withstand Voltage1 VESD IEC 61000-4-2 (Contact Discharge) ±30 kV IEC 61000-4-2 (Air Discharge) ±30 kV Diode Capacitance1 CI/O-GND Reverse Bias=0V , f=1MHz 660 pF Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage VRWM IR=1μA 15.0 V Breakdown Voltage VBR IR=1mA 16.7 V Reverse Leakage Current ILEAK VR=15V 1. 0 μA Clamp Voltage1 VC IPP=30A, tp=8/20µs, Fwd 27 .4 V Dynamic Resistance2 RDYN TLP , tP=100ns, I/O to GND 0.09 Ω Peak Pulse Current Ipp tp=8/20µs 30.0 A ESD Withstand Voltage1 VESD IEC 61000-4-2 (Contact Discharge) ±30 kV IEC 61000-4-2 (Air Discharge) ±30 kV Diode Capacitance1 CI/O-GND Reverse Bias=0V , f=1MHz 180 pF SC11xx Series

©2020 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 10/16/20 TVS Diode Arrays (SPA® Diodes) General Purpose Surge Protection - SP11xx Series Parameter Symbol Test Conditions Min Typ Max Units Reverse Standoff Voltage VRWM IR=1μA 22.0 V Breakdown Voltage VBR IR=1mA 23.0 V Reverse Leakage Current ILEAK VR=22V 1. 0 μA Clamp Voltage1 VC IPP=27A, tp=8/20µs, Fwd 35.5 V Dynamic Resistance2 RDYN TLP , tP=100ns, I/O to GND 0.13 Ω Peak Pulse Current Ipp tp=8/20µs 27 .0 A ESD Withstand Voltage1 VESD IEC 61000-4-2 (Contact Discharge) ±30 kV IEC 61000-4-2 (Air Discharge) ±30 kV Diode Capacitance1 CI/O-GND Reverse Bias=0V , f=1MHz 160 pF SC11xx Series Capacitance vs. BiasClamping voltage vs. IPP for 8/20μs waveshape 0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0 15 20 25 30 35 40 45 50 55 60 65 70 75 80 Clamp Voltage (VC) Peak Pulse Current-I PP(A) SC1122 SC1115 SC1105 0.0 100.0 200.0 300.0 400.0 500.0 600.0 700.0 02468 10 12 14 16 18 20 22 Capacitance (pF) Bias Voltage (V) SC1105 SC1115 SC1122 8/20μs Pulse Waveform 10% 20% 30% 40% 50% 60% 70% 80% 90% 100% 110% Time (/uni03BCs) Percent of IPP T ransmission Line Pulsing (TLP) Plot SC1122 SC1115 SC1105 0246 81 01 21 41 61 82 02 22 42 62 83 0 TLP Voltage (V) TLP Current (A) Note: 1 . Parameter is guaranteed by design and/or component characterization. 2.Transmission Line Pulse (TLP) with 100ns width, 0.2ns rise time, and average window t1=70ns to t2= 90ns

©2020 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 10/16/20 TVS Diode Arrays (SPA® Diodes) General Purpose Surge Protection - SP11xx Series SC1105 IEC 61000 -4-2 +8 kV Contact ESD Clamping Voltage SC1105 IEC 61000 -4-2 -8 kV Contact ESD Clamping Voltage SC1115 IEC 61000 -4-2 +8 kV Contact ESD Clamping Voltage SC1115 IEC 61000 -4-2 -8 kV Contact ESD Clamping Voltage SC11xx Series SC1122 IEC 61000 -4-2 +8 kV Contact ESD Clamping Voltage SC1122 IEC 61000 -4-2 -8 kV Contact ESD Clamping Voltage

©2020 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 10/16/20 TVS Diode Arrays (SPA® Diodes) General Purpose Surge Protection - SP11xx Series Time Temperature TP TL TS(max) TS(min) tP tL tS time to peak temperature PreheatPreheat Ramp-upRamp-up Ramp-downRamp-do Critical Zone TL to TP Critical Zone TL to TP Reflow Condition Pb – Free assembly Pre Heat - Temperature Min (Ts(min)) 150°C - Temperature Max (Ts(max)) 200°C - Time (min to max) (ts) 60 – 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3°C/second max TS(max) to TL - Ramp-up Rate 3°C/second max Reflow - Temperature (TL) (Liquidus) 217°C - Temperature (tL) 60 – 150 seconds Peak Temperature (TP) 260+0/-5 °C Time within 5°C of actual peak Temperature (tp) 20 – 40 seconds Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C Soldering Parameters SC11xx Series

Ordering Information

Part Number Package Marking Min. Order Qty. SC1105-01UTG 1 .6x1 .0mm DFN APFx 3000 SC1115-01UTG 1 .6x1 .0mm DFN AQFx 3000 SC1122-01UTG 1 .6x1 .0mm DFN AOFx 3000 Part Numbering SystemPart Marking System 11** 01 T G Voltage Number of Channels Package T= Tape & Reel G= Green U: 1.6x1.0mm DFN USC TVS Diode Arrays (SPA Diodes) xx F x Date code Assembly sitePart code AP = SC1105-01UTG AQ = SC1115-01UTG AO = SC1122-01UTG Part code : PIN1

©2020 Littelfuse, Inc. Specifications are subject to change without notice. TVS Diode Arrays (SPA ® Diodes) Revision: 10/16/20 TVS Diode Arrays (SPA® Diodes) General Purpose Surge Protection - SP11xx Series Package Dimensions D E L e b h h A Top View Bottom View Side View 1 2 1 2 Pin1 Recommended Soldering pad layout (mm) 1.00 0.58 1.70 0.58 Symbol 1 .6x1 .0mm DFN Millimeters Min Nor Max A 0.45 0.50 0.55 A1 - 0.02 0.05 D 1 .55 1 .60 1 .65 E 0.95 1 .00 1 .05 b 0.75 0.80 0.85 L 0.35 0.40 0.45 e 1 .10 BSC h 0.15 0.20 0.25 Embossed Carrier T ape & Reel Specification W AO P1 0.50 ±0.05 Do 1.50 0.10 0.00 2.00 0.05(I) PO 4.00 0.1(II) F(III) 1.75 0.1 Y Y X X BO KO T 0.20 0.02 SECTION Y-Y REF 3° SECTION X-X User Feeding Direction Pin 1 Location Symbol Millimeters A0 1 .14 +/- 0.03 B0 1 .75 +/- 0.03 K0 0.67 +/- 0.05 F 3.50 +/- 0.05 P1 2.00 +/- 0.10 W 8.00 +/- 0.10 ,Ref. ,Ref. ,Ref. Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics. SC11xx Series