SC105 IRF | Alldatasheet
Document overview
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Technical content
SCHOTTKY DIE 105 x 125 mils www.irf.com 1 Bulletin I0503J 12/99 NOTE: 10 mils die thickness is available on specific request only. Contact factory for information. 40 (1.57) Ø 125 (4.92) NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (INCHES). 2. CONTROLLING DIMENSION: (INCH). 3. DIMENSIONS AND TOLERANCES: Ø = 0.7 ± 0.1 (0.03 ± 0.004) 4. LETTER DESIGNATION: A = Anode (Top Metal) C = Cathode (Back Metal) D = Reject Ink Dot (only on non-conforming dies) 5. SAWING: Recommended Blade SEMITEC S1025 QS00 Blade a d Ø 0.35 ± 0.01 C A D c b (0.14 ± 0.0004) Wafer flat alligned with side b of the die NOT TO SCALE
www.irf.com SC105xxxxx5B Inked Probed Unsawn Wafer (Wafer in Box) 1150 SC105xxxxx5R Probed Die in Tape & Reel 3000 SC105xxxxx5P Probed Die in Waffle Pack 1150 SC105xxxxx5F Inked Probed Sawn Wafer on Film 1150 Device T J Max. V R Typ. IR @ 25°C Typ. I R @ 125°C Max. V F @ IF Package # (°C) (V) (µA) (mA) (V) Style SC105R015x5x 125 15 3000 n.a. contact factory SC105S020x5x 125 20 n.a. contact factory SC105S030x5x 150 30 220 100 0.49 @ 15A TO-220 SC105S045x5x 150 45 150 75 0.54 @ 15A TO-247 SC105S060x5x 150 60 110 60 0.60 @ 15A TO-247 SC105H045x5x 175 45 35 10 0.62 @ 15A TO-220 SC105H100x5x 175 100 12 7 0.86 @ 15A TO-247 SC105H150x5x 175 150 15 7 1.00 @ 15A TO-220
Electrical Characteristics
Device Metal Thickness Metal Thickness # Front Metal Back Metal SC105xxxxA5x Bondable -- Al/Si 30 kÅ -- Cr 1 kÅ Ni 4 kÅ Ag 6 kÅ SC105xxxxS5x Solderable Ti 2 kÅ Ni 6 kÅ Ag 35 kÅ Cr 1 kÅ Ni 4 kÅ Ag 6 kÅ Mechanical Data Device Description Minimum Order Quantity # Wafer in Sale Package Packaging Recommended Storage Environment: Store in original container, in dessicated nitrogen, with no contamination. Shelf life for parts stored in above condition is 2 years. If the storage is done in normal atmosphere shelf life is reduced to six months.
www.irf.com SC 105 H 100 S 5 B 1 23 1 - Schottky Die 2 - Chip Dimension in Mils 3 - Process (see Electrical Characteristics Table) 4 - Voltage code: Code = V RRM 5 - Chip surface metallization (see Mechanical Data Table) 6 - Wafer Diameter in inches 7 - Packaging (see Packaging Table) Device Code Ordering Information T able 56 7 H = 830 Process R = OR'ing Process S = Standard Process Wafer on Film STEEL FRAME
www.irf.com Wafer in Box Die in Waffle Pack ROUND CONTAINER FOAM DISK TYVEK DISK CHIP TRAY POCKET
www.irf.com EUROPEAN HEADQUARTERS:Hurst Green, Oxted, Surrey RH8 9BB, U.K. Tel: ++ 44 1883 732020. Fax: ++ 44 1883 733408. IR CANADA: 15 Lincoln Court, Brampton, Markham, Ontario L6T3Z2. Tel: (905) 453 2200. Fax: (905) 475 8801. IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg. Tel: ++ 49 6172 96590. Fax: ++ 49 6172 965933. IR ITALY: Via Liguria 49, 10071 Borgaro, Torino. Tel: ++ 39 11 4510111. Fax: ++ 39 11 4510220. IR FAR EAST: K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo, Japan 171. Tel: 81 3 3983 0086. IR SOUTHEAST ASIA: 1 Kim Seng Promenade, Great World City West Tower,13-11, Singapore 237994. Tel: ++ 65 838 4630. http://www.irf.com Fax-On-Demand: +44 1883 733420 Data and specifications subject to change without notice. T ape and Reel BARE DIE CARRIER TAPE REEL FRAME