SC0402E010M18 SOCAY | Alldatasheet
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Technical content
Features
Surface Mount Multilayer Varistor Revision November 28, 2013 2 / 5 @SOCAY Electronics Co., Ltd. 2013 Specifications are subject to change without notice. Please refer to www.socay.com for current information. SC0402E - SC0603E Series SOCAY Electronics Co., Ltd. www.socay.com SC0402E Series Rated Voltage Varistor Voltage Clamping Voltage Capacitance Part Number VDC (V) VV (V) VC (V) CP (pF) SC0402E050M05 ~5.5 7.6~12 25 5.0 SC0402E100N05 ~5.5 7.6~12 25 10 SC0402E050M09 ~9 11~17 35 5.0 SC0402E010M18 ~18 46~60 110* 1.0 SC0603E Series Rated Voltage Varistor Voltage Clamping Voltage Capacitance Part Number VDC (V) VV (V) VC (V) CP (pF) SC0603E050M05 ~5.5 7.6~12 25 5.0 SC0603E100N05 ~5.5 7.6~12 25 10 SC0603E050M09 ~9 11~17 35 5.0 SC0603E010M18 ~18 46~60 110* 1.0 VDC – Maximum DC operating voltage the varistor can maintain and not exceed 10μA leakage current. VV – Voltage across the device measure at 1mA DC current. Equivalent to V B “breakdown voltage” VC – Maximum peak current across the varistor with 8/20 μs waveform and 1A pulse current. *: Maximum peak current across the varistor with 8/20 μs waveform and 0.5A pulse current. CP – Device capacitance measured with zero volt bias 1Vrms at 1MHz. The pF is ±30%
Electrical Characteristics
Surface Mount Multilayer Varistor Revision November 28, 2013 3 / 5 @SOCAY Electronics Co., Ltd. 2013 Specifications are subject to change without notice. Please refer to www.socay.com for current information. SC0402E - SC0603E Series SOCAY Electronics Co., Ltd. www.socay.com Size EIA (EIAJ) 0402 (1005) 0603 (1608) Symbol Inches Millimeters Inches Millimeters Solder cream in reflow soldering Refer to the recommendable land pattern as printing mask pattern for solder cream. (1) Print solder in a thickness of 150 to 200 μm Size EIA (EIAJ) 0402 (1005) 0603 (1608) Symbol Inches Millimeters Inches Millimeters A 0.024 0.61 0.040 1.02 B 0.020 0.51 0.030 0.76 D 0.020 0.51 0.020 0.50 E 0.067 1.70 0.100 2.54 Precaution for handling of substrate Do not exceed to bend the board after soldering thes product extremely. (reference examples) l Mounting place must be as far as possible from the position, which is close to the break line of board or on the line of large holes of board. l Do not bend extremely the board, in mounting another component. If necessary, use back-up pin (support pin) to prevent from bending extremely. l Do not break the board by hand. We recommend to use the machine or the jig to break it. Construction & Dimensions L T C C W Pad Layouts & Precaution for handling of substrate
Surface Mount Multilayer Varistor Revision November 28, 2013 4 / 5 @SOCAY Electronics Co., Ltd. 2013 Specifications are subject to change without notice. Please refer to www.socay.com for current information. SC0402E - SC0603E Series SOCAY Electronics Co., Ltd. www.socay.com Reflow Condition Pb-Free assembly -Temperature Min (Ts(min)) +150°C -Temperature Max (Ts(max)) +200°C Pre Heat -Time (min to max) (TS) 60 -180 Seconds Average ramp up rate ( Liquidus Temp TL) to peak 3°C/Second Max TS(max) to TL - Ramp-up Rate 3°C/Second Max - Temperature (TL) (Liquidus) +217°C Reflow - Time (min to max) (TL) 60 -150 Seconds Peak Temperature (TP) 260 +0/-5°C Time within 5°C of actual peak Temperature (TP) 20-40 Seconds Ramp-down Rate 6°C/Second Max Time 25°C to peak Temperature (TP) 8 minutes Max Note that this product will be easily damaged by rapid heating, rapid cooling or local heating. Do not give heat shock over 100°C in the process of soldering. We recommend to take preheating and gradual cooling Soldering gun procedure Note the follows, in case of using solder gun for replacement. 1) The tip temperature must be less than 280 for the period within 3 seconds by using soldering gun under 30W 2) The soldering gun tip shall not touch this product directly. Soldering volume Note that excess of soldering volume will easily get crack the body of this product. Operating Temperature -40 ~ +85ºC Storage Temperature -40 ~ +85ºC Response Time <1 ns Solderability 245±5ºC, 3±1sec Solder Leach Resistance 260±5ºC, 10±1sec Solder leach resistance -40 ~ +85ºC Storage Temperature 5 ~ 40ºC Relative Humidity To 65% Taping Package Storage Condition Storage Time 12 Months max Item Specifications Test Condition Bias Humidity V△ V / VV ≤ ±10 % 90%RH, 40ºC, Working Voltage, 1000 hrs Thermal Shock V△ V / VV ≤ ±10 % -40ºC to 85ºC, 30 min. cycle, 5 cycles Full Load Voltage V△ V / VV ≤ ±10 % Working Voltage, 85ºC,1000 hrs Soldering Parameters Ramp-down Preheat Critical Zone TL to TP Time to peak temperature (t 25℃ to peak) TP TL TS(max) TS(min) Temperature Ramp-up Time General Technical Data Precaution for soldering Precaution for soldering Environmental Performance
Surface Mount Multilayer Varistor Revision November 28, 2013 5 / 5 @SOCAY Electronics Co., Ltd. 2013 Specifications are subject to change without notice. Please refer to www.socay.com for current information. SC0402E - SC0603E Series SOCAY Electronics Co., Ltd. www.socay.com Carrier Tape Dimensions Size EIA (EIAJ) 0402 (1005) 0603 (1608) Symbol Inches Millimeters Inches Millimeters Taping Reel Dimensions Unit: mm Taping Specifications There Shall be the portion having no product in both the head and the end of taping, and there shall be the cover tape in the heat of taping. Quantity of products in the taping package SIZE EIA (EIAJ) 0402 (1005) 0603 (1608) Standard Packing Quantity (PCS / reel) 10,000 4,000 The contents of a box :