BSP52T1G_V02 ONSEMI | Alldatasheet

Document overview

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Technical content

Features

  • The SOT-223 Package can be soldered using wave or reflow. The formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die
  • Available in 12 mm Tape and Reel Use BSP52T1 to Order the 7 Inch/1000 Unit Reel
  • PNP Complement is BSP62T1
  • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant
  • S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable MAXIMUM RATINGS (TC = 25°C unless otherwise noted) Rating Symbol Max Unit Collector-Emitter Voltage VCES 80 V Collector-Base Voltage VCBO 90 V Emitter-Base Voltage VEBO 5.0 V Collector Current IC 1.0 A Total Power Dissipation (Note 1) @ TA = 25°C Derate above 25°C PD 0.8 6.4 W mW/°C Total Power Dissipation (Note 2) @ TA = 25°C Derate above 25°C PD 1.25 W mW/°C Operating and Storage Temperature Range TJ, Tstg −65 to 150 °C THERMAL CHARACTERISTICS Characteristic Symbol Value Unit Thermal Resistance (Note 1) Junction-to-Ambient R/C0113JA 156 °C/W Thermal Resistance (Note 2) Junction-to-Ambient R/C0113JA 100 °C/W Maximum Temperature for Soldering Purposes Time in Solder Bath TL 260 Sec Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Device mounted on a FR-4 glass epox y printed circuit board using minimum recommended footprint. 2. Device mounted on a FR-4 glass epoxy printed circuit board using 1 cm 2 pad. Device Package Shipping †

ORDERING INFORMATION

SOT−223 CASE 318E STYLE 1 321 COLLECTOR 2,4 BASE EMITTER 3 AYW AS3/C0071 /C0071 A = Assembly Location Y = Year W = Work Week AS3 = Specific Device Code /C0071 = Pb−Free Package MEDIUM POWER NPN SILICON SURFACE MOUNT DARLINGTON TRANSISTOR BSP52T1G, SBSP52T1G SOT−223 (Pb−Free) 1000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. www.onsemi.com BSP52T3G SOT −223 (Pb−Free) 4000 / Tape & Reel (Note: Microdot may be in either location)

BSP52T1G, BSP52T3G, SBSP52T1G www.onsemi.com ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted) Characteristics Symbol Min Typ Max Unit OFF CHARACTERISTICS Collector-Base Breakdown Voltage (IC = 100 /C0109A, IE = 0) V(BR)CBO 90 − − V Emitter-Base Breakdown Voltage (IE = 10 /C0109A, IC = 0) V(BR)EBO 5.0 − − V Collector-Emitter Cutoff Current (VCE = 80 V, VBE = 0) ICES − − 10 /C0109A Emitter-Base Cutoff Current (VEB = 4.0 V, IC = 0) IEBO − − 10 /C0109A ON CHARACTERISTICS (Note 3) DC Current Gain (IC = 150 mA, VCE = 10 V) (IC = 500 mA, VCE = 10 V) hFE 1000 2000 Collector-Emitter Saturation Voltage (IC = 500 mA, IB = 0.5 mA) VCE(sat) − − 1.3 V Base-Emitter Saturation Voltage (IC = 500 mA, IB = 0.5 mA) VBE(sat) − − 1.9 V SWITCHING CHARACTERISTICS Rise Time (VCC = 10 V, IC = 150 mA, IB1 = 0.15 mA) tr − 155 − ns Delay Time (VCC = 10 V, IC = 150 mA, IB1 = 0.15 mA) td − 205 − ns Storage Time (VCC = 10 V, IC = 150 mA, IB1 = 0.15 mA, IB2 = 0.15 mA) ts − 420 − ns Fall Time (VCC = 10 V, IC = 150 mA, IB1 = 0.15 mA, IB2 = 0.15 mA) tf − 365 − ns 3. Pulse Test: Pulse Width ≤ 300 /C0109s, Duty Cycle ≤ 2.0%

SOT−223 (TO−261) CASE 318E−04 ISSUE R DATE 02 OCT 2018SCALE 1:1 /C0113 /C0113 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS 98ASB42680BDOCUMENT NUMBER: DESCRIPTION: Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 2SOT−223 (TO−261) onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2018 www.onsemi.com

www.onsemi.com SOT−223 (TO−261) CASE 318E−04 ISSUE R DATE 02 OCT 2018 STYLE 4: PIN 1. SOURCE 2. DRAIN 3. GATE 4. DRAIN STYLE 6: PIN 1. RETURN 2. INPUT 3. OUTPUT 4. INPUT STYLE 8: CANCELLED STYLE 1: PIN 1. BASE 2. COLLECTOR 3. EMITTER 4. COLLECTOR STYLE 10: PIN 1. CATHODE 2. ANODE 3. GATE 4. ANODE STYLE 7: PIN 1. ANODE 1 2. CATHODE 3. ANODE 2 4. CATHODE STYLE 3: PIN 1. GATE 2. DRAIN 3. SOURCE 4. DRAIN STYLE 2: PIN 1. ANODE 2. CATHODE 3. NC 4. CATHODE STYLE 9: PIN 1. INPUT 2. GROUND 3. LOGIC 4. GROUND STYLE 5: PIN 1. DRAIN 2. GATE 3. SOURCE 4. GATE STYLE 11: PIN 1. MT 1 2. MT 2 3. GATE 4. MT 2 STYLE 12: PIN 1. INPUT 2. OUTPUT 3. NC 4. OUTPUT STYLE 13: PIN 1. GATE 2. COLLECTOR 3. EMITTER 4. COLLECTOR A = Assembly Location Y = Year W = Work Week XXXXX = Specific Device Code /C0071 = Pb−Free Package GENERIC MARKING DIAGRAM* AYW XXXXX/C0071 /C0071 (Note: Microdot may be in either location) *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “/C0071”, may or may not be present. Some products may not follow the Generic Marking. 98ASB42680BDOCUMENT NUMBER: DESCRIPTION: Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 2 OF 2SOT−223 (TO−261) onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2018 www.onsemi.com

onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. ADDITIONAL INFORMATION TECHNICAL PUBLICATIONS: Technical Library: www.onsemi.com/design/resources/technical−documentation onsemi Website: www.onsemi.com ONLINE SUPPORT: www.onsemi.com/support For additional information, please contact your local Sales Representative at www.onsemi.com/support/sales