MBRD835L_V01 ONSEMI | Alldatasheet

Document overview

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  • PDF pages: 6

Technical content

Features

  • Low Forward V oltage
  • 150°C Operating Junction Temperature
  • Epoxy Meets UL 94 V−0 @ 0.125 in
  • Compact Size
  • Lead Formed for Surface Mount
  • SBRD8 Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable
  • These Devices are Pb−Free and are RoHS Compliant Mechanical Characteristics
  • Case: Epoxy, Molded
  • Weight: 0.4 Gram (Approximately)
  • Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable
  • Lead and Mounting Surface Temperature for Soldering Purposes: 260°C Max. for 10 Seconds
  • Shipped 75 Units Per Plastic Tube
  • ESD Rating: ♦ Machine Model = C (> 400 V) ♦ Human Body Model = 3B (> 8000 V) Device Package Shipping †

ORDERING INFORMATION

8.0 AMPERES, 35 VOLTS

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure BRD8011/D MBRD835LT4G DPAK (Pb−Free) 2,500 / Tape & Reel DPAK CASE 369C MARKING DIAGRAM B835LG = Specific Device Number A = Assembly Location* Y = Year WW = Work Week G = Pb −Free Device AYWW B 835LG MBRD835LG DPAK (Pb−Free)

75 Units / Rail

www.onsemi.com SBRD8835LG DPAK (Pb−Free) SBRD835LT4G−VF01 DPAK (Pb−Free) 2,500 / Tape & Reel SBRD8835LG−VF01 DPAK (Pb−Free) SBRD8835LT4G−VF01 DPAK (Pb−Free) 2,500 / Tape & Reel SBRD8835LT4G DPAK (Pb−Free) 2,500 / Tape & Reel * The Assembly Location Code (A) is front side optional. In cases where the Assembly Location is stamped in the package bottom (molding ejecter pin), the front side assembly code may be blank.

MBRD835L, SBRD8835L www.onsemi.com MAXIMUM RATINGS Rating Symbol Value Unit Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage VRRM VRWM VR 35 V Average Rectified Forward Current (TC = 88°C) IF(AV) 8.0 A Peak Repetitive Forward Current (Square Wave, Duty = 0.5, TC = 80°C) IFRM A Non−Repetitive Peak Surge Current (Surge applied at rated load conditions, halfwave, single phase, 60 Hz) IFSM A Repetitive Avalanche Current (Current Decaying Linearly to Zero in 1 /C0109s, Frequency Limited by TJmax) IAR 2.0 A Storage / Operating Case Temperature Tstg −65 to +150 °C Operating Junction Temperature (Note 1) TJ −65 to +150 °C Voltage Rate of Change (Rated VR) dv/dt 10,000 V//C0109s Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. The heat generated must be less than the thermal conductivity from Junction −to−Ambient: dPD/dTJ < 1/R/C0113JA. THERMAL CHARACTERISTICS Characteristic Symbol Value Unit Thermal Resistance − Junction−to−Case R/C0113JC 2.8 °C/W Thermal Resistance − Junction−to−Ambient (Note 2) R/C0113JA 80 °C/W 2. Rating applies when surface mounted on the minimum pad size recommended.

ELECTRICAL CHARACTERISTICS

Characteristic Symbol Value Unit Maximum Instantaneous Forward Voltage (Note 3) (iF = 8 Amps, TC = +25°C) (iF = 8 Amps, TC = +125°C) VF 0.51 0.41 V Maximum Instantaneous Reverse Current (Note 3) (Rated dc Voltage, TC = +25°C) (Rated dc Voltage, TC = +100°C) IR 1.4 mA Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 3. Pulse Test: Pulse Width = 300 /C0109s, Duty Cycle ≤ 2%.

DPAK (SINGLE GAUGE) CASE 369C ISSUE F DATE 21 JUL 2015 SCALE 1:1 STYLE 1: PIN 1. BASE 2. COLLECTOR 3. EMITTER 4. COLLECTOR STYLE 2: PIN 1. GATE 2. DRAIN 3. SOURCE 4. DRAIN STYLE 3: PIN 1. ANODE 2. CATHODE 3. ANODE 4. CATHODE STYLE 4: PIN 1. CATHODE 2. ANODE 3. GATE 4. ANODE STYLE 5: PIN 1. GATE 2. ANODE 3. CATHODE 4. ANODE STYLE 6: PIN 1. MT1 2. MT2 3. GATE 4. MT2 STYLE 7: PIN 1. GATE 2. COLLECTOR 3. EMITTER 4. COLLECTOR 1 2 STYLE 8: PIN 1. N/C 2. CATHODE 3. ANODE 4. CATHODE STYLE 9: PIN 1. ANODE 2. CATHODE 3. RESISTOR ADJUST 4. CATHODE STYLE 10: PIN 1. CATHODE 2. ANODE 3. CATHODE 4. ANODE b D E M0.005 (0.13) C A c C Z DIM MIN MAX MIN MAX MILLIMETERSINCHES D 0.235 0.245 5.97 6.22 E 0.250 0.265 6.35 6.73 A 0.086 0.094 2.18 2.38 b 0.025 0.035 0.63 0.89 c2 0.018 0.024 0.46 0.61 b2 0.028 0.045 0.72 1.14 c 0.018 0.024 0.46 0.61 e 0.090 BSC 2.29 BSC b3 0.180 0.215 4.57 5.46 L 0.055 0.070 1.40 1.78 L3 0.035 0.050 0.89 1.27 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCHES. 3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI- MENSIONS b3, L3 and Z. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.006 INCHES PER SIDE. 5. DIMENSIONS D AND E ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY . 6. DATUMS A AND B ARE DETERMINED AT DATUM PLANE H. 7. OPTIONAL MOLD FEATURE. 12 3 XXXXXX = Device Code A = Assembly Location L = Wafer Lot Y = Year WW = Work Week G = Pb −Free Package AYWW XXX XXXXXG XXXXXXG ALYWW DiscreteIC 5.80 0.228 2.58 0.102 1.60 0.063 6.20 0.244 3.00 0.118 6.17 0.243 /C0466mm inches/C0467SCALE 3:1 GENERIC MARKING DIAGRAM* *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. SOLDERING FOOTPRINT* H 0.370 0.410 9.40 10.41 A1 0.000 0.005 0.00 0.13 L1 0.114 REF 2.90 REF L2 0.020 BSC 0.51 BSC HDETAIL A SEATING PLANE A B C L H L2 GAUGE PLANE DETAIL A ROTATED 90 CW/C0053 e BOTTOM VIEW Z BOTTOM VIEW SIDE VIEW TOP VIEW ALTERNATE CONSTRUCTIONS NOTE 7 Z *This information is generic. Please refer to device data sheet for actual part marking. Pb−Free indicator, “G” or microdot “/C0071”, may or may not be present. Some products may not follow the Generic Marking. MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS 98AON10527DDOCUMENT NUMBER: DESCRIPTION: Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1DPAK (SINGLE GAUGE) onsemi and are trademarks of Semiconductor Components Industries, LLC dba onsemi or its subsidiaries in the United States and/or other countries. onsemi reserves the right to make changes without further notice to any products herein. onsemi makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. onsemi does not convey any license under its patent rights nor the rights of others. © Semiconductor Components Industries, LLC, 2018 www.onsemi.com

onsemi, , and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. onsemi reserves the right to make changes at any time to any products or information herein, without notice. The information herein is provided “as−is” and onsemi makes no warranty, representation or guarantee regarding the accuracy of the information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license under any of its intellectual property rights nor the rights of others. onsemi products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use onsemi products for any such unintended or unauthorized application, Buyer shall indemnify and hold onsemi and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that onsemi was negligent regarding the design or manufacture of the part. onsemi is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION TECHNICAL SUPPORT North American Technical Support: Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910 LITERATURE FULFILLMENT: Email Requests to: orderlit@onsemi.com onsemi Website: www.onsemi.com Europe, Middle East and Africa Technical Support: Phone: 00421 33 790 2910 For additional information, please contact your local Sales Representative