SBR5L60HT FUTUREWAFER | Alldatasheet

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  • PDF pages: 9

Technical content

Document No.: F21825Q 05-NOV-2021 V 2.0 www.futurewafer.com.tw FQE-001-04 1. Synopsis 1-1. Feature List

  • Trench MOS Schottky Technology
  • Low Forward Voltage Drop
  • 60-Volts Reverse
  • High Frequency Operation
  • Meets AEC-Q101 Qualified 1-2. Applications
  • Switch Mode Power Supply
  • Power Factor Correction
  • Solar Inverter
  • Uninterruptible Power Supply
  • High Efficiency DC/DC Converters
  • Motor Drivers 1-3. Benefits
  • Essentially No Switching Losses
  • Low Power Losses, Higher Efficiency
  • Reduction Of Heat Sink Requirements
  • Parallel Devices Without Thermal Runaway
  • Higher System Reliability Due To Lower Operating Temperatures 1-4. Mechanical Characteristics
  • Molded JEDEC TO-277B Package:
  • Packing: Tape and Reel
  • Flammability rating UL 94V-0
  • Halogen Free
  • JEDEC MSL Classification: Level 1 TO-277B

Document No.: F21825Q 05-NOV-2021 V 2.0 www.futurewafer.com.tw FQE-001-04 2. Contents

Document No.: F21825Q 05-NOV-2021 V 2.0 www.futurewafer.com.tw FQE-001-04 3. Electrical Property 3-1. Absolute Maximum Ratings 3-2. Electrical Characteristics 3-3. Thermal Characteristics

Document No.: F21825Q 05-NOV-2021 V 2.0 www.futurewafer.com.tw FQE-001-04 3-4. Ratings and Characteristics Curve Fig 1. Maximum Forward Current Derating Curve TM - Mount Temperature (°C) Average Forward Rectified Current (A) TM measured at cathode terminal mount typical values Fig 2. Typical Instantaneous Forward Characteristics Instantaneous Forward Current (A) Instantaneous Forward Voltage, VF (V) TJ=25°C TJ=100°C TJ=125°C Reverse Voltage, VR (V) Instantaneous Reverse Current (mA) Fig 3. Typical Reverse Current Characteristics TJ=25°C TJ=100°C TJ=125°C Fig 4. Typical Junction Capacitance Junction Capacitance (pF) TJ = 25 °C f = 1.0 MHz Vsig = 50 mVp-p Reverse Voltage, VR (V) Fig 5. Maximum Non-repetitive Forward Surge Current Number of Cycles at 60HZ Peak Forward Surge Current (A)

Document No.: F21825Q 05-NOV-2021 V 2.0 www.futurewafer.com.tw FQE-001-04 4. Soldering Parameters

Document No.: F21825Q 05-NOV-2021 V 2.0 www.futurewafer.com.tw FQE-001-04 5. Package Information 5-1. Dimension 5-2. PCB Pad Layout Recommendation Unit:mm Unit:mm

Document No.: F21825Q 05-NOV-2021 V 2.0 www.futurewafer.com.tw FQE-001-04 6. Packing 6-1. Taping and Reel Specification 6-2. Embossed Carrier Tape Specification Direction Of Feed

Document No.: F21825Q 05-NOV-2021 V 2.0 www.futurewafer.com.tw FQE-001-04 6-3. Surface Mount Reel Specification 6-4. Tape Leader and Trailer Specification Unit:mm

Document No.: F21825Q 05-NOV-2021 V 2.0 www.futurewafer.com.tw FQE-001-04 7. Ordering Information 8. Version 8-1. History 8-2. Company Profile Futurewafer Tech Co., Ltd. 台灣未來芯科技股份有限公司 TEL: +886-3-3350161 / FAX: +886-3-3350172 cherry@futurewafer.com.tw No. 286-11F, Sec. 3, Sanmin Rd., Taoyuan Dist., Taoyuan City 330, Taiwan